LED Heat Dissipation for Lighting Reliability

Two-part heatsink for LED modules that separates the thermal management function from the optical alignment function. The heatsink consists of an optical carrier portion with an LED mounting area and an alignment feature to align with an optical component. It also has a separate heat sink bulk portion that is coupled to the optical carrier portion. This allows the optical carrier to have a compact shape for precise LED placement and alignment, while the bulkier heat sink section can handle the bulk of the heat dissipation. It enables easier manufacturing, shipping, and fixture compatibility compared to integrated complex shaped heatsinks.

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Heat dissipation device for LED lighting fixtures that allows efficient cooling of the LEDs to extend their lifespan. The device has a heat transfer lamp panel with an array of second heat sinks around the outer wall. Each second heat sink has an internal air inlet slot and ventilation holes connected to bottom first heat sinks between the second sinks. This allows air to flow through the device and extract heat from the LEDs. The LED fixture is mounted on the bottom of the heat transfer panel. The panel has a through hole for wiring and a threaded hole to attach the fixture.

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A heat dissipation structure for LED lamps that improves cooling efficiency and longevity of high power LED lamps. The structure has a snap-fit heat dissipation mechanism that attaches to the top of the lamp body. The heat dissipation mechanism has a cylindrical heat sink with concentrically arranged fins, starting with circular fins at the top, followed by semiconductor fins and heat conduction fins towards the bottom. This multi-stage fin design provides progressive cooling for the LEDs as heat travels down the stack. The cylindrical shape allows for better airflow around the fins compared to flat fins. The bottom of the heat sink has fixed rods for mounting and temperature sensors for monitoring.

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An LED lamp design that allows high-power LEDs to be used without requiring external heat sinks. This is achieved by using a cylindrical transparent housing with the LEDs mounted on a flexible PCB rolled up inside. The PCB is coated with a thin transparent layer to protect the LEDs. The rolled PCB, LEDs, and driver components are all contained within the housing. This allows the LEDs to dissipate heat directly into the surrounding air through the transparent housing.

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Cooling high-power lighting systems like laser-based lighting, which require cooling for sustained operation, using a two-phase cooling device. The cooling device has a chamber with a tapering section that contacts the heat source like a luminescent body. The tapering section allows the chamber wall thickness to be reduced at the contact region. The thinner wall section at the hottest point reduces thermal resistance and enables localized cooling.

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Lighting apparatus with an integrated anion generator for air purification that has a non-powered ventilation structure to provide effective heat dissipation from the LED chips. The lighting apparatus includes an anion generator inside the housing, an open-ended cylindrical anion-emitting tube that protrudes from the housing, a discharge electrode inside the housing opposite the tube opening, an LED circuit board above the housing, and a cover that only partially encloses the tube. Air holes allow outside air into the tube when anions are emitted, creating airflow that also cools the LEDs. The anion generator and vented tube provide air circulation without fans to dissipate LED heat.

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LED lighting device with improved cooling and modular construction to simplify assembly. The device has a lamp cap, case, power supply, heat exchange unit, and light emission unit. A buckle allows connecting the case and heat exchanger without bolts. The light emission unit connects to the heat exchanger for efficient heat transfer.

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An LED lighting device that maximizes thermal coupling between the LED and heat sink to improve heat dissipation and reliability. The device has a recessed PCB that surrounds the LED module mounted on the heat sink. The PCB provides electrical control circuitry and the recess allows the LED to directly contact the heat sink.

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Modular, scalable, reduced-profile LED light fixture with elongated heat sinks and coupled light sources that couple to form long arrays. The heat sink modules are joined electromechanically via a coupler device that conveys power and data between the modules. The coupler also supports external devices like lights and fans. The modular design allows customizable arrays for various mounting heights without sacrificing light directionality.

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Integrated ceiling device containing multiple LED light sources with an effective heat dissipation system to maintain low junction temperature. The device has a mechanical arrangement for the LED lamps that conducts heat away from the lamps and other electronic components to prevent overheating. This improves LED efficiency and lifespan.

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LED cooling device with improved heat dissipation and faster warm-up time compared to conventional aluminum heat sinks. The device uses copper heat spreaders and a heat spreader bottom plate inside enclosed structural supports connected to the LED backside. Cooling fans are fixed to the inner sides of the supports. This configuration provides direct contact and forced air cooling for faster thermal transfer from the LED to the exterior.

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LED lamp bead assembly with improved heat dissipation at the connection end to extend lamp life. The assembly has a heat shield, heat dissipation assembly, and control terminal. The heat dissipation assembly surrounds the bottom of the heat shield and contains a semiconductor refrigeration plate, card slot, and power supply. This enclosed heat sink design captures and dissipates heat from the lamp connections. The heat shield has a protrusion with lamp beads to distribute heat. This prevents heat buildup and damage to the components.

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Heat pipe cooling device for high-power LED lamps that has better heat dissipation performance compared to conventional methods. The device uses a unique heat pipe design with an annular bottom section and multiple U-shaped top sections connected together. This allows equalized working fluid level in the annular section and improved circulation compared to conventional heat pipes. The heat pipe is used in high-power LED lamps to dissipate heat from the LED chips. The lamp also has a radiator, evaporation chamber, and support plate to connect the heat pipe sections. The U-shaped sections pass through the support plate and have fins for condensation. Multiple parallel sets of LED arrays are used to prevent single LED failure from causing lamp outage.

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LED superconducting module lamp with integrated cooling for high power applications to prevent lamp decay and improve longevity. The lamp has an enclosed cooling assembly attached to the lamp holder. The assembly consists of a mounting plate fixed to the holder and a frame attached to the plate. The plate has a hole to connect it to the holder. The enclosed cooling assembly allows higher power LED modules to be used without overheating or decay.

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Integrated heat dissipation structure for vehicle lamps that efficiently cools the LEDs to extend life and improve performance. The structure has a heat-conducting connector, metal deck, aluminum column, and radiator. The radiator has a heat-conducting cylinder with cooling fins, fan, and cover. The fan engages the cylinder bottom. A sensor detects abnormal temperatures and signals the fan to start cooling. Directly attaching the fan to the cylinder simplifies assembly. The integrated heat dissipation prevents excessive heat buildup in LED lamps.

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LED light source cooling device to improve heat dissipation compared to natural convection. The device has a casing with an internal heat-conducting layer. The heat-conducting layer has penetrating holes connecting groups. An LED light source attaches to the far side of the layer. A heat sink on the other side of the layer contacts the LED. The sink has a U-shaped bracket that rotates and has a fan attached. This actively forces air through the penetrating holes to extract heat from the LED and sink.

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Thermal management of an electronic apparatus such as an electronic lighting device, particularly to a multi-sided thermal management device for an electronic apparatus, and to an electronic apparatus incorporating a multi-sided thermal management device. The device comprises a multi-sided heat spreader element defining a longitudinal axis and comprising a longitudinally extending multi-sided wall and an internal space at least partly enclosed within the multi-sided wall, the multi-sided wall having an inner surface, an outer surface and longitudinally spaced first and second ends; a plurality of electronic components mounted to the outer surface of the wall of the heat spreader element; and a flow space for a cooling medium provided in the internal space of the heat spreader element.

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LED heat dissipation module and lighting fixture to improve heat dissipation and longevity of LED lamps. The module has a radiator with fins filled with a thermal conductive medium, and a fan to actively cool the fins. A temperature sensor detects the radiator temperature and controls the fan speed. This prevents junction temperature rise and prolongs LED life. The module is encapsulated in the lamp housing.

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LED lamp with improved heat dissipation using capillary core heat pipes to prevent overheating of high-power LED chips. The lamp has a heat pipe connected to the LED source, a temperature sensor, and a control unit. The heat pipe transfers heat from the LED to the outside. The temperature sensor measures ambient temperature. The control unit manages LED brightness, driver power, and displays temperature. It uses an embedded Linux OS, USB connection, and bipolar transistor temperature sensor.

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Passive heat dissipation system for vehicle lamps that uses a heat pipe embedded in a heat sink to remove heat from the LEDs without a fan. The LED is mounted directly to the heat pipe which is then inserted into the heat sink slot. Heat transfers from the LED to the heat sink via the pipe for passive cooling. This allows comparable heat removal to a fan-based system without active airflow.

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