LED Component Miniaturization in Lighting Manufacturing

LED light engine with improved light extraction and heat dissipation compared to traditional encapsulated LEDs. The engine uses a sealed cavity structure with an optical lens in contact with the LED chip's emitting surface. This eliminates multiple interfaces between the chip and lens, reducing light reflection and improving extraction. The sealed cavity also prevents UV absorption by packaging materials. The LED chip is mounted on a bracket with bonding pads for electrical connection. An optical lens with a contact layer protruding into the cavity is bonded to the chip's emitting surface. This provides direct contact for light extraction without interfaces. The sealed cavity and lens contact improve light extraction efficiency. The chip's electrical connections are made through pads on the bracket.

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A compact LED lighting apparatus that provides high brightness from a small volume package. The lighting apparatus consists of a board with multiple LED light-emitting units mounted on it. These LEDs are enclosed in a package structure that has a volume of less than 5000 mm³ but still delivers a light intensity greater than 150 lumens.

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Lighting apparatus with high intensity and small size suitable for integration into compact consumer electronics and appliances. The lighting apparatus includes a board with multiple LED light-emitting units mounted on it. The LEDs are enclosed in a package structure with a volume of less than 5000 mm3. This small package size achieves a high light intensity greater than 150 lumens.

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LED devices with reduced footprint and improved cross-talk reduction for closely-spaced arrays. The devices have LED chips with light-altering materials directly on the peripheral sidewalls instead of using a separate submount or leadframe. The light-altering material thickness is in the range of 15-100 microns. This allows compact packaging with footprint close to the chip size. The light-altering material reduces cross-talk between closely-spaced LEDs by absorbing or reflecting light leaking from adjacent chips. The material is formed as a pre-shaped sheet that is laminated onto the LED chip edges.

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LED light source with improved light scattering, wider light angle, and reduced thickness compared to conventional LED backlight modules. The LED light source has a unique colloid shape on top of the chip that scatters light. The colloid has a concave center and convex edges. This shape helps spread the light emitted by the chip. The LED chip is solidified directly onto the support without a lens. This eliminates the need for a separate lens, gap, and reflections. The colloid and chip are encapsulated together. This reduces the distance between LEDs and diffusers, allowing thinner modules. The molding fixture has grooves with concave-convex shapes to form the colloid on the chips during preparation.

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Single-side light-emitting chip scale package LED (CSP LED) with improved light extraction efficiency by optimizing the internal structure. The CSP LED has a bowl-shaped white wall glue surrounding the LED chip. The bottom of the chip is recessed to match the bowl shape. This allows the chip electrode to be flush with the bottom of the bowl. The chip and bowl are filled with packaging glue. This configuration prevents blocking of light around the chip and eliminates light escape through the bottom. The CSP LED has higher front side light extraction efficiency compared to conventional CSP LEDs with white wall glue outside the chip.

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Wafer-level packaged light-emitting device with inclined wafer reflection structure and its manufacturing method to improve the luminous efficiency of compact flip chip LED devices like chip scale packages (CSP). The device has a flip chip LED, fluorescent structure, side-transparent structure, and reflective structure. The side-transparent structure has an inclined surface between the LED and fluorescent layers. The reflective structure covers the inclined surface to reflect light back into the package instead of escaping from the sides. This reduces internal light loss and improves overall efficiency compared to conventional side reflectors. The device can be manufactured by pressing flip chips onto a film with light-transparent adhesive, curing to form the side structure, and adding a cover reflective structure.

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A compact and bright LED lighting apparatus that exceeds 150 lumens while having a small volume of less than 5000 mm3. The apparatus achieves high-intensity lighting in a compact package by using a board with multiple LED emitters and enclosing them in a minimal-volume package structure.

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Lighting apparatus with high intensity, small volume package, and high-efficiency LEDs. The apparatus includes a board with multiple small LEDs mounted on it and an enclosure that houses the LEDs. The enclosure has a volume of less than 5000 mm3 and protects the LEDs while maintaining high light output.

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Low-profile luminaire design for retrofit LED downlighting applications. The luminaire has a heat spreader, heat sink trim plate, and a light source mounted to the spreader. The spreader and sink are sized, shaped, and thermally coupled to effectively dissipate heat from the light source without requiring additional bulky heat-sinking components. This allows a compact form factor suitable for retrofitting into existing recessed light fixtures or junction boxes.

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Thin integrated LED packaged light source that can directly package the chip on the substrate to stabilize the optical distance of the LED packaged light source and realize LED thinning. The thin integrated LED packaged light source is manufactured by attaching inverted blue chips at equal distances on a solder paste on the PCB substrate, covering them with a transparent encapsulation layer, and attaching a fluorescent film layer on top.

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Method to manufacture a backlight unit for displays using mini LEDs in a way that allows thinner packages, higher contrast, and easier dimming control. The method involves printing solders, reflectors, encapsulant, and LEDs onto a substrate using stencil printing techniques. This enables precise placement and patterning of components for a compact backlight. The mini LEDs are dimmable by region and have individual phosphor encapsulation. The printed reflector covers most of the substrate area for high contrast.

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Chip scale packaging (CSP) LED with improved luminous efficiency for top-emitting CSP LEDs. The CSP LED has a flip chip LED, a brilliant layer, a chip side spacer, and a reflection structure. The chip side spacer connects between the LED chip edge and the bottom of the brilliant layer, forming an oblique surface. The reflection structure covers the oblique spacer edge. This redirects light emitted from the chip edges back into the LED, preventing loss.

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Chip-scale packaging (CSP) LED with improved efficiency for applications like displays and lighting. The CSP LED has a flip-chip LED, photoluminescent layer, chip-side spacer, and reflective structure. The chip-side spacer is a beveled sidewall connecting the LED edge to the package surface. The reflective structure covers the beveled sidewall. This reduces light escape from the LED edges and improves efficiency compared to conventional CSP LEDs with a fully covering photoluminescent layer. The spacer and reflective structures are formed through processes like extruding adhesive and curing.

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A light-emitting device with improved efficiency, uniformity, and adjustable angle, particularly for small-sized devices. The device has an LED chip, a tapered fluorescent structure, and a reflective structure covering both the LED and fluorescent sides. The tapered fluorescent structure reduces light escape and improves spatial uniformity. The reflective structure guides light out instead of reflecting back. This avoids halo and losses. The tapered shape allows smaller device size and lower thermal resistance compared to full vertical reflection.

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LED light emitting device with a smaller light-emitting area compared to conventional devices. The device is made by a manufacturing process that allows closer packing of the LED chip and reflector. The process involves mounting the LED chip on the device substrate before forming the reflector. This allows the reflector to be very close to the chip, reducing the overall light-emitting area. The chip is also covered with a transparent gel. By precisely shaping the reflector and gel around the chip, the light-emitting area can be minimized beyond the limitations of conventional devices. The smaller light area enables better secondary optical design and device-level optical integration.

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LED module for emitting mixed light, preferably white light, that can be used in lamps with small reflector sizes. The LED module has a circular light-emitting zone divided into flat sectors, like slices of a pie. Each sector can emit a different light spectrum. Phosphor can be added to the potting compound between the sectors to create white light. This allows producing a homogeneous mixed light from individual sector emissions. The circular sector design allows a small light-emitting zone suitable for small reflector lamps.

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High efficiency thin form factor light source module for applications like displays, lighting, and sensors. The module has a light-emitting diode (LED) die that outputs a light beam. The LED die is mounted on a carrier substrate that reflects the light back through the LED die to create a self-reflected light path. This allows the LED die to be very thin, as the carrier substrate provides the necessary optical path length. The self-reflection also improves light extraction efficiency. The carrier substrate can also have other features like microstructures, coatings, or patterns to further enhance the light output. The module is manufactured by mounting the LED die on the carrier substrate.

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A versatile, flat-panel LED lighting fixture that integrates the driver circuitry and allows multiple LED configurations to be driven separately for redundancy. The fixture has a frame that houses an LED panel. The panel has LEDs along the edges and a power circuit board that converts AC to DC within the frame. The circuitry is narrow and fits in a channel in the frame. The fixture can alternate between LED configurations by driving sets of LEDs separately.

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A thin, compact light-emitting chip design that allows ultra-thin light-emitting devices by embedding the LED chips in recessed areas on the substrate. This reduces the overall thickness of the light-emitting chip below the sum of the LED chip and substrate thicknesses. The recesses accurately seal the LED chips with filling materials like phosphor glue to prevent spreading and achieve desired white light effects. This enables thinner, more compact light-emitting devices like displays and lighting panels with ultra-thin chips.

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Small, thin, high-brightness LED device for backlights in thin and light electronic devices like smartphones. The device has a single-sided light emission with a compact layout. The LED chip is bonded to a thin fluorescent adhesive layer that contains different phosphors. This allows concentration of brightness and color in a small area. A sealant covers the edges. The device is suitable for small space backlights because it has a smaller footprint than traditional LED packages. The thin fluorescent adhesive reduces thickness. Mixing different phosphors improves brightness and color concentration compared to traditional dispensed phosphors.

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A compact LED device for thin and light applications like displays and backlights. The LED device has a single-sided emitting structure with the chip and phosphor on the same side. A thin light-transmitting adhesive layer separates the chip from the PCB. This allows a compact, thin device that can be used in tight spaces like displays. The phosphor is applied using a deposition technique to improve phosphor utilization. The chip is bonded to the phosphor layer. This enables high brightness and color consistency in compact LED devices. The thin, compact LEDs can be packed densely for high resolution displays or backlights.

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A multi-faceted chip-scale packaged LED that emits light from all sides to reduce dark areas between LEDs in applications like backlights. The LED has a flip-chip with light-emitting surfaces on the top and two opposing sides. The top surface has a luminescence conversion adhesive, while the side surfaces have a side reflective adhesive. This allows the LED to emit light from the sides as well as the top. The multi-sided LED reduces the need for dense LED arrays and complex lens designs to eliminate dark areas between LEDs.

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A high-power, energy-efficient lighting system for film and TV production that uses modular LED light sources. The system has a central hub connected to multiple radial modules. Each module contains an LED array, heat exchanger, and electronics. The modules extend radially and emit light through windows in a plane. This allows compact, modular construction with individual module replacement. An external frame connects the modules and hub. The modular design provides robust, lightweight, high-output lighting that can be expanded, replaced, or repaired easily.

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Single-sided LED device and packaging method for compact, high-brightness LEDs that are suitable for thin, lightweight applications like mobile phone displays. The device has a PCB, light-emitting chip, fluorescent glue layer, top encapsulant layer, and side sealant layer. The fluorescent glue and encapsulant layers are separately prepared by vapor deposition and coating, then bonded to the chip, instead of dispensing or spraying. This improves glue utilization and concentration compared to conventional methods. The separate preparation allows smaller device size, lower thickness, and better color performance for thin LED backlights.

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LED lighting assembly with efficient heat dissipation and simplified manufacturing compared to traditional LED fixtures. The assembly uses wire frames on either side of the LEDs to create a gap between them. The LED chains are connected across the gaps using techniques like wire bonding or flip chip. This allows electrical connection without relying on a printed circuit board. The frames and LEDs are molded together to provide mechanical support. The gaps provide thermal isolation between the LEDs, enabling efficient heat transfer to a separate heat sink. This eliminates the need for a PCB through the LEDs and simplifies manufacturing. The LED chains can be inserted into containers like tubes or bulbs for enclosed lighting applications.

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Flat LED lighting fixture with integrated internal driver circuitry for powering the LEDs, allowing a slim form factor and simplifying installation. The fixture has a thin frame containing an LED panel and power circuitry. The LED panel contains arrays of LEDs along the edges. The power circuitry includes drivers to convert AC power to DC for the LEDs. The circuitry is designed to fit within channels in the frame.

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A compact lighting device that provides high brightness in a small form factor using multiple LEDs. The device has a package structure enclosing the LEDs with a volume less than 5000 mm3. The encapsulated LEDs are mounted on a board. This enables a high lumen output of over 150 lumens from a very small package size, suitable for applications where intense lighting is needed in a confined space.

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Chip-scale packaging (CSP) LED with improved luminous efficacy, particularly for top-surface emitting CSP LEDs. The LED has a flip-chip LED, photoluminescent layer, spacer structure, and reflective structure. The spacer has a beveled edge connecting the LED and photoluminescent layer edges. The reflective structure covers the beveled spacer edge. This prevents light escaping the LED through the side surfaces and improves efficiency.

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Compact, high efficiency LED package that uses internal light reflection to improve light extraction and enable smaller footprint packages. The LED package has a sealing body with flat surfaces that reflect light back into the package instead of escaping through the edges. This recycled light is converted by a conversion layer and emitted from the package. The flat sealing body shape allows the LED chip area to be closer to the package edge compared to hemispherical lenses. This provides higher chip-to-package ratio and wider light emission profile. The flat sealing body also reduces total internal reflection (TIR) light that would be lost.

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Ultrathin LED light engine design with integrated heat dissipation, compact size and modularity for easy assembly. The light engine consists of a protective cover, a driving circuit board, an aluminum substrate, and LED modules. The circuit board is mounted on the aluminum substrate via a heat-conducting plate. The LED modules are mounted on the substrate and connect to the board with an insulated circuit. The cover reflects light and protects the components. The substrate and cover form a heat sink. This allows an ultrathin design with modular components while achieving good thermal management. The cover shape can be customized for different applications.

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LED lighting device for automotive applications that provides improved light distribution and small dimensions compared to prior LED lamps. The device comprises at least two LED assemblies with LED elements mounted in a specific arrangement relative to each other. The LED elements are arranged along a rotation axis with their planes parallel to the axis. The LED assemblies are offset and rotated around the axis to achieve uniform light distribution. This compact configuration allows the LED device to replace traditional filament bulbs in automotive lamps while maintaining the regulatory tolerance box for filament placement.

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A small form factor LED lighting apparatus with high intensity. The lighting apparatus has a volume less than 5000 mm3 and a light intensity greater than 150 lumens. The compact size makes it suitable for applications where space is limited. The apparatus achieves high brightness from multiple LEDs enclosed in a small package.

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Miniature adjustable linear LED lighting device with high color rendering index (CRI). The device has multiple LED filaments arranged inside a transparent outer container. The filaments are connected in parallel and emit light through a slot in an arc-shaped reflective housing. The device provides high CRI lighting in a compact form factor for applications like shop windows and shelves. The arc-shaped reflector creates a resonant cavity that repeatedly reflects the light back into the filament envelope to excite phosphors for better color rendering.

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A simple and mass producible LED package structure for lateral light emission. The structure involves mounting the LED chips inside a reflective cup on the substrate, encapsulating them, and then dividing the substrate into two halves with opposite openings. This creates a compact package with integrated lateral light reflection. The LED chips emit light into the reflective cup which bounces back laterally due to the divided substrate, providing lateral light extraction without the need for additional components or redesigning the LED chip placement.

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A packaged LED with improved light extraction efficiency to enhance brightness without increasing LED chip count or power. The LED package has a reflective structure around the LED chip. The LED chip is mounted on a bracket with pins to connect to an external circuit. The bracket has a reflective surface around the chip to bounce light back and increase extraction. This allows higher efficiency and brightness from the same chip and power compared to a bare chip.

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A packaging structure for CSP (chip scale package) standard LED lamps that improves heat dissipation, light extraction, and reliability compared to conventional LED lamps. The packaging involves encapsulating the LED chip with a fluorescent glue layer at the bottom edge and a bent stopper to prevent light leakage. The LED chip has a specific layer configuration with notches and bumps at the bottom contacts. This design allows better heat dissipation, as the glue layer contacts the substrate for thermal transfer, and improved light extraction, as the stopper and notches prevent light reflection. The bumps on the contacts also provide electrical connection.

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An LED light engine package structure that integrates the LED chips and the LED driver electronics on the same substrate to simplify manufacturing and improve thermal performance compared to separate components. The LED chips and driver electronics are all fabricated on a single substrate using semiconductor wafer processing. This allows the LED chips and driver electronics to be closely packed together without intermediary packaging steps, reducing size and cost while improving heat dissipation. The integrated LED engine can then be mounted as a single package in applications like lighting.

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Simplified LED chip-on-board (COB) light source with improved heat dissipation and manufacturing efficiency. The COB light source has a sheet-type heat dissipation bracket with a reflective bowl or groove integrated into it. The LED chip is mounted in the reflective bowl/groove on the heat sink. Electrodes are punched directly onto the heat sink. This eliminates the need for separate substrates, bond wires, and external heat sinks. The LED chip is directly attached to the heat sink with the reflective bowl/groove providing internal reflection. This simplifies design, reduces costs, and improves heat dissipation compared to traditional COBs.

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A three-dimensional packaged LED light source for automotive headlights that improves integration, light extraction, and heat dissipation compared to conventional 2D packaged LEDs. The 3D packaged light source uses a 3D heat column with LED chips mounted on a PCB inside a lens housing. This allows more LEDs to be stacked vertically for higher integration and light output compared to 2D packaging. The 3D column also provides better heat dissipation compared to 2D substrates since more surface area is in contact with the heat sink.

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Chip-level LED light source module with improved protection and heat dissipation compared to conventional flip chip LEDs. The module has a PCB, enclosure, and primary optics. The LED chips are mounted on the PCB and enclosed by a cofferdam. This protects the sidewalls of the chips from damage and improves heat dissipation compared to exposed sidewalls. A primary optic element is then added over the enclosure.

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High-power LED lamp structure based on Si substrate with improved efficiency and heat dissipation compared to conventional LED lamps made on sapphire or SiC substrates. The structure uses flip-chip LEDs on Si substrates with integrated heat sinks, reflectors, and phosphor for better light extraction. The LED chips are bonded to the Si substrate and enclosed in a package with wires connecting the electrodes. This allows direct cooling of the LED chips, better light reflection, and easier package fabrication compared to substrates like sapphire or SiC.

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LED package with improved light extraction and thermal management. The package has a lead frame, LED chip, heat slug, and body part. The body part covers the heat slug and has higher thermal resistance on the outer circumference versus the interior. This provides better thermal stability. The body part also has higher reflectivity on the central upper surface near the LED chip versus the rest. This improves light extraction. The design allows separate optimization of light extraction and thermal management in key regions.

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Ultra-thin side-mounted LED with high efficiency SMD packaging for applications like smartphones and wearables. The LED has a super thin profile of less than 0.4mm on one side and a total thickness of 1.2mm. This allows it to be mounted close to the PCB for compact devices. The LED has a light-emitting chip connected to the PCB using gold wire bonding. The thin profile and close mounting improves efficiency by reducing distance for light extraction.

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LED lighting assembly with simplified design and manufacturing compared to conventional LED packages. The assembly has a flattened housing with recesses to hold the LEDs and diffusing lenses. It uses sheet metal forming instead of intricate punched structures and screws. The housing also has a compartment for the power supply with a thermal barrier between it and the LEDs. This reduces components, simplifies assembly, and improves heat management compared to traditional LED packages.

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A multi-chip LED package design to improve light extraction, uniformity, and heat dissipation compared to conventional packaged LEDs. The design involves inserting the LED chips into a diffuser with a reflective top surface to scatter and direct light. The LEDs are mounted on a protrusion above the PCB with a metal heat sink underneath for direct heat dissipation. This allows the LED chips to be fully surrounded by diffusion and reflection elements to maximize extraction. The PCB has through-holes for light transmission. A first reflective layer on the PCB boundary reflects light into the holes.

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