46 patents in this list

Updated:

Modern LED lighting systems require precise assembly of multiple components - from LED arrays and heat sinks to optical elements and electrical connections. Current manufacturing processes often involve complex manual steps, with assembly times averaging 12-15 minutes per fixture and defect rates reaching 3-5% due to connection errors and misalignment.

The fundamental challenge lies in simplifying assembly while maintaining precise optical alignment, thermal management, and reliable electrical connections across diverse lighting applications.

This page brings together solutions from recent research—including substrate-joining techniques that eliminate connectors, T-shaped contact designs for universal LED compatibility, optical arrays with integrated electrodes, and modular socket-based systems. These and other approaches focus on reducing assembly complexity while ensuring consistent performance in commercial and industrial lighting products.

1. Illumination Apparatus with Directional Catadioptric Optical Elements and Integrated LED Electrical Connections

Optovate Limited, 2022

An illumination apparatus designed for lighting applications with directional output using LEDs and optical elements. The apparatus features an array of directional catadioptric optical elements aligned with an array of LEDs. These optical elements include electrodes that provide electrical connections to the LEDs, allowing the LEDs to be packaged separately from the optics. The optical element array can be assembled with the LED array to create the complete illumination apparatus.

US20220205615A1-patent-drawing

2. LED Downlight with Separable Driver and Detachable Connection System

KIM DOO JOON, SEOHYUN INT CORP, SEOHYUN INTERNATIONAL CORP, 2022

LED downlight device with separable driver for ease of installation, maintenance and flexibility. The downlight has an LED module, heat sink, reflector, diffuser cover and housing. The driver is separate from the downlight and connects to wires drawn out from the heat sink and junction box. This allows detachable connection for easier installation and replacement of just the driver instead of the whole downlight if needed. It also allows using different driver wattages by swapping just the driver.

KR20220078111A-patent-drawing

3. Modular LED Lamp System with Separate LED Module Board and Signal Control Board

GUANGDONG BASE DECORATIVE LIGHTING LIMITED CO, GUANGDONG BASE DECORATIVE LIGHTING LTD CO, 2022

Split control system for intelligent LED lamps with separate LED lamp board and signal control board to simplify design, improve reliability, and reduce interference compared to integrated control boards. The LED lamp has a board with LED modules connected in series, and a separate board with AC-DC conversion, step-down module, control chip, and antenna. This allows independent power, signal, and antenna routing to avoid lamp housing interference. It also enables easier assembly and installation.

CN216600141U-patent-drawing

4. Light-Emitting Device with Overlapping Flexible and Rigid Substrates and Conductive Joining Member

NICHIA CORPORATION, 2022

A light-emitting device designed to prevent cracks in solder joints between substrates in LED displays while reducing the number of connectors. The device features two substrates: one flexible and one rigid. At one end, the flexible substrate overlaps the rigid substrate without covering the wiring patterns. An electrically conductive joining member spans across the wiring patterns to connect the substrates. This design enables flexible arrangement and prevents solder joint cracks.

5. Modular Polygonal Light Board with Integrated LED, Driver, and Power Components

SHENZHEN WITOP TECH CO LTD, SHENZHEN WITOP TECHNOLOGY CO LTD, 2021

An intelligent full-color light board that can be easily spliced together to create customized lighting configurations. The light board has a polygonal housing containing an LED light board, PCB driver board, and power module. The driver board has a LED drive control chip, current limiting resistor, decoupling capacitor, and filter capacitor connected to the power supply. The LED board, driver board, and power module are all mounted on the housing. This modular design allows individual components to be swapped, added, or removed as needed to customize the light board size, color output, and connectivity.

6. LED Module with Centralized Integrated Board and Peripheral Electrical Components for Unified Connection and Enhanced Heat Dissipation

ZOMO PHOTOELECTRIC TECH CO LTD, ZOMO PHOTOELECTRIC TECHNOLOGY CO LTD, 2021

LED module for high-power lighting applications that simplifies production and improves efficiency compared to separate LED arrays. The module has a main substrate with an integrated LED board at the center surrounded by electrical components. The LED board contains multiple LED modules with positive/negative pins. This allows connecting and soldering all the LED chips at once instead of individually for each module. The central LED board and outer components are separated for better heat dissipation.

7. Light-Emitting Device with Overlapping Flexible Substrates and Conductive Joining Member

NICHIA CORPORATION, 2021

A light-emitting device with a cost-effective substrate joining structure that allows for flexible substrate arrangement. It consists of a first flexible substrate with mounted light-emitting elements and a second substrate. The first substrate overlaps part of the second substrate without covering its wiring. An electrically conductive joining member bridges the wiring patterns of both substrates. This design eliminates the need for connectors or adhesives, reducing manufacturing complexity and costs.

8. Modular LED Display System with Independent Module Controllers and Frameless Interlocking Connectivity

SHENZHEN CHIP OPTECH CO LTD, 2021

Modular distributed control LED display system that enables customizable and expandable large-scale LED displays. The system uses detachable LED display module units that can be assembled and connected together without fixed frames or wiring. Each module has its own controller and power supply. The modules are connected using locks that can be opened from the front or back. This allows flexible configuration and expansion of the display size. The modules can be spliced horizontally, vertically, or both. This avoids the limitations of fixed frame sizes and complex wiring in traditional displays.

EP3761294A1-patent-drawing

9. Modular LED Lighting System with Central Drive Control and Separate Power and Dimming Signal Modules

JIASHAN SANSI PHOTOELECTRIC TECHNOLOGY CO LTD, PUJIANG SANSI OPTOELECTRONICS TECH CO LTD, PUJIANG SANSI OPTOELECTRONICS TECHNOLOGY CO LTD, 2020

Modular LED lighting system with flexible configuration options to reduce costs and improve versatility compared to conventional LED lamps. The system has a central drive control module that connects to an LED lamp holder module, a power supply, a control signal input module, and a control signal conversion module. This allows separate control of power and dimming signals to the lamp head module, enabling customized configuration of lamp functions and power levels.

10. LED Luminaire Assembly with Replaceable Modules, Concavo-Convex Lenses, and Integrated Thermal Management

Eaton Intelligent Power Limited, 2020

High intensity LED luminaire assembly with improved thermal management, serviceability, and glare reduction. The assembly has replaceable LED modules with concavo-convex lenses for glare reduction. The modules are thermally connected to a heatsink housing. The power supply is separately housed with cooling. This allows independent replacement of modules. The power supply has circuitry for constant current and pulse width modulation dimming. It also has a thermal insulator between the power supply and LED modules. The assembly can be mounted at multiple angles.

11. Monolithic LED Array with Selective Removal and Reconfiguration for Customized Non-Monolithic Assembly

Optovate Limited, 2020

An approach for creating customized and efficient LED lighting devices involves assembling a monolithic array of LEDs and then selectively modifying it to achieve desired configurations. The process starts with a monolithic array of LEDs, from which specific LEDs are selectively removed and transferred to form a customized array with specific positions and spacings. This non-monolithic array is then aligned with an array of optical elements to create the final illumination apparatus. Techniques such as light or laser-based separation are used to remove and position LEDs precisely, allowing for optimization of the LED arrangement to match the optical elements. This method enhances efficiency by avoiding the need to manufacture LEDs in the final configuration from the outset.

US10605434B2-patent-drawing

12. LED Illumination Apparatus with Customizable LED and Optical Element Arrays Featuring Integrated Electrical Connectivity

Optovate Limited, 2020

An LED-based illumination apparatus designed for efficient, directionally controlled lighting features reduced manufacturing complexity. It comprises an array of custom optical elements, such as lenses, aligned with a separate array of LEDs. The optical elements focus and direct the light emitted by the LEDs. The optical array includes electrodes for electrical connections to the LEDs. LEDs are initially formed in a monolithic array but are selectively removed and transferred onto a substrate to create a customized LED array with specific compositions and spacings. This custom array is then assembled with the optical array, allowing for precise configuration and alignment. Techniques like selective removal from the monolithic array facilitate this customization, while the optical array ensures proper electrical contact with the LEDs.

US10533730B2-patent-drawing

13. Modular LED Light Source with Intermediate Heat Sink for Enhanced Thermal Management

YANGZHOU EDISON LITEK CO LTD, YANGZHOU EDISON-LITEK CO LTD, 2020

Modular LED light source with improved heat dissipation for applications like automotive lighting. The modular design separates the LED board from the main circuit board using an intermediate heat sink. This allows the LED board with the light assembly to be mounted directly onto the heat sink for better thermal dissipation compared to just using the outer housing as a heatsink. The main circuit board is mounted separately below the heat sink. This separates the heat generating LEDs from the sensitive electronics to improve reliability and lifespan.

CN209893143U-patent-drawing

14. LED Holder with Base and T-Shaped Contact Section for Versatile CoB-LED Pad Connectivity

TE Connectivity Nederland BV, 2019

Low-cost, small-sized holder for an LED that can easily contact and mount a variety of different CoB-LEDs having contact pads in different locations. The holder includes a base, a contact, and a T-shaped contact section. The contact is connected to electrical wiring and has a receiving section to connect to a cable. The base holds the contact and exposes the T-shaped contact section in a receptacle that receives the LED board. This allows the T-shaped contact to electrically contact a pad on the LED board.

15. LED Light Board with Integrated Component Mounting and Direct Heat Dissipation Structure

厦门三堃电子科技有限公司, 2019

LED light board with improved heat dissipation and simplified assembly compared to traditional LED lamps. The board has the LED components like beads and driving components like diodes, resistors, etc directly mounted on the light board itself instead of separate lamp and circuit boards. This allows better heat dissipation from the LEDs. The light board and circuit board are connected via plugs and fixed together. The power connections are made using wires on the light board, which simplifies assembly compared to separate boards with terminal connections.

CN209213500U-patent-drawing

16. Illumination Apparatus with Separately Formed Optical and Light-Emitting Element Arrays for Aligned Light Direction

Optovate Limited, 2019

An illumination apparatus that provides a highly efficient, compact, and customizable lighting solution. The apparatus involves an array of separately formed optical elements and a separately formed array of light-emitting elements. The optical element array contains reflective or refractive elements that direct light emitted by the light-emitting elements. The optical element array also has electrodes to electrically connect to the light-emitting elements. The optical and light-emitting element arrays are assembled with alignment so each light-emitting element is positioned at an input surface of an optical element. This enables the separately formed light-emitting array to be customized and optimized independently from the optical elements.

17. Modular Lamp with Replaceable Planar Semiconductor Lighting Elements and Multi-Sided Socket Connections

Ulrich Spintge, Karsten Diekmann, Britta Goeoetz, 2019

Modular lamp design with easily replaceable planar semiconductor lighting elements that can be mounted in sockets. The lamp consists of an illuminant with a planar LED lighting surface that can be inserted into a socket. The socket provides the electrical and mechanical connection to power the illuminant. Multiple illuminants can be inserted into adjacent sockets to create a larger common illumination surface. The sockets can have connections on multiple sides for flexible wiring and shorted supply connections to simplify electrical connections.

18. Light-Emitting Device with Overlapping Substrates and Single Conductive Joining Member

NICHIA CORPORATION, 2019

A light-emitting device with a simplified, cost-effective structure using overlapping substrates and a joining member. The device has two overlapping substrates with wiring patterns and light-emitting elements. The substrates are partially overlapped with the first substrate overlapping a portion of the second substrate. An electrically conductive joining member is positioned across the wiring patterns. This configuration allows the substrates to be connected with just one joining member instead of multiple connectors.

US20190074419A1-patent-drawing

19. Lighting Module with Heat Sink-Mounted Electrical Connector and Integrated Interconnection Device

VALEO VISION, 2019

A lighting module for vehicle headlights and other lighting applications that can simplify production and reduce costs compared to traditional connectors. The module has an electrical connector for connecting to vehicle wiring that is mounted directly to a heat sink using an electrical interconnection device such as a printed circuit board. This eliminates the need for a two-part connector with the second part joining after the heat sink mounting. The module design also includes a cavity on the heat sink to prevent electrical contact between the connector contacts and the sink.

20. Modular Light System with Interchangeable Components and Detachable Connection Units

Vaxcel International Co., Ltd., 2018

Modularized light system with interchangeable components for customizable lighting solutions. The system uses detachable connection units between light modules, a control module, and a power module. This allows flexible configurations by connecting the modules in series. The control module can be positioned anywhere in the chain to synchronize the lights. The power module provides DC power to the control module. This allows compact, integrated modules with reduced wiring compared to integrated long cartridge lights.

US2018317293A1-patent-drawing

21. Modular LED Lamp with Detachable Heads and Integrated Power Converters

22. LED Light Fixture with Detachable Modules and Sliding Power Connector Interface

23. Modular LED Lighting System with Interchangeable Boards for Customizable White Light Color Temperature

24. Two-Piece Connector with Spring-Loaded Contact Pads for Screwless LED Module Retention and Electrical Connection

25. LED Lamp Assembly with Independent Rotatable Driver and Housing for Fixture Retrofitting

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Increasing output and reducing costs require optimizing the process for assembling LED lighting fixtures. The patents here show a variety of inventive approaches to accomplishing this goal. These methods focus on improving the integration of components, standardizing connectors, and simplifying mounting processes.