Advanced Grip Systems for Skateboard Decks

Micro-LED display device with improved electrode design for better electrical connection and reliability. The display has pixels with multiple transistors, electrodes, and micro-LEDs. The micro-LEDs have a first electrode connected to the pixel electrode and a second electrode exposed. A common electrode connects to the second electrodes of all micro-LEDs and contact electrodes of the pixels. This allows direct electrical connection of the common electrode to the micro-LED electrodes without interposing wiring. Metal wiring connects the contact electrodes. The common electrode and wiring are between insulating layers above the transistors.

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Compact, high-performance optoelectronic component for integrating LEDs and control electronics in a single package. The component has an optoelectronic chip mounted in a recess with a tilted side wall. The chip's electrical contacts connect to pads on a control chip using conductive paths applied to the side wall. This allows the LED and control electronics to be stacked in a compact housing without needing separate leads. The tilted wall guides the conductors directly over the chips without adding height. The housing can also have cutouts with tilted sides for connecting the LED chip's pads to an external leadframe.

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Electronic device and display panel design to reduce vertical bright lines and shaking in displays. It achieves this by arranging the subpixels and connecting the electrodes in a specific way. The subpixels have electrodes connected to a single signal line. The first and second electrodes of adjacent subpixels are on one side of the line, while the third and fourth electrodes are on the other side. This alternating layout helps distribute brightness evenly when scanning the lines.

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A backplane design for microLED displays with improved yield by protecting the connecting terminals from oxidation and corrosion. The backplane has the connecting terminals located inside via holes on the flexible substrate instead of exposed on the surface. This prevents environmental degradation and improves reliability. The terminals have portions between the substrate and passivation layer, and inside the via. This allows electrical connection through the via hole to the substrate signal traces. It enables using any material for the terminals, not just ones that can withstand wet etching. The protected terminals improve yield compared to exposed terminals prone to oxidation and corrosion.

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An allGaNbased monolithic activematrix microLED system that integrates metalinsulatorsemiconductor highelectronmobility transistors (MIS HEMTs) with lightemitting diodes (LEDs) is demonstrated. The proposed structure employs direct electron injection from the 2D gas (2DEG) in a HEMT, serving as ntype layer, into quantum wells of LEDs. A 2HEMT1LED pixel configuration fabricated one epitaxial growth, enabling precise control LED light output through combination select and drive HEMTs. achieved maximum optical density 0.5 Wcm 2 . 2 matrix constructed row column lines connected via HEMTs, demonstrating capability for individual control.

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Integrating micro LEDs with digital and analog circuitry in a stacked configuration to enable compact, power-efficient display systems. The technique involves reconstituting a semiconductor wafer with a layer containing the micro LEDs after forming the driver circuitry on a separate wafer. This allows integrating the micro LED arrays with the digital and analog circuits in a common wafer. The process involves singulating and bonding micro LED wafers to a driver wafer, then removing the substrate and forming vertical connections through the stack. It eliminates the need for wafer size mismatch and waste compared to bonding larger wafers.

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Stage circuit for driving pixels in display devices that reduces glitches and improves power efficiency. The stage circuit has an output stage, a first driver, and a second driver. The output stage provides enable and carry signals. The first driver controls node voltages based on previous enable and clock. The second driver controls node voltage based on previous carry, clock, and enable. The second driver uses a capacitor and transistor in series, where the transistor is turned off for carry=1 to float the capacitor. This reduces glitches compared to directly connecting nodes.

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Display device with reduced signal distortion in high resolution displays. The display has a curved sub-region protruding from one side of the display area. The display drivers connect directly to demux circuits in this curved region, while the other demux circuits connect to the drivers via longer transmission lines. A compensation capacitor is placed between the power line and the data line in the curved region to compensate for the longer transmission path. This reduces distortion of the data signal compared to using the same transmission lines throughout.

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Digital control is an important topic for III-nitride LEDs. In this work, a p-channel MOSFET monolithically integrated with micro-LED by utilizing the same p-type GaN layer of commercial blue LED wafer. The device demonstrates controllable electroluminescence varying its gate-to-source and drain-to-source voltage. As device, p-MOSFET distance 16 m shows maximum current -1.4 mA/mm, transconductance 123 S/mm, on-off ratio 3.5 105. diameter 20 uniform light emission, 3.3 V forward voltage at A/cm2, low reverse leakage 4 10-11 A -5 V. This simple, easy, cheap monolithic integration scheme enables another step digital micro-LEDs CMOS circuitry in near future, benefiting various applications such as microdisplay, visible communications, bio-sensing.

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Light emitting device and display panel with improved uniformity and reliability by reducing center of light emission variation between pixels. The display has a substrate with multiple light emitting devices attached. By carefully balancing current through each pixel, it prevents variations in luminance and center of light emission between pixels. This ensures consistent brightness and positioning of the light emission center point across the display, reducing issues like color shift and dead pixels caused by uneven current distribution.

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Display device with improved power efficiency and grayscale accuracy in multi-emission displays with multiple thin-film transistors (TFTs) in the light emission path. The display has an emission circuit that emits light based on a node voltage. A first control circuit charges the node based on a sweep signal and emission signal. A second control circuit discharges the node using the sweep signal and emission signal. This allows maintaining high efficiency and accurate grayscale by controlling the node voltage rather than relying solely on TFT saturation.

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Display panel with improved charge time for pixels to address the issue of insufficient pixel charging due to short charge times. The panel has two scan lines per row instead of one, allowing independent control of charge times for adjacent pixels. This involves connecting the first pixel to the first scan line and the second pixel to the second scan line. This allows flexibly controlling the time to write the first data signal to the first pixel and the second data signal to the second pixel. By adding a new scan line, the charge times can be independently controlled, which can be adjusted to increase the charge times of the pixels. This helps prevent insufficient charging due to short charge times.

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A skateboard grip surface with projections and voids that improve traction and prevent slips. The voids between the projections provide grip without the need for external tapes or materials. The projections can have pyramid or trapezoidal shapes. The surface can be created by cutting the deck with a CNC router bit that has a rounded tip.

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A skateboard and other support surfaces have a unique gripping surface with raised projections and voids between them. The projections are formed by cutting the surface with a router. The projections allow improved grip without needing grip tape. The gripping surface is formed on skateboard decks, balance boards, scooter decks, stair treads, and other support surfaces.

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Recreational sports boards like skateboards with improved grip surfaces that provide better traction without the need for separate grip tape. The boards have engraved patterns on the top surface that create recessed areas with varying depths. These recessed sections provide a textured grip that increases friction compared to the smooth surface. The depth variation allows customization of grip in different areas. The engraving process involves stenciling and sandblasting to create the pattern. The recessed sections engage the rider's feet for better traction compared to flat surfaces.

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Skateboard with a curved section near the rear end of the deck that matches the shape of the arch of the human foot. This curved section called the arch contact section, provides a better fit and contact area for the rear foot on the skateboard. It allows the rider to securely grip the board and have more control over steering and maneuvers compared to a flat deck. The curved section is raised above the deck surface.

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