Multicolor LED Control Systems

Colorful COB LED light source with wider color range compared to using just two chipsets with different colors. It uses two sets of LED chipsets on a substrate, a fluorescent layer, and a light guide layer. The LED chipsets provide primary colors. The fluorescent layer converts light from one chipset to a different color. The light guide mixes the converted light from the fluorescent layer with the unconverted light from the other chipset to create a range of colors based on the primary colors.

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RGB adjustable COB (chip-on-board) light source with improved color and efficiency. The COB has red, green, and blue LED strings using blue chips covered by fluorescent glues. The red string has red phosphor glue, green uses green phosphor glue, and the blue string uses uncovered blue chips. This allows consistent materials and characteristics for all colors. The COB has a surrounding dam ring and a cover over the LEDs. The separate color conversion glues enable adjusting RGB balance and intensity.

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A multi-color LED light source that provides high color rendering index (CRI) by interleaving and mixing blue, green, red, and white LED chips in the light-emitting area. This integrated layout on the substrate allows for more accurate color mixing and better color rendering compared to separate white and color areas. The blue LEDs (440-465nm), green LEDs (520-550nm), and red LEDs are arranged alongside the white LEDs in the light-emitting area to achieve full-color lighting with improved color rendering compared to isolated color and white areas.

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Stacked LED chip structure for adjustable color temperature LED light sources that provides more natural light output compared to mixing lights of different color temperatures. Multiple LED chips are vertically stacked with phosphor layers on each chip. By adjusting the brightness of the stacked chips, it allows adjustment of color temperature while keeping the chromaticity on the Planckian trajectory for more natural light. Reflective glue around the chips enhances center light and reduces color distortion. The inclined reflective glue surface and phosphor coverage on the stack and substrate improve light extraction.

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A high Color Rendering Index (CRI) LED light source that provides both high color rendering accuracy and adjustable color options. The light source has separate blue, red, green, and white LED chips in individual light-emitting areas on a substrate. Each area is surrounded by a dam. Fluorescent glue fills the areas. The blue, red, green, and white LEDs emit light into the glue. This allows independent control of color balance by adjusting the intensities of the blue, red, green, and white LEDs. The fluorescent glue converts the LED light into a more natural, higher CRI white light for better color rendering.

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An adjustable spectrum LED light source module with improved color quality and lifespan compared to traditional LED lights. The module uses individual red, green, blue, and yellow LED chips packaged without phosphors. The chips are densely arranged on a substrate. This allows synthesizing white light by combining the primary colors instead of using phosphors. The module has a control unit to adjust the current through the chips and tune the light spectrum. It avoids phosphor limitations and aging issues.

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Full-spectrum LED device and LED equipment that provides better color rendering and spectral characteristics compared to conventional full-spectrum LEDs. The device uses multiple LED chip units with different peak wavelengths between 415nm and 470nm, each covering the blue range. They are electrically connected with balanced blue light energy distribution. Fluorescent glue with phosphor covers each chip. This balances blue light and improves spectral continuity and naturalness compared to just 1 blue LED.

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LED lamp design to improve color rendering by using a combination of white LEDs and purple LEDs. The purple LEDs emit in the UVA spectrum. The white LEDs provide the main light output while the purple LEDs fill in the UVA range. The combined light enhances color rendering compared to just white LEDs. Alternating white and purple LEDs allows overlap of the UVA range. The purple LEDs can be 400-420nm wavelength.

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A lighting device with high-color rendering using a combination of blue and purple LEDs. The device includes a substrate with blue and purple LEDs, enclosed in a phosphor-coated transparent housing. The blue and purple LEDs stimulate the phosphor to emit white light with enhanced color rendering. The combination of blue and purple light allows the emitted white light to partially overlap the UVA spectrum, significantly improving color rendering compared to devices with only blue LEDs.

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Wide color gamut LED packaging device, manufacturing method and backlight module to improve color quality of LED displays. The device uses quantum dot materials to convert blue light from the LED into pure green and red light. This provides narrower peak widths compared to conventional green phosphors, resulting in better color purity and wider color gamut when mixed with blue. The quantum dot LED packaging involves coating the quantum dots onto the blue LED chip. The backlight module uses this quantum dot LED instead of phosphors for green and red conversion.

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LED lighting source with improved white light extraction efficiency and color adjustment capability. The LED light source has three blue LED chips, one each with a yellow, red, and green phosphor coating. This configuration allows separate excitation of the phosphors without phosphor-phosphor light absorption. The blue, yellow, and green emissions combine to create white light. By varying the brightness of the blue, yellow, and green channels, the white light color temperature can be adjusted dynamically.

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LED full-spectrum color mixing using seven primary colors instead of the traditional RGB to achieve wider color gamut, better white light quality, and higher color rendering. The method involves using an RGBWCLA (red, green, blue, white, cyan, light) seven-color LED in each mixing module. The duty cycles of the seven colors are adjusted to mix target colors or white light. This allows covering a larger chromaticity area, wider correlated color temperature range, full-spectrum white light, and higher color rendering.

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LED artificial lighting device that allows adjustable color temperature while reducing size compared to using separate high and low CCT devices. The lighting device has an LED chipset, multiple blue chip groups with different color temperatures, barriers, and phosphor. The blue groups form separate color temperature areas. The main chipset and phosphor are on the substrate. The barriers isolate the blue groups. A control circuit drives the main chipset. The phosphor is in the barriers. This allows separately adjusting the blue groups for different CCTs without needing separate devices or a large integrated lamp.

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Multicolor LED packaging device and method that provides independent control of red, green, and white LEDs using blue LED chips and color conversion films. The device has an LED carrier with multiple LED light-emitting units, where at least one unit has a blue LED chip covered by a color conversion film. Bonding wires connect the LED units to carrier pads. This allows separate control of each unit. The conversion films convert blue light to red, green, or white using phosphors. A packaging adhesive covers the LEDs and conversion films, optimizing light mixing.

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Preparation method for multicolor LED lamp beads with consistent quality and adjustable light parameters. It involves spectroscopic separation of white LED beads to get standard beads with specific wavelength and voltage. Then, a control chip, standard bead, and color beads are soldered onto a monomer. Encapsulation covers the chips and beads. A feedback module calculates light parameter differences and adjusts the color chip to match. Fixing the standard bead between ground and lamp pins optimizes chromaticity. This allows precise white light control, consistency, and self-regulation.

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LED flat package light source with improved heat dissipation and color rendering for applications like high-end colored lighting. The LED flat package has a substrate with the LED chip attached. The chip is coated in phosphor powder, covered with a phosphor film, or a ceramic phosphor sheet. Additionally, a matching-shaped color chip is placed over the LED chip. This configuration provides better heat dissipation from the LED chip and enhances color rendering compared to just coating the LED chip.

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LED lighting device for stage lighting applications that provides high color rendering, wide color gamut, small size, and low temperature dependence. The device uses a unique LED chip arrangement and packaging technique. The LED chips are arranged in a pattern where red, green, and blue chips alternate with blue chips in between. The blue chips are surrounded by grooves, and red and green chips are filled into the grooves. This allows close chip packing without chip-to-chip color mixing. The filled grooves also contain phosphor for secondary color emission. The device has a central flat area for white chips. This configuration enables compact size, reduced color mixing, and improved color rendering compared to separate multi-chip devices.

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LED light source with adjustable color temperature that provides a wider range of color temperatures with better color rendering and uniformity compared to conventional RGB LED sources. The light source uses multiple color LED chips (blue, green, red) and excitable phosphor layers to cover the visible spectrum. By adjusting the current through each chip, the phosphor excitation spectrum can be optimized to match user needs and maintain the color coordinate within the Planck locus for improved CRI and LER. This allows customizable color temperature while avoiding issues like narrow gamut and poor uniformity seen in RGB sources.

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Full-spectrum LED light source that provides better color rendering compared to traditional full-spectrum LEDs. The light source uses a specific combination of blue LED chips with different peak wavelengths, along with phosphor-mixed packaging glue, to improve color rendering in the red and blue regions. The blue chips with wavelengths of 435-450nm, 450-460nm, and 460-475nm are connected in series or parallel in the LED module. This arrangement provides better color rendering in the red (R9) and blue (R12) regions compared to using only blue chips or adding phosphors externally.

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LED light source with adjustable color temperature display finger and packaging method thereof. The LED light source has multiple LED chips (blue, green, red) on a substrate with a dam around them. The chips excite fluorescent powder layers that are covered by the fluorescent powder layers. By adjusting the current to each chip, the excitation spectrum of the fluorescent powder can be controlled to optimize light color and improve color rendering index. The dam protects the chips and powder.

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