Developing Recyclable Adhesives for F&B Packaging

Additive for adhesives and temperature-sensitive adhesive compositions that enhances adhesion while maintaining elasticity. The additive, specifically a N-substituted maleimide compound, improves adhesive performance by creating a thermally stable cross-linking network that maintains polymer chain mobility at elevated temperatures. This enables both high fixation strength and improved peelability in temperature-sensitive adhesives, particularly in applications where thermal stability is critical.

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A hot-melt adhesive composition that enables rapid crosslinking through controlled thermal processing, while maintaining high adhesive strength. The composition comprises a modified polyolefin resin with an acid functional group, a thermally melting phenol resin, and an epoxy crosslinking agent. The acid functional group enables the crosslinking agent to form strong bonds with the modified polyolefin resin, while the thermally melting phenol resin facilitates rapid thermal curing. The composition achieves high adhesive strength through controlled thermal processing, making it suitable for applications requiring rapid bonding.

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A low-temperature responsive acrylate copolymer for adhesive applications that enables temperature-controlled bonding without requiring high-temperature curing. The copolymer exhibits a temperature-dependent glass transition temperature (Tg) that remains below 60°C even at low temperatures, while maintaining sufficient tack and peel strength at elevated temperatures. This enables continuous production processes where the adhesive must remain on the carrier plate during high-temperature bonding. The copolymer's unique properties enable precise temperature control during bonding while maintaining adhesion and optical clarity in the production environment.

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Hot melt adhesives with phase change materials that provide both thermal regulation and bonding strength. The adhesives incorporate phase change materials (PCMs) with melting temperatures between 5-80°C and latent heat capacities between 40-300 J/g, which absorb and release heat as the temperature changes. These materials enable temperature-dependent thermal regulation while maintaining bond strength, particularly in applications requiring thermal stability.

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Temperature-sensitive adhesive with enhanced heat resistance and peelability after thermal treatment. The adhesive contains a side chain crystalline polymer with a linear alkyl group having 16 or more carbons, combined with a tackifier containing styrene resin. The side chain crystalline polymer exhibits a temperature-dependent decrease in adhesive strength below its melting point, while the tackifier maintains its adhesive properties upon thermal treatment. This combination enables the adhesive to maintain its peelability even after high-temperature thermal degradation, while its heat resistance improves significantly.

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Temperature-sensitive adhesive for bonding and debonding at ambient temperatures, featuring a side-chain crystalline polymer with a melting point. The adhesive exhibits high temperature stability while maintaining room-temperature adhesion and debonding characteristics. The side-chain crystalline polymer ensures controlled thermal behavior, preventing premature adhesive failure during bonding and debonding operations. This design enables reliable, low-temperature bonding and peeling without the need for elevated temperatures or specialized equipment, while preventing the wailing phenomenon that can damage substrates during removal.

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