Effective thermal management is pivotal for reliable, high-performance microLED operation at the extreme current densities required for next-generation displays and lighting. Recent breakthroughs in engineered substrate materials, thermally optimized device architectures, and advanced packaging solutions aim to beat the heat in microLEDs.
One of the key challenges still is the ability to dissipate the substantial heat fluxes generated, especially for ultra-small footprint microLEDs targeted at super-high pixel density displays.
But what are the latest technologies keeping microLEDs cool under pressure?
Here, we explore some of the most promising thermal management trends enabling the microLED revolution in high-brightness displays and solid-state lighting.
Innovations in substrate materials and designs that can rapidly conduct heat laterally over larger surface areas before vertical dissipation include:
With exceptional bulk and interface thermal conductivity, diamond substrates can minimize temperature rises in high-power density microLEDs. Chemical vapor deposited diamond platforms provide ultra-high heat spreading.
Atomically thin graphene sheets grown by chemical vapor deposition demonstrate very high in-plane thermal conductivity while remaining optically transparent. This enables lateral heat conduction across device surfaces.
Reinforcing polymer matrixes with fillers like boron nitride or graphite nanoparticles creates composite substrates with thermal conductivities superior to metals. These polymer composites offer tunable thermal dissipation.
Structural designs conducting heat away from the thermally sensitive p-n junction:
Monolithic integration of tiny heat pipes or sealed microchannels with circulating coolant fluids provides active junction cooling to minimize temperature rises.
Fabricating narrow, tall LED pillars increases junction surface area, reducing thermal resistance. This drops heat flux density for a given power density.
Periodic photonic crystal resonant cavity patterns etched around microLEDs laterally diffuse heat over larger areas while enhancing light extraction efficiency.
Innovative packaging techniques for effective heat removal include:
Encapsulants with high latent heats absorb and dampen transient thermal spikes during high brightness operation, improving mean time to failure.
High-density arrays of micromachined pin fins precisely tuned to match underlying heat patterns maximize thermal contact and heat transfer rate.
Large-area graphene sheets bonded to device backsides provide lateral heat spreading while also functioning as a structural substrate.
With thermal management innovations paving the way, microLED development is primed to stay cool while transforming high-resolution displays, next-generation visible light communications, and ultra-efficient lighting.