Microfluidic Cooling Systems for Processor Thermal Management

Electronic device and airflow generating package for improved heat dissipation. The device has a component that generates heat, a heat conductive component to transfer the heat, and an airflow generating package on the device edge. The package contains a film structure that oscillates at ultrasonic rates to generate airflow. This airflow flows through the heat conductive component to dissipate the heat. The oscillating film creates controlled vent openings to direct the airflow. This active airflow improves heat dissipation compared to passive convection.

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Component cooling system for high-performance computing devices that provides improved cooling efficiency compared to traditional cooling methods. The system uses multiple heat pipes, spring mechanisms, and thermoelectric coolers to split and remove heat from components. The spring mechanisms rigidly attach heat transfer elements to the cooling manifold, maintaining contact during assembly and use. This ensures consistent thermal conductivity and prevents displacement. The multiple fluid flow paths and thermoelectric coolers facilitate better heat removal from components.

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Detachable chip-level liquid cooling for high power electronics to improve heat dissipation capability and reliability compared to traditional heat sinks. The chip has microchannels etched on its surface. A detachable cover plate with inlet and outlet connects over the channels. This allows ultra-high heat dissipation while enabling separate maintenance and reuse of the chip and cover. The detachable design improves reliability and reduces costs compared to integrated solutions where a blocked channel renders the whole chip unusable.

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A thermal management system for high power computing devices like servers that uses arrays of microelectromechanical system (MEMS) jets to cool the devices more effectively than traditional fans or liquid cooling. The system has a heat sink with fins in contact with the hot components. MEMS jets are mounted on the fins and vibrated at resonance to create high-speed impinging fluid flow. This provides higher cooling capacity in a compact size compared to fans. The MEMS jets can be driven with feedback control to optimize cooling performance.

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A compact and efficient chip cooling system using micro-nano structures inside the cooling channels. The system has a closed loop cooling pipeline with turbulent flow enhancers inside the channels. A unidirectional pump outside the loop circulates the cooling fluid. The turbulent flow enhancers are micro-nano protrusions on the channel walls that disrupt laminar flow, enhance convection, reduce contact angles, and improve heat exchange. The system provides compact, high utilization, large heat dissipation area, and efficient cooling compared to conventional channels.

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A microfluidic cooling device for integrated circuits that enables on-demand thermal management through a customizable template structure and high-throughput additive manufacturing (HTAM) process. The device comprises microfluidic channels defined by a template structure and supplemented by a deposited material, allowing for optimized microchannel dimensions and shapes tailored to specific IC thermal management requirements. The HTAM process enables rapid production of customized microfluidic thermal solutions with precise control over microchannel routing and fluid flow characteristics.

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A multilayer cooling structure for electronic assemblies, comprising a heat absorption plane with cooling troughs, a heat dissipation plane, a supply plane, and connecting channels. The structure enables uniform cooling over large areas through a novel arrangement of heat transfer surfaces and channels, fabricated using additive manufacturing techniques.

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Electronic packages with inductors that utilize fluidic channels for cooling, where the inductor's magnetic core and conductive windings are integrated with a fluid path that passes through the core and windings to dissipate heat generated by the inductor's operation.

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A thermal management system for electronic devices that uses a movable fluid movement structure to enhance heat transfer between the device and a working fluid. The structure is positioned on a surface of a thermal management device and moved relative to the device and/or other structures to direct fluid flow and increase thermal transfer rates. The system can be integrated into immersion cooling systems with condensers for efficient heat removal.

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A direct silicon microfluidic cooling system for electronic components, comprising a cooling block with micro-pin fins, a manifold with inlet and outlet ports, a thermal interface material layer, and an electronic component. The cooling block matches the surface area of the electronic component, with micro-pin fins on one side and the thermal interface material layer on the other. The manifold supports fluid flow through the micro-pin fins to remove heat from the electronic component.

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A liquid cooling module for electronic devices, particularly foldable mobile phones and wearables, that integrates a pump and cooling module into a single, flexible unit. The pump features a piezoelectric component that drives fluid flow through a sealed cavity, eliminating the need for separate inlet and outlet valves. The cooling module includes a flexible membrane that seals the pump to the device's casing, eliminating the need for additional sealing interfaces. The design enables reliable, high-performance cooling in compact, flexible devices.

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Cooling specific circuits in a photonic integrated circuit to low temperatures like cryogenic levels, instead of globally cooling the entire circuit, to improve performance of superconducting nanowire single photon detectors (SNSPDs) without cooling the entire circuit. Micro-channels are etched adjacent to the SNSPDs to locally conduct cryogenic fluids like liquid helium directly above the SNSPDs for targeted cooling. This reduces the thermal resistance and improves heat flow compared to global cooling, allowing lower power consumption for SNSPD cryogenic operation.

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A liquid-cooled heat sink for electronic components that combines microchannel and jet impingement cooling. The heat sink features a fractal inlet manifold that distributes coolant uniformly to multiple microjets, which impinge on a heat exchange plate. The design enables efficient cooling of high-power electronic components while minimizing pressure drop and thermal resistance. The heat sink is fabricated using additive manufacturing techniques, such as stereolithography, to create complex geometries with high accuracy.

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A microfluidic thermal management system for electronic components that uses selectively actuated valves and/or pumping membranes to flow cool working fluid across hot spots and effectively manage heat generated by the components. The system includes a microfluidic volume with thermal elements, inlet and outlet ports, and valves that can be controlled to direct working fluid flow based on thermal management demands of the component. The system can be electrically connected to a controller or power source that measures thermal demands and determines optimal working fluid flow rates and paths to maintain component temperature within a safe operating range.

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Driven by the demands of the intelligent industry, the thermal management of high power chips is causing huge concern. In the last several decades, microfluidic cooling has demonstrated great potential in device cooling applications. This paper presents a monolithically integrated manifold microchannel cold plate that can become a general embedded cooling method for most chips. The test samples are fabricated by the MEMS process and test. The experimental result shows that the cold plate can remove more than 500W/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> heat with a thermal resistance below 0.25 Kcm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /W and the global average convective heat transfer coefficient was approximately 43300 W/m <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> K. This approach is important for solving thermal management challenges in electronic devices.

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Results of a review of the cooling needs for high performance computing (HPC) processors using advanced packaging indicates benefits of implementing direct cooling through silicon microchannels. Progress in fabrication of silicon microchannels, both in microcooler/cold plate and in direct cooling of the die is assessed. Challenges in transferring silicon microchannels into HPC packaging are summarized, and steps towards commercialization are presented.

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A cooling system for electronic components that employs multiple parallel heat transfer paths between a primary heat sink and a secondary heat sink, with each path providing a separate conduction path for heat removal. The system includes a manifold that distributes a heat transfer fluid between the primary and secondary heat sinks, allowing for efficient heat transfer and improved cooling performance.

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A fluid cooling system for integrated circuits that employs multiple flow paths through multiple heat transfer elements to achieve higher heat dissipation efficiency. The system includes a manifold that splits a single fluid flow into multiple paths, each of which can be controlled independently to target specific heat dissipation needs. The manifold then merges the paths after heat transfer, enabling optimized cooling of high-power components.

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A component cooler for computing devices that utilizes multiple heat pipes to split a heat load generated by a component, such as a processor, by providing multiple conduction paths between multiple heat transfer surfaces to facilitate heat removal from the component. The cooler includes multiple fluid flow paths across multiple surfaces to facilitate heat removal from the component, and can utilize one or more thermoelectric coolers (TECs) in contact with one or more heat transfer surfaces to provide sub-ambient cooling to the heat transfer surfaces to facilitate heat removal from the component.

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A component cooler for computing devices that enables adaptive cooling by providing an identity of the cooler to the processor and configuring operating parameters based on the cooler's capabilities. The cooler employs multiple heat pipes, fluid flow paths, and thermoelectric coolers to manage heat removal, and communicates its characteristics to the processor to optimize performance.

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Component cooling system for high performance computing devices like processors that split the heat load generated by a component into multiple conduction paths between multiple heat transfer elements to facilitate heat removal. The system uses multiple heat pipes and thermoelectric coolers to provide sub-ambient cooling to the component. The component cooler has separate heat conduction paths from the component to multiple heat transfer elements instead of just one. This allows spreading and dissipating the heat more effectively to improve cooling performance.

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A system for sub-cooling electronic components in computing devices, comprising a thermoelectric cooling device (TEC) thermally coupled to a heat dissipation device, positioned at the front of the device chassis, and a fan directing airflow through the TEC to cool the airflow to a sub-ambient temperature before it reaches the components.

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A semiconductor package with enhanced thermal management, comprising a wiring structure, a semiconductor chip, internal terminals, a high thermal conductivity layer, and an encapsulator. The high thermal conductivity layer is positioned between the wiring structure and the semiconductor chip, extending onto scribe lanes, and directly contacts the semiconductor chip's side surface. The layer's maximum contact height exceeds half the chip's thickness, enabling efficient heat dissipation from both the wiring structure and the semiconductor chip.

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A mobile device cooling system that uses vibrational motion to drive a fluid towards heat-generating components, achieving a coefficient of thermal spreading (CTS) greater than 0.5 for devices with total steady-state power of at least 5 watts. The system comprises active cooling cells with cooling elements that undergo vibrational motion to drive the fluid, which is sealed within the device housing and circulates through a fluid path past heat-generating components before exiting through vents.

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A three-dimensional chip with integrated heat transfer means to manage thermal dissipation in stacked integrated circuits. The chip comprises alternating layers of integrated circuitry and microfluidic channels that can be bonded together to form a compact, high-performance device.

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An efficient cooling system is necessary for the reliability and safety of the modern microchips for longer life. As microchips become smaller and more powerful, the heat flux generated by these chips per unit area also rises sharply. Traditional cooling techniques are inadequate to meet the recent cooling requirements of microchips. To meet the current cooling demand of Microelectromechanical devices (MEMS) devices and microchips, microchannel heat sinks (MCHS) technology is the latest invention that can dissipate a significant amount of heat because of its high surface area to volume ratio. This study provides a concise summary of design, material selection, and performance parameters of MCHS that are developed over the last few decades. The limitations and challenges associated with different techniques employed by researchers over time to enhance the thermal efficiency of microchannel heat sinks are discussed. The effects on the thermal enhancement factor, Nusselt number, and pressure drop at different Reynold numbers, in passive techniques (flow obstruction) i.e. ribs, grooves, ... Read More

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A computing system with improved current path resistance and reduced power loss, comprising a printed circuit board with a processor on the top and a voltage regulator on the bottom, a heat pipe connecting the voltage regulator to a heat sink on the top, and a heat spreader layer embedding the heat pipe's evaporator end. The system enables placement of the voltage regulator below the processor while maintaining effective cooling, thereby improving system efficiency and reducing thermal resistance.

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A vibrating fluid pump for cooling electronics without using fans. The pump has an orifice plate with holes, a vibrating fan element near the plate, and channels. The fan vibrates to force fluid through the orifices, creating a low pressure region. Fluid is then drawn through the channels by this pressure difference. The fan vibration is controlled based on feedback to optimize flow. This allows compact, fanless cooling for electronics like smartphones and laptops by leveraging vibration-driven fluid motion.

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A cooling system for computing devices that uses piezoelectric elements to generate vibrational motion and drive fluid flow for heat transfer. The system comprises multiple cooling cells, each containing a piezoelectric element that is actuated to induce resonant vibration, and a switching and control module that provides drive signals to the elements based on their resonant frequencies. The system can be used in both open and closed devices, and can be powered by the piezoelectric elements themselves during the relaxation phase of their vibration.

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A semiconductor package liquid cooling system that integrates a microchannel structure directly bonded to the chip to dissipate heat generated during operation. The microchannel structure includes a manifold and multiple microchannels that can be independently controlled to match varying heat densities across the chip. The system enables efficient cooling of high-power density regions while minimizing leakage and stress.

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A system-on-chip (SoC) based cooling system that enables flexible and efficient cooling of advanced chips. The system comprises a base unit, a fluid management core, a sealing layer, and a top unit, with the fluid management core featuring microchannel structures and fluid channels to distribute cooling fluid to the chip. The system allows for customization of the cooling plate design to accommodate different chip sizes and types, while maintaining high compatibility and reliability.

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A cooling system for electronic devices that uses a vibrating heat exchanger to drive fluid flow through orifices to dissipate heat. The heat exchanger is thermally coupled to the device's heat source via a support structure, and its vibration frequency is optimized to match structural and acoustic resonances in the system. The system can be integrated with a heat spreader to enhance cooling performance.

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Stacked plate heat exchanger for cooling semiconductor devices, comprising a core with alternating flow paths and limiting portions that restrict fluid circulation, wherein the limiting portions are positioned between adjacent flow paths and feature alternating open and blocked sections to prevent fluid bypass.

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Modular fluid heat exchange systems for electronics cooling applications, comprising separate, matingly engageable units that permit component heat exchange modules to be reconfigured with different pumps and cold plates independently of each other. The system includes a fluid receiver unit with a pump, a fluid transfer unit with a distribution manifold, and a cold plate with microchannels, all of which can be detached and reattached as needed to accommodate changing cooling requirements.

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Microscale heat transfer devices and arrays with directed fluid flow for thermal management of semiconductors and other devices. The devices comprise microjet structures that direct fluid onto a primary heat exchange region, with post-jetting flow paths to direct the fluid to outlets. The devices can be fabricated using multi-layer electrochemical fabrication methods and can be integrated into cold plates with inlet and outlet interfaces. The devices provide enhanced cooling and heat dissipation capabilities, particularly for high-performance electronic devices.

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The creation of effective cooling solutions has been required to address thermal difficulties as a result of the ongoing miniaturisation and rising power densities of electronic devices.The development and optimisation of microscale cooling devices specifically created for electronics cooling applications are the focus of the extensive investigation presented in this paper.This study's main goal is to investigate how microscale cooling technologies might improve heat dissipation efficiency in order to meet growing thermal management demands.Device design, fabrication, and optimisation were the three key processes that made up the methodical technique used to accomplish this.In order to maximise heat transfer, suitable materials with high thermal conductivity and low thermal resistance have to be chosen and integrated during the device design phase.Different design options, such as microchannels, microfins, and microjets, were taken into consideration to improve convective heat transmission and boost the devices' capacity for heat dissipation.Advanced simulation methods were also used... Read More

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An integrated circuit (IC) package assembly with enhanced thermal management, comprising an IC die with a temperature control element integrated into the die's surface, and a manifold encasing the die to create a plenum for fluid-based heat dissipation. The temperature control element features a plurality of thermal dissipating elements that efficiently manage heat generated by the IC die's active components.

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Microelectronic device with integrated heat management through direct bonding. The device comprises a first semiconductor element; a second semiconductor element disposed on the first semiconductor element; and a fluidic cooling unit directly bonded to the first semiconductor element without an intervening adhesive, the fluidic cooling unit comprising a cavity structure to contain a fluid, the fluidic cooling unit comprising a thermal pathway to transfer heat away from the first semiconductor element.

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For embedded microfluidics cooling, the morphology of the microfluidics structure and the liquid injection mode have a great impact on the cooling performance. Manifold structure can adjust the flow direction of the coolant before heat convection, reducing pumping power and improving cooling efficiency of embedded cooling. In this work, four manifold structures for embedded cooling are designed and fabricated, the cooling performance and hydraulic performance of different structures is compared through experimental investigations. The results show that compared with the horizontal cooling, the manifold structure based on vertical cooling not only reduces the temperature by 20.8%, but also reduces the pressure loss by 43.5%.

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A cooling plate for electronic devices that enhances reliability through redundant cooling loops and multi-phase cooling. The plate features multiple circulation loops and/or multi-phase cooling cells, with a multiple-path liquid delivery system that enables implementation in standard installations with single supply and return lines. The plate includes fluid ports with multiple orifices that couple to separate cooling loops, and can be implemented for various electronic devices such as single-chip modules, system-on-chip devices, and multi-chip modules.

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Semiconductor packaging with impingement cooling to efficiently dissipate heat from electronic components like high speed dies. The packaging uses a device substrate with the component mounted on one surface, and a cooling substrate with vias that connect to a nozzle for impingement cooling. Coolant flows through the vias into a cavity between the substrates, impinges on the device substrate, and exits. The similar thermal expansion of the substrates prevents warping. This compact cooling approach allows high power/speed components without large footprint or complex systems.

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A thermal management plate for critical processors that combines single-phase and two-phase cooling in a single module. The module includes a bottom plate with microchannel structures for single-phase cooling and a top plate with phase-change structures for enhanced cooling. The plates are thermally coupled and can operate independently or together to manage heat from high-power processors. The module can be integrated with a liquid manifold and frame to provide a complete cooling solution.

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Linear cooling of continuous microfluidic is crucial to the microfluidic analysis of cell cryopreservation and homogenous ice nucleation. This study presents a method to establish a linear temperature gradient for linear cooling of continuous microfluidic based on a single thermoelectric cooler. A novel multi-structure thermoelectric cooler was proposed to generate a stable linear temperature gradient. Furthermore, a numerical model was established to explore the performance of linear cooling of continuous microfluidic. Meanwhile, experiments were carried out to validate the model. Based on the proposed multi-structure thermoelectric cooler, linear cooling of continuous microfluidic can be successfully achieved, even if the current of the thermoelectric cooler or microfluidic velocity changes. For the case of current equal to 3 A and microfluidic velocity equal to 50 mm/s, microfluidic can be linearly cooled from 297 K to 251 K with a cooling rate of 64.5 K/s and linearity of 0.9912. It was also found that the temperature gradient decreases slightly with increasing microfluidic veloc... Read More

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Electronic packages with integrated cooling channels in the substrate enable thermal management from below the die, complementing traditional top-side cooling. The substrate features recessed channels that can be sealed with a die attach film, allowing a coolant to flow through the substrate and enhance heat dissipation in high-power architectures.

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An integrated circuit (IC) package with a microchannel-based cooling system that enables precise temperature control. The system comprises microchannels within the IC package encapsulation material, flow valves, a pump, and temperature sensors. Valve control logic receives temperature signals from the sensors and adjusts the flow valves to maintain a desired temperature level, allowing for efficient heat extraction and enabling the use of high-power ICs.

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Cooling system for heterogeneous computing architectures that accommodates diverse thermal requirements of different hardware modules through a modular heat transfer plate (HTP) design. The system features a base stiffener, top stiffener with a mounting channel, and a cooling device mounted on top. Multiple HTPs can be inserted into the mounting channel to transfer heat from various hardware modules, including CPUs, GPUs, VRs, and HBM, to the cooling device. The HTPs are protected by elastic structures and can be easily replaced or added as the system configuration changes.

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Cooling techniques for electronic equipment that minimizes the need for mechanical cooling. The techniques include having a cooling device for mounting on a heat-generating component, a cooling arrangement including the cooling device, a cooling system including the cooling device, and a method of use of the cooling device.

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Abstract In this work, a two-channel, water-based cooling system was integrated into a polydimethylsiloxane (PDMS)-glass microfluidic device for application in single-cell biological studies. This system is designed to cool living cells to single-digit temperatures in situ , without requiring any features of the electron-beam fabricated master mould to be changed, and without interfering either biologically or optically with the cells themselves. The temperature profile inside the device was mapped using multiple thermocouples mounted inside the device, over time. A parametric study including coolant flow rate, distance between the cooling channel and the fluidic channel, and number of active cooling channels was performed to evaluate the performance of the system. By using ice water as the coolant, we have demonstrated stable on-chip cooling reaching an average temperature of 4.9 C when operated at a coolant flow rate of 23 ml min 1 and using two active cooling channels, positioned only 400 m away from the cell trapping sites. The maximum observed temperature deviation during an... Read More

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A liquid cooling system for electronic devices that improves cooling performance when the thermoelectric cooler (TEC) is deactivated. The system includes a dual-block cooler configuration, where a bottom thermal block is positioned between the TEC and CPU, and a top thermal block is positioned between the TEC and the bottom block. When the TEC is off, cooling liquid is pumped through the bottom block, which is closer to the CPU and can more effectively absorb heat. This enables higher CPU powers without activating the TEC, resulting in power savings and improved performance.

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A thermal heat spreader plate for electronic devices that combines active and passive cooling technologies to manage heat generated by chip package assemblies. The plate features an active cooling device on one surface and a passive cooling device on the opposing surface, allowing for both forced fluid circulation and natural convection to dissipate heat. This dual-cooling approach enables improved thermal management in high-density electronic systems where conventional cooling methods are insufficient.

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