Efficient Heat Management in LED Lighting Systems

An LED lamp design that allows high-power LEDs to be used without requiring external heat sinks. This is achieved by using a cylindrical transparent housing with the LEDs mounted on a flexible PCB rolled up inside. The PCB is coated with a thin transparent layer to protect the LEDs. The rolled PCB, LEDs, and driver components are all contained within the housing. This allows the LEDs to dissipate heat directly into the surrounding air through the transparent housing.

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Cooling high-power lighting systems like laser-based lighting, which require cooling for sustained operation, using a two-phase cooling device. The cooling device has a chamber with a tapering section that contacts the heat source like a luminescent body. The tapering section allows the chamber wall thickness to be reduced at the contact region. The thinner wall section at the hottest point reduces thermal resistance and enables localized cooling.

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Lighting apparatus with an integrated anion generator for air purification that has a non-powered ventilation structure to provide effective heat dissipation from the LED chips. The lighting apparatus includes an anion generator inside the housing, an open-ended cylindrical anion-emitting tube that protrudes from the housing, a discharge electrode inside the housing opposite the tube opening, an LED circuit board above the housing, and a cover that only partially encloses the tube. Air holes allow outside air into the tube when anions are emitted, creating airflow that also cools the LEDs. The anion generator and vented tube provide air circulation without fans to dissipate LED heat.

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LED lighting device with improved cooling and modular construction to simplify assembly. The device has a lamp cap, case, power supply, heat exchange unit, and light emission unit. A buckle allows connecting the case and heat exchanger without bolts. The light emission unit connects to the heat exchanger for efficient heat transfer.

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An LED lighting device that maximizes thermal coupling between the LED and heat sink to improve heat dissipation and reliability. The device has a recessed PCB that surrounds the LED module mounted on the heat sink. The PCB provides electrical control circuitry and the recess allows the LED to directly contact the heat sink.

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Modular, scalable, reduced-profile LED light fixture with elongated heat sinks and coupled light sources that couple to form long arrays. The heat sink modules are joined electromechanically via a coupler device that conveys power and data between the modules. The coupler also supports external devices like lights and fans. The modular design allows customizable arrays for various mounting heights without sacrificing light directionality.

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Integrated ceiling device containing multiple LED light sources with an effective heat dissipation system to maintain low junction temperature. The device has a mechanical arrangement for the LED lamps that conducts heat away from the lamps and other electronic components to prevent overheating. This improves LED efficiency and lifespan.

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High-power density solid-state lighting modules can produce focused, intense light output for applications like curing polymers, sterilization, cleaning, and material ablation. The lighting module uses dense arrays of solid-state light-emitting diodes (LEDs) on a thermally conductive substrate. The LEDs can be driven at high power to achieve the required power densities. The module allows solid-state lighting to replace high-intensity arc lamps for applications requiring high power density irradiation.

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A lighting fixture design that efficiently dissipates heat from the light source towards the front of the fixture to prevent damage due to overheating. The fixture has a thermally conductive mounting structure shaped like a heat-spreading cup. The light source is mounted inside the cup with the heat generated by the light being transferred radially along the cup's bottom and then forward towards the rim. This prevents heat from building up at the rear where it can damage the fixture or surrounding cavity. The fixture may also have a lens assembly that covers the front opening of the cup.

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A light-emitting device with improved heat dissipation and pressure resistance to prevent damage to the sealing resin and internal components. The light-emitting device includes higher thermal conductivity heat transfer members embedded among the light-emitting elements within the sealing resin. These heat transfer members help dissipate heat from the light-emitting elements more effectively, preventing decreased emission intensity. The device also includes deformation prevention members on the substrate around the sealing resin to limit the depth of dents when pressure is applied to the resin. This prevents damage to the internal components and wires from finger or tool pressure during handling or installation.

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A light source module with improved heat dissipation and fabrication efficiency without resorting to expensive materials. The module has a heat sink with an insulating layer to protect against electrical shock. An electrically conductive layer is embedded in the insulation to provide current to the light source. The conductive layer also has a heat dissipation portion to extract heat.

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An LED lighting fixture that uses a heat spreading cup to dissipate heat from the LED and electronics towards the front of the fixture. The fixture has a lens assembly that extends inside the mounting structure and covers the opening. The heat spreading cup is thermally coupled to the LED and has a shape that directs heat towards the front. This prevents heat buildup in the cavity where the fixture is mounted, avoiding damage.

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Heat dissipation device for LED vehicle headlights that provides effective cooling with flexible fins for better fitting within the limited space of a headlight assembly. The device has a base, vertically stacked heat conducting fins radiating outward, and an LED module coupled with the base. The fins are made of flexible aluminum to be bent and distorted to fit into the headlight housing.

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Heat dissipation device for an LED lamp with flexible fins to fit into confined spaces for applications like vehicle headlights. The device has a base, an LED module, and vertically stacked heat conducting fins that radiate outward. The fins are made of flexible aluminum that can be bent to fit in tight spaces. This allows better heat dissipation compared to rigid heat sinks.

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Flexible heat dissipation device for LED vehicle headlights that can fit into the confined headlight assembly and effectively dissipate heat. The device has a base, vertically stacked flexible aluminum fins radiating outward, an LED module, and a wiring loom. The flexible fins can be bent to fit into the headlight housing. The fins conduct heat away from the LED and increase the dissipation area.

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LED module with customized connection of series parallel circuits to achieve uniform thermal loading of LEDs for optimum heat dissipation and reliability. The number of LEDs in the parallel circuits is varied based on their position on the circuit board. Fewer LEDs are connected in parallel in the central region compared to the edge regions. This reduces the current and heat in the center where cooling is poorer.

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Lighting device with improved heat dissipation to protect LEDs and maintain stable output. The device has a heat sink made of materials like sintered silicon carbide that can withstand high temperatures and conduct heat away from the LEDs. This prevents over-heating and color shifting that degrades LED performance. The heat sink can have sections of different materials to optimize heat transfer.

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An LED module that improves luminous efficiency and reliability. The module contains an LED chip, lens group, circuit board, and heat sink. An encapsulant with a refractive index between the LED chip and lens is injected to fill the space around the chip. This prevents total internal reflection of light and improves efficiency. The encapsulant also seals the module against moisture ingress.

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A lighting device for efficiently emitting light from an LED light source while protecting the eyes of users. The device uses a specific configuration of heat sink, light source, reflector, and reflective sheet to optimize light output and distribution.

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Flexible circuit board assembly for an LED lamp to improve heat dissipation, maintain shape, and enable efficient production. The assembly uses a strip-shaped resin layer as a substrate. On the upper surface, a signal line layer made of copper or aluminum is patterned for electrical connections. On the lower surface, a thicker heat dissipation layer made of the same metal is added to dissipate LED heat.

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