LED Lighting Life Extension

Heat dissipation device for LED lighting fixtures that allows efficient cooling of the LEDs to extend their lifespan. The device has a heat transfer lamp panel with an array of second heat sinks around the outer wall. Each second heat sink has an internal air inlet slot and ventilation holes connected to bottom first heat sinks between the second sinks. This allows air to flow through the device and extract heat from the LEDs. The LED fixture is mounted on the bottom of the heat transfer panel. The panel has a through hole for wiring and a threaded hole to attach the fixture.

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LED lighting device with improved heat dissipation to prevent overheating and damage. The device has a movable heat conduction mechanism inside the radiator. The mechanism has a transmission unit and a heat dissipation unit both attached to the surface. This allows the heat conduction mechanism to move and flex as the LEDs expand and contract due to temperature changes. This facilitates better heat transfer between the LEDs and the radiator, preventing excessive heat buildup.

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Graphene-based phase change thermal conductive component for rapidly dissipating heat in LED lamps. The component has a graphene-filled microchannel structure filled with a composite phase change material. The microchannels are arranged in a spiral shape at the bottom of the lamp housing. The graphene and phase change material rapidly conduct and absorb heat from the LED chips and lamp tube, respectively, allowing fast dissipation through the fins. This improves LED lamp heat dissipation, especially in compact designs with high power and heat.

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Heat dissipation device for ultra-high-power LED spotlights with over 1200 watts of power. The device uses multiple heat pipes and fins to efficiently transfer and dissipate the high heat generated by the LEDs. The device has two heat-gathering substrates sandwiched together with symmetrically arranged heat pipes clamped between them. The heat pipes connect the substrates and have fins inside them for additional heat dissipation. This allows rapid transfer of heat from one substrate to the other via phase change in the pipes. The fins enhance conduction and dissipation on the substrates. The device provides improved heat dissipation for super-high-power LED spotlights beyond the limits of conventional heat pipes.

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LED cooling device with improved heat dissipation and faster warm-up time compared to conventional aluminum heat sinks. The device uses copper heat spreaders and a heat spreader bottom plate inside enclosed structural supports connected to the LED backside. Cooling fans are fixed to the inner sides of the supports. This configuration provides direct contact and forced air cooling for faster thermal transfer from the LED to the exterior.

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Composite radiator for LED lamps with improved heat dissipation. The radiator connects directly to the LED lamp housing and has an inner section filled with a phase change material. This section is smaller than half the volume of the overall radiator. The radiator also has fins for convective cooling. The fins surround the central connection point to the LED lamp. The fin heights decrease outwardly. This design increases surface area for air contact, leverages convection, and uses phase change material to enhance heat transfer.

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A high heat flux cooling device for high-power LEDs that efficiently dissipates the high heat flux generated by closely-packed LEDs. The cooling device uses a heat dissipation substrate with heat-absorbing pits filled with thermal grease to embed the LED circuit boards. This allows direct contact and conduction cooling between the LEDs and the heat sink substrate. The grease provides a thermal interface and cushioning to prevent damage. The LEDs are mounted on the substrate surface with an annular rib around the pits. The ribs isolate the pits and prevent grease leakage. The grease thickness is 1.5x the circuit board thickness to ensure full embedding.

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A high-efficiency heat sink and cooling device for LED lamps to improve heat dissipation for high-power LED lamps. The cooling system uses multiple interconnected heat pipes and fins in a modular design to dissipate heat more effectively than conventional heat sinks. The design involves a base with grooves for installing interconnected U-shaped heat pipes. The heat pipes have fins on one end that connect to the base, and fins on the other end that connect to the lamp's heat sink. The interconnected heat pipes form a network to efficiently transfer heat from the lamp's power electronics to the base for dissipation. The modular design allows scaling the cooling capacity by adding more heat sink modules.

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LED superconducting module lamp with integrated cooling for high power applications to prevent lamp decay and improve longevity. The lamp has an enclosed cooling assembly attached to the lamp holder. The assembly consists of a mounting plate fixed to the holder and a frame attached to the plate. The plate has a hole to connect it to the holder. The enclosed cooling assembly allows higher power LED modules to be used without overheating or decay.

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LED light source cooling device to improve heat dissipation compared to natural convection. The device has a casing with an internal heat-conducting layer. The heat-conducting layer has penetrating holes connecting groups. An LED light source attaches to the far side of the layer. A heat sink on the other side of the layer contacts the LED. The sink has a U-shaped bracket that rotates and has a fan attached. This actively forces air through the penetrating holes to extract heat from the LED and sink.

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LED lamp structure that uses time-sharing heat storage and release to reduce lamp size and improve lifetime by storing some heat in a phase change material and dissipating the rest through a heat pipe. The lamp has a heat chamber with a heat pipe, LEDs on one side, and phase change material on the other. When the LEDs heat up, some goes into the PCM and some through the pipe. LEDs can operate longer before overheating. The PCM absorbs heat during LED off periods, preventing overheating.

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Pulsating heat pipe LED cooler with improved heat dissipation performance. It combines pulsating heat pipes, heat dissipation fins, and gravity heat pipes to create an effective LED cooling device. The pulsating heat pipe is wrapped around a gravity heat pipe and has fins attached to the outer ring. This setup allows heat transfer from the LED chip to the gravity heat pipe, then through the pulsating heat pipe fins to the surrounding air. The temperature equalizing plate provides a flat surface for the LED and gravity heat pipe.

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LED lamp with improved heat dissipation using aluminum-based flat plate heat pipes. The lamp has two flat heat pipes, one with the LED source and one for heat dissipation, connected by sub-heat pipes. The heat pipes have protrusions and circular holes on their inner walls. These features optimize liquid reflux speed and heat transfer. The heat pipes are made by extruding aluminum. The protrusions and holes are integral with the heat pipe walls. The heat pipes are oriented horizontally or curved upward to prevent liquid stagnation. This design provides efficient heat transfer from the LED source to the dissipation heat sink.

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LED lamp with improved heat dissipation using aluminum-based flat plate heat pipes. The lamp has two flat heat pipes, one with direct contact to the LED light source and the other in contact with the first pipe. The pipes have sub-pipes with grooves in the walls. The grooves are extruded aluminum or aluminum alloy. The pipes are oriented horizontally or nearly horizontal. The grooves have raised bumps and circular holes. The bumps are spaced 0.2mm apart, and the circular holes have diameters 0.3mm-1.2mm. This shape and size optimizes heat transfer by capillary action.

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Composite heat sink for LED automotive lights that provides better thermal management compared to traditional copper or aluminum heat sinks. The composite heat sink has a columnar heat conductor with a cap that directly contacts the LEDs to absorb their heat. This is integrated with a fin heat sink and fan to efficiently dissipate the absorbed heat. The integrated structure reduces thermal interfaces and resistance compared to separate copper/aluminum components.

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Heat dissipation structure for LED lamp bodies to improve cooling of LED lamps with irregular arrangements or wide coverage. The structure uses embedded second heat-conducting copper pipes on the lamp base to transfer heat from uncovered areas to the main fins and copper tubes. This prevents local overheating and extends LED life by efficiently dissipating heat through the fins and air. The pipes are placed at corner positions of the base where regular fins can't reach.

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Heat conduction device for LED lamps that improves heat dissipation efficiency to protect the lamp components from high temperatures. The device has a heat exchanger fixed to the upper end of the base, a fan attached to the exchanger, and vertical grooves on the base. This creates a path with increased contact area between the LED substrate and base using thermally conductive silicone. The grooves prevent oil volatilization. The exchanger has fins and an integrated cylinder. The fan blades face the exchanger. Air holes and channels guide air through the exchanger. This design allows faster heat transfer from the LED chip to the fan for efficient dissipation.

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LED lamp and lighting device with improved heat dissipation. The lamp has an aluminum substrate, a heat-conducting layer on the substrate, and a heat-dissipating layer on the heat-conducting layer. The heat-dissipating layer contacts air to dissipate heat through convection. This allows efficient heat transfer from the LED to the air, improving heat dissipation compared to direct conduction. The heat-conducting layer can also have a thermally conductive medium like graphene to further enhance heat transfer. The device uses this lamp to improve heat dissipation from the LED.

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A thermoelectric separation type superconducting LED module with improved heat dissipation for long lamp life. The module has a thermally conductive plate sandwiched between a heat sink and an aluminum substrate. LEDs are mounted on the substrate. A thermally conductive boss below each LED connects to the LED top surface and bottom surface. This creates a thermoelectric separation that enhances heat transfer. The plate, substrate, and heat sink are all aluminum with silver plating for high thermal conductivity. The module has through holes for the bosses and fins on the heat sink for additional heat dissipation.

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A high efficiency heat dissipation system for integrated LED lamps that reduces LED operating temperatures and recycles heat. The system uses a U-shaped heat pipe, Stirling engine, radiator fins, and a micro generator. The LED chip is sandwiched between the fixing frame plates with the heat pipe bottom facing the chip's bottom. Heat from the LED transfers to the pipe, which absorbs and vaporizes a medium. The vaporized medium moves through the pipe to the radiator fins where it condenses, releasing heat to the air. The remaining heat goes to the frame's bottom plate, which contacts the Stirling engine. The engine converts this heat to mechanical motion driving the micro generator to produce electricity. The power is sent to the LED through a power module.

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