Developing Recyclable Adhesives for F&B Packaging

Additive for adhesives and temperature-sensitive adhesive compositions that enhances adhesion while maintaining elasticity. The additive, specifically a N-substituted maleimide compound, improves adhesive performance by creating a thermally stable cross-linking network that maintains polymer chain mobility at elevated temperatures. This enables both high fixation strength and improved peelability in temperature-sensitive adhesives, particularly in applications where thermal stability is critical.

Source

A hot-melt adhesive composition that enables rapid crosslinking through controlled thermal processing, while maintaining high adhesive strength. The composition comprises a modified polyolefin resin with an acid functional group, a thermally melting phenol resin, and an epoxy crosslinking agent. The acid functional group enables the crosslinking agent to form strong bonds with the modified polyolefin resin, while the thermally melting phenol resin facilitates rapid thermal curing. The composition achieves high adhesive strength through controlled thermal processing, making it suitable for applications requiring rapid bonding.

Source

A low-temperature responsive acrylate copolymer for adhesive applications that enables temperature-controlled bonding without requiring high-temperature curing. The copolymer exhibits a temperature-dependent glass transition temperature (Tg) that remains below 60°C even at low temperatures, while maintaining sufficient tack and peel strength at elevated temperatures. This enables continuous production processes where the adhesive must remain on the carrier plate during high-temperature bonding. The copolymer's unique properties enable precise temperature control during bonding while maintaining adhesion and optical clarity in the production environment.

Source

Phase change modified resin, pressure-sensitive adhesive, and their applications for electronic components, particularly for LCD displays, backlight modules, frames, and glass. The phase change modified resin contains a phase change material, softening point regulator, antioxidant, catalyst, coupling agent, and a phase change material. The pressure-sensitive adhesive comprises the phase change modified resin, cross-linking agent, solvent, and a pressure-sensitive adhesive component. The pressure-sensitive adhesive is particularly effective for electronic components requiring high reliability and durability, such as LCD displays and backlight modules, where traditional adhesives can be damaged during repair or replacement.

Source

Pressure-sensitive adhesive and adhesive sheet for low-temperature peeling, with improved adhesion and durability under thermal stress conditions. The adhesive comprises a polymer backbone with linear alkyl acrylate monomers, specifically a polymer with a molecular weight of 1-12 carbon atoms. The polymer backbone is modified with a tackifier to enhance adhesion, and the adhesive is formulated with a crosslinking agent that forms a thermally stable network with the polymer backbone. The adhesive formulation achieves superior peel strength at both high and low temperatures, while maintaining excellent chemical resistance and durability.

Source

Packaging film with an adhesive layer that automatically opens in response to microwave heating. The film comprises a thermoplastic elastomer, ethylene-vinyl acetate (EVA), and carnauba wax. The EVA content is between 100-300 parts by weight, while the carnauba wax content is between 0.2-3 parts by weight. When heated in a microwave oven, the film's adhesive layer undergoes a pressure-activated degradation, enabling controlled release of packaged contents.

Source

Hot melt adhesives with phase change materials that provide both thermal regulation and bonding strength. The adhesives incorporate phase change materials (PCMs) with melting temperatures between 5-80°C and latent heat capacities between 40-300 J/g, which absorb and release heat as the temperature changes. These materials enable temperature-dependent thermal regulation while maintaining bond strength, particularly in applications requiring thermal stability.

Source

Temperature-sensitive adhesive with enhanced heat resistance and peelability after thermal treatment. The adhesive contains a side chain crystalline polymer with a linear alkyl group having 16 or more carbons, combined with a tackifier containing styrene resin. The side chain crystalline polymer exhibits a temperature-dependent decrease in adhesive strength below its melting point, while the tackifier maintains its adhesive properties upon thermal treatment. This combination enables the adhesive to maintain its peelability even after high-temperature thermal degradation, while its heat resistance improves significantly.

Source

Hot melt adhesive compositions that exhibit superior bonding properties across a broad temperature range, particularly at low temperatures. The compositions feature a copolymer comprising a polypropylene polymer with a polydispersity index of no greater than 5, a polyethylene wax, and a free radical initiator. The copolymer's reaction product achieves a viscosity of no greater than 12,000 centipoise at 177 °C, with a polydispersity index no greater than 5, and exhibits excellent tackifying properties. The adhesive composition also includes a tackifying agent, which enables fast bonding at both low and high temperatures.

Source

Temperature-sensitive adhesive for bonding and debonding at ambient temperatures, featuring a side-chain crystalline polymer with a melting point. The adhesive exhibits high temperature stability while maintaining room-temperature adhesion and debonding characteristics. The side-chain crystalline polymer ensures controlled thermal behavior, preventing premature adhesive failure during bonding and debonding operations. This design enables reliable, low-temperature bonding and peeling without the need for elevated temperatures or specialized equipment, while preventing the wailing phenomenon that can damage substrates during removal.

Source

Hot-melt adhesives for bonding polyolefin films and composite materials, particularly for low-energy surfaces like polyethylene films. The adhesives feature a soft resin with a softening point between -10°C and 40°C, a polar-modified polyolefin wax, and a hardener. The combination provides excellent adhesion properties, including high immediate tackiness, long shelf life, and resistance to environmental degradation. These adhesives can be used to bond polyolefin films and composite materials in construction and hygiene applications.

Source

Temperature-sensitive adhesive for flexible substrates that maintains adhesion and dimensional stability across temperature ranges. The adhesive combines chemical resistance, heat resistance, and peelability to ensure reliable bonding in both ambient and elevated temperature environments. It achieves this through a unique blend of polymers and additives that prevent substrate deformation and peeling during thermal cycling, while maintaining adhesion properties.

Source

Temperature-sensitive adhesive with enhanced peelability that eliminates the need for temperature-controlled peeling processes. The adhesive achieves superior peelability by incorporating a unique tackifier composition that enables reliable release from substrates at elevated temperatures. This innovative adhesive design addresses the conventional problem of substrate damage during peeling, providing a reliable and efficient release mechanism for temperature-sensitive adhesives.

Source