LED Component Cost Reduction in Manufacturing
LED manufacturing facilities currently process thousands of components per hour, with yields ranging from 85-95% depending on complexity. Material costs represent 60-70% of production expenses, while testing and binning operations add significant overhead. Current industry standards require tight tolerances for color consistency (typically ±100K CCT) and forward voltage matching (±0.1V).
The fundamental challenge lies in balancing manufacturing throughput and component uniformity while reducing material waste and testing complexity.
This page brings together solutions from recent research—including standardized component architectures, integrated thermal management systems, simplified connection methods, and optimized binning processes. These and other approaches focus on maintaining quality standards while reducing production costs through improved yields and streamlined operations.
1. Method for Assembling LED Illumination Devices with Separate Optical and Light-Emitting Element Arrays
Optovate Limited, 2020
A technique for manufacturing efficient and cost-effective LED-based illumination devices. The method involves using arrays of separate optical elements and light-emitting elements that are assembled to create the illumination apparatus. The optical element array has electrodes to connect to the light-emitting elements.
2. LED Illumination Apparatus with Aligned Optical Element and LED Arrays for Enhanced Directionality and Light Extraction
Optovate Limited, 2019
A highly efficient, low-cost LED-based illumination apparatus in which an array of optical elements is aligned with an array of tiny light-emitting diodes (LEDs) to improve the directionality and light extraction of the LED emission. The optical elements can be catadioptric, reflective, or refractive elements arranged in an array. The LEDs are formed on a separate substrate. When assembled, the optical elements focus and direct the LED light. The optical element array includes electrodes to connect to the LED array for powering the LEDs. The LED and optical element arrays can be manufactured separately and then aligned and combined. This allows for optimizing the LED and optical element designs independently.
3. LED Lighting Fixture with Form-Shaping for Standardized Component Integration
Contemporary Communications, Inc., 2019
Designing an LED lighting fixture that allows the use of standardized, low-cost components like LED strips and drivers to create a complete lighting product. The fixture uses a physical form that shapes the LED strip into a desired emission pattern when attached. It also includes constraint mechanisms to hold the strip in place. This allows using off-the-shelf LED strips rather than custom electronics. A positioning form for the driver is also provided. The physical forms can adapt strips and drivers to fit inside existing fixtures.
4. Production Control System for LED Substrate Manufacturing with Rank-Based Component Grouping and Automated Retrieval
FUJI CORP, FUJI Corporation, 2019
Production control system for efficiently producing LED substrates by optimizing selection and usage of different rank LED components. The system manages a storage of LED parts with associated rank data. It generates component groups of LED ranks to meet substrate requirements. It selects groups based on stock and production needs. This allows balancing usage of higher cost higher rank LEDs. The system also automates retrieving specific LEDs from storage.
5. Light Source Module with Embedded Electrically Conductive Layer for Heat Dissipation and Insulation
LG ELECTRONICS INC., 2019
A light source module with improved heat dissipation and fabrication efficiency without resorting to expensive materials. The module has a heat sink with an insulating layer to protect against electrical shock. An electrically conductive layer is embedded in the insulation to provide current to the light source. The conductive layer also has a heat dissipation portion to extract heat.
6. Lighting Module with Heat Sink-Mounted Electrical Connector and Integrated Interconnection Device
VALEO VISION, 2019
A lighting module for vehicle headlights and other lighting applications that can simplify production and reduce costs compared to traditional connectors. The module has an electrical connector for connecting to vehicle wiring that is mounted directly to a heat sink using an electrical interconnection device such as a printed circuit board. This eliminates the need for a two-part connector with the second part joining after the heat sink mounting. The module design also includes a cavity on the heat sink to prevent electrical contact between the connector contacts and the sink.
7. LED Manufacturing Dispensing Method with Big Data-Driven Glue Concentration Compensation
Zhejiang Yunke Intelligent Manufacturing Technology Co., Ltd., 2018
Optimizing the dispensing process in LED manufacturing to improve consistency and yield by using big data analysis. The method involves collecting original production data like material parameters, errors, initial glue concentration, glue concentration change, process conditions, etc. It then calculates the current dispensing amount based on the current glue concentration, compensation, and threshold ranges. This compensates for factors like phosphor settling, errors, and concentration changes during dispensing. By comparing the current point to previous production data, it reduces the impact of phosphor sedimentation on LED luminous characteristics and keeps brightness consistent between chips. This improves color coordinate concentration, bin rate, yield, and output ratio.
8. Modular LED Light Engine with Bonded Insulated Substrates for Direct AC Input
Point Engineering Co., Ltd., 2018
Light engine for an LED light source that is lower cost, modular, and allows AC power input without complex circuitry. It achieves this by using multiple insulated substrates for the LEDs, driver circuitry, and protection, all bonded together. The LED elements are mounted on a substrate, with circuit substrates contacting it to apply voltage, and protection substrates surrounding all of it. This provides insulation between components and prevents shorts. The bonded substrates form a modular light engine that can be easily manufactured and scaled.
9. Interlocking Modular LED Display Panels with Hermetic Sealing and Passive Cooling
Ultravision Technologies, LLC, 2018
Modular multi-panel LED display system that is low cost, lightweight, weatherproof, and doesn't require cabinets or active cooling. The display panels are designed to be interconnected without cabinets, using interlocking points, and hermetically sealed to protect the electronics from the environment. Heat sinks provide passive cooling. The panels have recessed printed circuit boards with LEDs, driver circuits, and potting compound over the LEDs.
10. Light Emitting Device with Linear Wiring Patterns on Insulating Substrate and Single Sealing Member
Sharp Kabushiki Kaisha, 2018
Low-cost light emitting device with improved insulation between the LED elements. The device has linear wiring patterns on an insulating substrate with LED chips mounted between them. The LED chips are sealed together with a single sealing member. The linear arrangement of the LEDs allows for simple and cost-effective manufacturing. The linear wiring patterns provide electrical insulation between the LEDs.
11. Modular Driver Module for LED Luminaire Retrofit in Standard Light Fixtures
Cree, Inc., 2018
Modular driver module for light fixtures with LED luminaires that allows existing fixtures to be retrofitted with LEDs. The module generates the drive signals necessary to drive the LEDs, eliminating the need for LED luminaires to have their own driver electronics. The module can be located in a junction box or escutcheon plate of the fixture, and the existing sockets and wiring used to carry the drive signals to the LED bulbs. This avoids the need for specialized LED bulbs with built-in drivers, allowing standard bulb sockets to be used.
12. Manufacturing Execution System with Modular Architecture for LED Epitaxial and Chip Production
SHANXI NANYE LIQI OPTOELECTRONIC CO LTD, 2015
A manufacturing execution system (MES) specifically designed for the complex and challenging process of LED epitaxial and chip manufacturing. The MES comprises modules for factory service management, device management, production technique management, supply chain management, production management, quality management, and sales management. It provides integrated real-time monitoring, tracking, analysis, and reporting of all aspects of LED manufacturing to improve efficiency, quality, and yield, reduce costs, and enhance profitability.
The patents that are displayed here provide information on a range of cost-cutting techniques. These include enhanced heat dissipation methods, streamlined component designs, and creative production procedures. LED lighting adoption can be greatly increased by putting these ideas into practice.
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