Paint Curing in Cold Weather
Paint curing in cold environments presents significant technical hurdles, with cure times extending beyond 24 hours when temperatures drop below 10°C (50°F). Traditional solvent-based and water-based coatings struggle to achieve proper film formation and cross-linking, leading to incomplete curing, reduced durability, and surface defects that can compromise the coating's protective properties.
The fundamental challenge lies in achieving complete polymerization and cross-linking reactions at low temperatures while maintaining the coating's essential performance characteristics.
This page brings together solutions from recent research—including dual-curing systems combining UV and thermal activation, specialized photoinitiator formulations for low-temperature environments, and novel epoxy-thiol technologies that enable consistent curing at reduced temperatures. These and other approaches focus on practical implementation in industrial settings where maintaining optimal curing conditions may not be feasible.
1. UV-Infrared Dual-Curing Varnish Coating with Trifunctional Aliphatic Polyurethane Acrylate Oligomers
GUANGDONG SIFANG VICTORY NEW MAT CO LTD, 2023
Low-temperature curing UV-infrared dual-curing varnish coating for automotive applications that addresses traditional dual-curing challenges while maintaining superior performance. The coating combines the benefits of UV and infrared curing through a proprietary dual-curing process that enables low-temperature curing while maintaining excellent wear resistance and weather resistance. The formulation comprises a trifunctional aliphatic polyurethane acrylate oligomer, a high hydroxyl value polyurethane acrylate oligomer, and an acrylate oligomer containing primary hydroxyl groups.
2. Cationically Curable Resin Composition with Hydrogenated Epoxy Resin, Cationically Polymerizable Component, and Thermal Initiator
THREEBOND CO LTD, 2019
Cationically curable resin composition with enhanced storage stability and low-temperature curing capabilities. The composition comprises a hydrogenated epoxy resin, a cationically polymerizable component, and a thermal initiator. The epoxy resin provides excellent adhesion and sealing properties, while the cationic polymerizable component enables photocuring at room temperature. The thermal initiator enables low-temperature curing without the need for heat application. This composition combines the benefits of cationic polymerization with the advantages of photo-curing and low-temperature curing, making it suitable for applications requiring these properties.
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