LED Component Miniaturization in Lighting Manufacturing

Mini LED backlight array and backlight module design to reduce the number of Mini LEDs needed for uniform light mixing in displays, making thinner and cheaper Mini LED backlight modules. The key idea is to use a cavity around the Mini LED array and cover it with a transparent light outlet. The cavity shape and dimensions are optimized to collimate and mix the light from the Mini LEDs inside the cavity, providing uniform output through the outlet without needing additional Mini LEDs. This reduces the total number of Mini LEDs required for a backlight compared to arranging them directly. The cavity collimation and mixing effect compensates for the lower density of Mini LEDs inside.

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LED light engine with improved light extraction and heat dissipation compared to traditional encapsulated LEDs. The engine uses a sealed cavity structure with an optical lens in contact with the LED chip's emitting surface. This eliminates multiple interfaces between the chip and lens, reducing light reflection and improving extraction. The sealed cavity also prevents UV absorption by packaging materials. The LED chip is mounted on a bracket with bonding pads for electrical connection. An optical lens with a contact layer protruding into the cavity is bonded to the chip's emitting surface. This provides direct contact for light extraction without interfaces. The sealed cavity and lens contact improve light extraction efficiency. The chip's electrical connections are made through pads on the bracket.

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A compact LED lighting apparatus that provides high brightness from a small volume package. The lighting apparatus consists of a board with multiple LED light-emitting units mounted on it. These LEDs are enclosed in a package structure that has a volume of less than 5000 mm³ but still delivers a light intensity greater than 150 lumens.

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Lighting apparatus with high intensity and small size suitable for integration into compact consumer electronics and appliances. The lighting apparatus includes a board with multiple LED light-emitting units mounted on it. The LEDs are enclosed in a package structure with a volume of less than 5000 mm3. This small package size achieves a high light intensity greater than 150 lumens.

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LED devices with reduced footprint and improved cross-talk reduction for closely-spaced arrays. The devices have LED chips with light-altering materials directly on the peripheral sidewalls instead of using a separate submount or leadframe. The light-altering material thickness is in the range of 15-100 microns. This allows compact packaging with footprint close to the chip size. The light-altering material reduces cross-talk between closely-spaced LEDs by absorbing or reflecting light leaking from adjacent chips. The material is formed as a pre-shaped sheet that is laminated onto the LED chip edges.

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LED light source with improved light scattering, wider light angle, and reduced thickness compared to conventional LED backlight modules. The LED light source has a unique colloid shape on top of the chip that scatters light. The colloid has a concave center and convex edges. This shape helps spread the light emitted by the chip. The LED chip is solidified directly onto the support without a lens. This eliminates the need for a separate lens, gap, and reflections. The colloid and chip are encapsulated together. This reduces the distance between LEDs and diffusers, allowing thinner modules. The molding fixture has grooves with concave-convex shapes to form the colloid on the chips during preparation.

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Single-side light-emitting chip scale package LED (CSP LED) with improved light extraction efficiency by optimizing the internal structure. The CSP LED has a bowl-shaped white wall glue surrounding the LED chip. The bottom of the chip is recessed to match the bowl shape. This allows the chip electrode to be flush with the bottom of the bowl. The chip and bowl are filled with packaging glue. This configuration prevents blocking of light around the chip and eliminates light escape through the bottom. The CSP LED has higher front side light extraction efficiency compared to conventional CSP LEDs with white wall glue outside the chip.

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Wafer-level packaged light-emitting device with inclined wafer reflection structure and its manufacturing method to improve the luminous efficiency of compact flip chip LED devices like chip scale packages (CSP). The device has a flip chip LED, fluorescent structure, side-transparent structure, and reflective structure. The side-transparent structure has an inclined surface between the LED and fluorescent layers. The reflective structure covers the inclined surface to reflect light back into the package instead of escaping from the sides. This reduces internal light loss and improves overall efficiency compared to conventional side reflectors. The device can be manufactured by pressing flip chips onto a film with light-transparent adhesive, curing to form the side structure, and adding a cover reflective structure.

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A compact and bright LED lighting apparatus that exceeds 150 lumens while having a small volume of less than 5000 mm3. The apparatus achieves high-intensity lighting in a compact package by using a board with multiple LED emitters and enclosing them in a minimal-volume package structure.

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Lighting apparatus with high intensity, small volume package, and high-efficiency LEDs. The apparatus includes a board with multiple small LEDs mounted on it and an enclosure that houses the LEDs. The enclosure has a volume of less than 5000 mm3 and protects the LEDs while maintaining high light output.

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Low-profile luminaire design for retrofit LED downlighting applications. The luminaire has a heat spreader, heat sink trim plate, and a light source mounted to the spreader. The spreader and sink are sized, shaped, and thermally coupled to effectively dissipate heat from the light source without requiring additional bulky heat-sinking components. This allows a compact form factor suitable for retrofitting into existing recessed light fixtures or junction boxes.

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Thin integrated LED packaged light source that can directly package the chip on the substrate to stabilize the optical distance of the LED packaged light source and realize LED thinning. The thin integrated LED packaged light source is manufactured by attaching inverted blue chips at equal distances on a solder paste on the PCB substrate, covering them with a transparent encapsulation layer, and attaching a fluorescent film layer on top.

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Method to manufacture a backlight unit for displays using mini LEDs in a way that allows thinner packages, higher contrast, and easier dimming control. The method involves printing solders, reflectors, encapsulant, and LEDs onto a substrate using stencil printing techniques. This enables precise placement and patterning of components for a compact backlight. The mini LEDs are dimmable by region and have individual phosphor encapsulation. The printed reflector covers most of the substrate area for high contrast.

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Chip scale packaging (CSP) LED with improved luminous efficiency for top-emitting CSP LEDs. The CSP LED has a flip chip LED, a brilliant layer, a chip side spacer, and a reflection structure. The chip side spacer connects between the LED chip edge and the bottom of the brilliant layer, forming an oblique surface. The reflection structure covers the oblique spacer edge. This redirects light emitted from the chip edges back into the LED, preventing loss.

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Chip-scale packaging (CSP) LED with improved efficiency for applications like displays and lighting. The CSP LED has a flip-chip LED, photoluminescent layer, chip-side spacer, and reflective structure. The chip-side spacer is a beveled sidewall connecting the LED edge to the package surface. The reflective structure covers the beveled sidewall. This reduces light escape from the LED edges and improves efficiency compared to conventional CSP LEDs with a fully covering photoluminescent layer. The spacer and reflective structures are formed through processes like extruding adhesive and curing.

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A light-emitting device with improved efficiency, uniformity, and adjustable angle, particularly for small-sized devices. The device has an LED chip, a tapered fluorescent structure, and a reflective structure covering both the LED and fluorescent sides. The tapered fluorescent structure reduces light escape and improves spatial uniformity. The reflective structure guides light out instead of reflecting back. This avoids halo and losses. The tapered shape allows smaller device size and lower thermal resistance compared to full vertical reflection.

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LED light emitting device with a smaller light-emitting area compared to conventional devices. The device is made by a manufacturing process that allows closer packing of the LED chip and reflector. The process involves mounting the LED chip on the device substrate before forming the reflector. This allows the reflector to be very close to the chip, reducing the overall light-emitting area. The chip is also covered with a transparent gel. By precisely shaping the reflector and gel around the chip, the light-emitting area can be minimized beyond the limitations of conventional devices. The smaller light area enables better secondary optical design and device-level optical integration.

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LED module for emitting mixed light, preferably white light, that can be used in lamps with small reflector sizes. The LED module has a circular light-emitting zone divided into flat sectors, like slices of a pie. Each sector can emit a different light spectrum. Phosphor can be added to the potting compound between the sectors to create white light. This allows producing a homogeneous mixed light from individual sector emissions. The circular sector design allows a small light-emitting zone suitable for small reflector lamps.

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High efficiency thin form factor light source module for applications like displays, lighting, and sensors. The module has a light-emitting diode (LED) die that outputs a light beam. The LED die is mounted on a carrier substrate that reflects the light back through the LED die to create a self-reflected light path. This allows the LED die to be very thin, as the carrier substrate provides the necessary optical path length. The self-reflection also improves light extraction efficiency. The carrier substrate can also have other features like microstructures, coatings, or patterns to further enhance the light output. The module is manufactured by mounting the LED die on the carrier substrate.

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A versatile, flat-panel LED lighting fixture that integrates the driver circuitry and allows multiple LED configurations to be driven separately for redundancy. The fixture has a frame that houses an LED panel. The panel has LEDs along the edges and a power circuit board that converts AC to DC within the frame. The circuitry is narrow and fits in a channel in the frame. The fixture can alternate between LED configurations by driving sets of LEDs separately.

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