Improving Micro-LED Chip Transfer in Display Production

This patent describes a structure and method for transferring LED chips without damaging them. The structure includes two adhesive layers between the substrate and the LED chips. The bottom layer is a pyrolysis adhesive and is thicker than the height of the LED electrodes. The top layer is a photolysis adhesive. During the transfer process, laser irradiation is used to degrade the top layer and release the chip. The thicker bottom layer helps protect the electrodes from any damage. After the chip is released, it can be transferred to a display backplane. This structure and method are an effective way to protect LED chips during the transfer process.

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This patent describes a method of efficiently manufacturing a large micro-LED display. The method involves four steps: fluidic self-assembly (FSA), interposer alignment, solvent injection, and laser transfer. In the first step, micro LEDs are transferred to an interposer using FSA. Then, the interposer is aligned with the display substrate. A solvent is injected between them to separate the LEDs from the interposer. Finally, the LEDs are transferred to the display by vaporizing the solvent with a laser. This method is efficient and cost-effective, making it a great choice for large-scale micro-LED display production.

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This patent describes a method for transferring microLEDs used in displays like TVs. The transfer is done using a custom adapter plate with a bonding adhesive layer. The adhesive layer is made of silicone or acrylic and has a specific thickness and porosity. The adhesive's force is designed to increase when cooled and decrease when heated. This allows adjusting the LED retention force by controlling the adapter's temperature during transfer. This temperature control helps to maintain the optimal force required to transfer the microLEDs without damaging them. The adhesive layer also helps to keep the microLEDs in place, even when the adapter plate is subjected to mechanical vibrations or other external forces. This ensures that the microLEDs are properly transferred and secured in the display.

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This patent describes a more efficient method for transferring micro-LEDs to display backplanes than conventional pick-and-place methods. The micro-LEDs are first bonded to a carrier using a special bonding layer that can be released when exposed to actinic light. The micro-LEDs are then secured to the display backplane carrier. When the bonding layer is exposed to actinic light, it releases the micro-LEDs from the first carrier, allowing them to remain on the display backplane. This light-based debonding eliminates the need for mechanical separation. It also allows for the transfer of micro-LEDs as complete arrays in one step, instead of individually. The light-based debonding can be done with scanners or projectors that move the actinic light over the carrier.

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This patent describes a method for quickly and accurately transferring micro LED chips to a circuit board. The method involves attaching the chips to a carrier substrate with adhesive. Then, the chips are positioned above the circuit board. A laser is used to heat and deform the adhesive underneath each chip. This causes the chips to detach from the carrier and fall onto adhesive on the circuit board. This process is much faster than traditional methods and can be used to quickly and accurately transfer large numbers of chips. The laser is irradiated through the carrier substrate and a light-to-heat conversion layer to ensure that the chips are heated and deformed properly. This method can be used to quickly and accurately transfer large numbers of micro LED chips to a circuit board.

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This patent describes a method for accurately transferring micro-LEDs to substrates. The method uses electric fields to guide the LEDs into the right position. The substrate is first prepared by creating a trench-like "micro-LED receiving area" around it. This area is then surrounded by insulation. When a fluid containing micro-LEDs is applied to the substrate, the electric field between the underlying electrodes helps guide the LEDs into the trenches. After this, the insulation is partially removed to electrically connect the LEDs to the electrodes. This method is accurate and efficient, allowing for easy and accurate positioning of the LEDs.

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This patent describes a system for transferring micro LEDs to a substrate. This system overcomes the problems of existing methods. It uses a transfer head to grip the micro LED and a chuck below the substrate to attract the LED onto the substrate. The transfer head releases its grip when the LED is placed on the substrate, avoiding any tilting of the LED. The chuck can be an electrostatic or magnetic chuck. This system ensures that the micro LED is accurately placed on the substrate, without any tilting or misalignment.

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This patent describes a micro-LED position error correction carrier. It is designed to transfer micro-LEDs to a substrate with improved alignment accuracy. The carrier has loading recesses with inclined bottoms. These bottoms are designed to capture the micro-LEDs and correct any position errors before the transfer. This helps to ensure that the micro-LEDs are transferred with greater accuracy and precision.

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This patent describes a method for transferring micro LEDs from a source substrate to a target substrate. This method is efficient and reliable, and is especially useful for displays. The process begins by applying an electrical potential to the bonding contacts on the target substrate. This potential polarizes the micro LEDs, creating an attractive force between the polarized LEDs and the charged bonding contacts. This attractive force helps to align the LEDs accurately with the contacts. This alignment is important, as it enables precise and efficient transfer of large numbers of micro LEDs to the target substrate. This method is useful for display applications, as it enables the accurate and reliable transfer of micro LEDs to the target substrate.

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A method for making micro LED display panels with precise placement of micro LEDs. This method enables efficient transfer of micro LEDs to thin-film transistor (TFT) substrates. The method involves using UV light or heat to deactivate the adhesive layer between the micro LED and carrier substrate before transfer. This allows the micro LED to separate from the carrier and adhere to the TFT substrate without any adhesive in between. This eliminates any mismatch due to adhesive height and allows direct contact between micro LED electrode and TFT substrate for improved electrical connection. The use of UV light or heat to deactivate the adhesive layer ensures that the micro LED is placed accurately on the TFT substrate, which results in a better display panel.

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This patent outlines a method for transferring micro-LED chips from a wafer to a substrate. This method, called laser lift-off, reduces waste and increases efficiency. It starts by analyzing the LED usage in each block of the wafer. This helps to determine an optimized mask size and transfer area. This optimization minimizes the number of scrap blocks. As a result, more of the micro-LED chips on the wafer can be transferred and used instead of being wasted. This increases the efficiency of the process and reduces the amount of waste generated.

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This patent describes a method for transferring micro-LED arrays to improve the yield and quality of micro-LED displays. The method involves bonding the micro-LED array onto a receiving substrate using micro-bumps. An underfill is then applied between the two substrates. This underfill helps to improve the bonding strength during the transfer. The final step is to use laser irradiation to lift-off the micro-LED array from the first substrate. This method is designed to improve the yield and quality of micro-LED displays, making them more reliable and cost-effective.

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This patent describes a method for transferring micro-LEDs without damaging the receiving substrate circuitry. During the transfer process, a laser is used to lift-off the micro-LEDs from the carrier substrate. However, the laser can cause damage to the receiving substrate circuitry if it is not shielded. To prevent this, the method described in this patent involves the use of a laser-transparent carrier substrate and a protective layer. The protective layer is applied to the receiving substrate surface and/or the carrier substrate opposite the micro-LEDs. This layer shields the receiving substrate circuitry from the laser, thus preventing any potential damage. This method ensures that the micro-LEDs can be transferred without damaging the receiving substrate circuitry.

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This patent describes a method for transferring micro-LEDs from a donor substrate to a display backplane. This method uses light-based debonding to facilitate the transfer. The micro-LEDs are first bonded to the donor substrate using a releasable bonding layer. When this bonding layer is exposed to actinic light, it releases and the micro-LEDs are transferred to the display backplane. This allows for selective transfer of individual micro-LEDs from the donor substrate to the display backplane. This method is advantageous as it eliminates the need for manual handling of the micro-LEDs, thus reducing the risk of damage to the micro-LEDs. Furthermore, it is a faster and more efficient method of transferring micro-LEDs.

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A method for transferring micro-LEDs without damaging the circuitry. The traditional method of laser lift-off has a limitation: it can damage the circuitry during the transfer process. This patent describes a new method to overcome this limitation. It involves the use of a transparent carrier substrate to protect the circuitry. Additionally, a protection layer (mask/conductive blanket) is applied on the carrier and receiving substrates. This layer shields the circuitry from the laser during the lift-off process, preventing any damage.

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This patent describes a cost-effective and efficient method for manufacturing microLED displays. MicroLED displays are typically made by transferring individual LED chips from a growth substrate to a display backplane. This process is expensive and complex. The method described in this patent is simpler and more cost-effective. It involves growing an LED crystal film on a substrate, then bonding it to a display backplane with driving circuitry and through holes aligned to the LEDs. The substrate is then peeled off to separate the LEDs from the growth substrate and complete the display. This process is more cost-effective and time-efficient than the traditional mass transfer method.

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A micro LED display substrate that improves the yield of micro LEDs during transfer. The substrate is designed to reduce the damage to the LEDs during transfer. It has a patterned bonding layer with a thicker central region and a thinner peripheral region. This helps in providing a more uniform height to the LEDs when they are bonded to the layer. This uniform height helps in avoiding overpressure on the peripheral LEDs. The patterned layer thickness also helps in reducing warping compared to a uniform thickness. The substrate may also have a patterned surface trench depth with a shallower peripheral region. This helps in further reducing the damage to the LEDs during transfer.

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A method and transfer head for transferring micro-LEDs without heating up all the LEDs on the substrate. This allows good/bad LED sorting during transfers. The method uses a specialized transfer head with pickup units that can apply current to individual micro-LEDs. By applying current, only the micro-LED to which the current is applied is heated up. This helps to avoid thermal damage to the other micro-LEDs, allowing selective transfer of good micro-LEDs. The transfer head is also designed to provide a precise, repeatable, and low-cost transfer process. This helps to reduce the cost of the overall transfer process.

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This patent describes a method for producing micro-LED displays. It is a transfer printing process that allows efficient and high yield production of micro-LED modules. The process involves transferring and bonding micro-LED chips from a retaining film to a substrate. This is done while the solders are heated. To ensure the chips and solders remain in place during the transfer and bonding process, a planar carrier member is used to hold the chips. This member suppresses the thermal expansion of the substrate, preventing any dislocation of the chips and solders.

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This patent describes a method for mass producing micro-LED displays. The method involves using a transfer plate and micro-LED grains. The transfer plate has several recesses and metal bonding pads. The micro-LED grains also have metal bonding pads. Solder is formed on the bonding pads of both the transfer plate and the micro-LEDs. The transfer plate and micro-LEDs are then placed in a solvent-filled chamber and vibrated. This causes the micro-LEDs to fall into the recesses and bond via the solder. The chamber is then cooled to solidify the solder and create a micro-LED substrate. This method is a cost-effective way to mass produce micro-LED displays.

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A method for transferring micro-LEDs to a display substrate. This method involves using a liquid suspension medium with a density similar to that of the micro-LEDs. This allows the LEDs to float on the liquid, preventing them from adhering to the substrate. A positioning substrate with holes of the same size as the LEDs is then placed over the suspension. This traps the floating LEDs in the holes. The substrate is then vibrated to align the LEDs with the holes. The LEDs that enter the holes are partially exposed on the substrate side. Finally, the positioned LEDs are transferred to the display substrate.

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This patent describes a method for manufacturing micro-LED displays with high yield and efficiency. The method involves bonding the micro-LEDs to a driving circuit substrate. To ensure precise alignment, the patent describes the use of circular grooves and electrode structures. The grooves and electrodes are placed on the two substrates respectively. The grooves and electrodes help align the micro-LEDs for bonding. This allows multiple LEDs to be bonded simultaneously, rather than having to individually pick and place them. This method helps reduce the time and cost of manufacturing micro-LED displays.

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This patent describes a method and device for transferring micro LEDs from a base substrate to a final array substrate. The traditional method of transferring micro LEDs requires the use of patterned molds, which can be time-consuming and expensive. This patent proposes a new transfer method that eliminates the need for molds. The method involves a series of steps. First, temporary substrates are bonded to the LED surfaces. Then, the base substrate is peeled off. An intermediate substrate is then bonded and stretched to achieve the desired LED spacing. Finally, a transfer substrate is bonded and the temporary substrates are peeled off, leaving the LEDs on the array substrate. The stretching of the intermediate substrate allows for customization of LED spacing without needing different transfer heads for each configuration. This makes the transfer process faster and more cost-effective.

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This patent describes a method of creating a display panel with a redundancy scheme. It involves transferring an array of micro LED device pairs from one or more carrier substrates to the bottom electrodes of subpixels on a display substrate. The surface of the display substrate is then inspected for irregularities. These irregularities are then insulated with a passivation layer. Finally, one or more top electrode layers are formed in electrical contact with the array of micro LED device pairs. This redundancy scheme helps to ensure that the display panel is robust and reliable.

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A fabrication method for Micro LED display panels that simplifies the transfer and bonding of LED chips. This method makes it possible to produce large scale Micro LED displays. It is an improvement over conventional methods, which are time-consuming and difficult to scale. The method involves using an adhesive layer on the display substrate. This adhesive layer helps retain the LED chip array in place after transfer. This makes it possible to selectively remove unwanted LED chips, while leaving the desired ones aligned with the pixel grid. The remaining LED chips are then connected to the display circuitry. This simplifies the process of producing Micro LED displays, allowing for larger scale production.

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This patent describes a system for transferring micro-LED devices between substrates without physical contact. The system is based on the use of hot air. It includes a hot air blowing head which is used to heat the adhesive that holds the micro-LED to the first substrate. The heat causes the adhesive to release the micro-LED. The micro-LED is then vacuum-suctioned and transferred to the second substrate. This system eliminates the need for physical contact between the micro-LED and the substrates, which can cause damage to the micro-LED.

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This patent describes a method of constructing a micro-LED display module using transfer printing. The method involves transferring micro-LED chips from a carrier film to a mount substrate. Solder is applied between the chips and substrate. Then, the chips and solder are heated simultaneously to bond the chips to the substrate. The planar carrier member is an important component of this process. It prevents thermal expansion of the substrate during heating from dislocating the chips. This ensures that the chips remain in place and the module is properly constructed.

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This patent describes a method for fabricating micro LED displays. It uses a process of transferring entire RGB pixels from source wafers to target display substrates. This is done using a bonding equipment. The process starts by bonding a carrier plate to the pixel array. This carrier plate is then aligned and bonded to the target substrate using compression bonding. Once the pixel array is transferred, the carrier plate is detached and aligned to a new target to transfer the remaining pixels. This method of transferring complete RGB pixels as whole units instead of individual LEDs makes the fabrication process more efficient and cost-effective.

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This patent describes a transfer head and system for transferring MicroLEDs. The transfer head is designed to improve the efficiency of the transfer process. It consists of a grip surface and a support that protrudes beyond the surface. This support contacts the substrate and prevents shaking during the transfer process. This helps to ensure that the MicroLEDs are accurately transferred and prevents them from being damaged. The transfer head also has an adjustable grip surface that can be adjusted to accommodate different substrate sizes. This makes it easier to transfer MicroLEDs of different sizes and shapes.

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A mass transfer method for assembling millions of micro-LEDs onto display backplanes. This method is fast, precise, and damage-free. It involves using a temperature-controlled adhesive layer. The adhesive layer is heated to a temperature that reduces its adhesive strength. This allows the LED dies to slide into proper alignment. Then the adhesive is cooled to regain its strength, fixing the aligned LED array onto the target substrate. This enables precise mounting of large numbers of LED dies in a short time. The temperature-controlled adhesive layer is key to this method. By heating it to reduce its adhesive strength, the LED dies can be moved into the desired position. Then, when the adhesive is cooled, it regains its strength and securely holds the LED dies in place. This makes it possible to assemble millions of micro-LEDs in a short time, without damaging the dies.

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This patent describes a method for transferring micro-LEDs of different colors to a receiving substrate in one pass. It involves growing micro-LEDs of blue, green and red on a single GaAs original substrate. The micro-LEDs are then connected to metal electrodes. The metal electrodes are then bonded to bumping electrodes on the receiving substrate. After the transfer is complete, the GaAs original substrate is removed. This method allows for the transfer of micro-LEDs of different colors in one pass, by growing them on the same substrate. This reduces the time and cost associated with transferring multiple colors of micro-LEDs.

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This patent describes a transfer head designed to pick up and transfer micro LEDs during the manufacturing of micro LED displays. The transfer head helps to reduce damage and improve transfer efficiency. It consists of three main components: a grip member, a support member, and a communication member. The grip member is designed to hold the micro LED. The support member surrounds the grip and helps to stabilize it. The communication member connects the support regions and equalizes the vacuum pressure in the grip area. This equalizes the grip force across the micro LED, thus preventing damage.

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This patent describes a method and apparatus for accurately transferring tiny LEDs from a growth substrate to a target display substrate. The method is used in display manufacturing and is designed to ensure precise alignment of the LEDs. It involves the use of an array of transfer heads to pick up the LEDs and an array mask with alignment holes. The LEDs on the transfer heads are aligned with the holes, inserted through, and placed onto bonding contacts on the target substrate. The apparatus is designed to enable simultaneous transfer of large numbers of LEDs with precision. This eliminates the need for manual alignment, saving time and money.

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This patent describes a method for transferring micro LEDs to an LED display. The method uses an inkjet head to accurately transfer the micro LEDs to each pixel region of the display. The micro LEDs are sprayed onto the panel, and the inkjet head helps to quickly and accurately place them into each sub-pixel. This method is highly accurate and efficient, and it helps to ensure that the micro LEDs are properly placed in the display.

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This patent discloses a method for transferring a micro-LED array from one substrate to another. The method uses conductive resist to bond the LED array to the receiving substrate. The resist is patterned on the receiving substrate to cover the electrodes. This provides a strong bond that prevents damage during lift-off. The conductive resist also enables a low temperature transfer, which is beneficial for the LED array. After the LED array is bonded to the receiving substrate, laser irradiation is used to lift-off the LED array from its original substrate. This method is advantageous because it is a low-temperature process that also provides a strong bond to prevent damage during lift-off.

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This patent describes a method for transferring micro-LEDs using vacuum adsorption. This method allows for precise and selective detachment of the micro-LEDs from the mother substrate and targeted attachment to different substrates. The process begins by contacting the vacuum module's holes with the micro-LED arrays of a single color. This creates a vacuum force that detaches the LEDs from the mother substrate. The detached LEDs are then aligned and transferred to a target substrate coated with a deformable transfer material. This material is then deformed with external force, resulting in physical bonding and electrical connection between the micro-LEDs and the target substrate.

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A transfer head for precisely transferring micro LEDs to a substrate without damaging them. This transfer head is specially designed to minimize the risk of misalignment when heated. It consists of two parts: a holding part and a support part. The holding part is made of deformable materials that can grip the LEDs firmly. The support part is made of low thermal expansion material. This material helps to prevent misalignment when the head is heated during the transfer process. The combination of these two parts ensures that the micro LEDs are transferred to the substrate without any damage.

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This patent describes a transfer head for transferring micro-LEDs from one substrate to another. The head uses vacuum suction to pick up and release the micro-LEDs. The suction is created by a porous member, which has pores that create and release a vacuum pressure. This method of transfer is more efficient and damage-free compared to other methods like electrostatic or adhesive-based heads. The vacuum suction allows for precise and damage-free transfer of the micro-LEDs, resulting in a higher yield and better quality.

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This patent describes a device that prevents defects when mounting micro LEDs onto a substrate. During the transfer process, it is important to ensure that the LEDs are aligned properly. If the alignment is off, it can lead to defects. This device helps to reduce such defects. It uses larger contact holes to expose the LEDs. This allows for more tolerance in the alignment during transfer. The device consists of a micro LED with a protective film and an insulating layer. The protective film has a first contact hole, while the insulating layer has a second contact hole. The first hole is larger than the second hole. This helps to ensure that the alignment is correct and that the transfer is successful.

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A transfer head for high precision transfer of micro LEDs from one substrate to another. This transfer head uses vacuum suction to grip the micro LEDs. It does this by using vertical holes in a layered grip member. The layered grip member has a multi-layer structure. This structure allows for precise one-to-one correspondence between the suction holes and the micro LEDs. This makes it possible to grip and transfer the micro LEDs without damaging them. Additionally, the layered grip member prevents rigidity loss from the suction holes. This makes the transfer head more reliable and efficient.

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This patent describes a device that can manufacture micro-LEDs. It consists of two stages: a wafer stage and a substrate stage. The wafer stage is where the LED wafer is placed. It is connected to the substrate stage via a driving member. The substrate stage is connected to a lower base. This allows both stages to move together or just the wafer stage. This is important because it helps to minimize the gap change between the two stages. This is critical for the successful transfer of the micro-LED chips to the glass substrate.

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A method for efficiently and accurately transferring micro-LEDs to a target substrate. This method uses a two-step laser process. In the first step, a laser is used to separate and release the LEDs from a relay substrate. In the second step, a second laser is used to bond the released LEDs to the target substrate. This method is more efficient and accurate than traditional methods. It also has the potential to reduce the cost of production.

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A transfer device for mass-producing micro-LED displays. This transfer device is designed to pick up and stack micro-LEDs from different substrates with varying spacing. It consists of a tube with an open end and a closed end. At the closed end, there is a driving mechanism that moves to pick up the micro-LEDs from the open end. The tube can store multiple micro-LEDs and detach them to release them onto a target substrate. This device is designed to work at high speeds, allowing for mass production of micro-LED displays.

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This patent describes a method to improve the yield of micro-LED during display manufacturing. It also ensures that the electrical connection to the mirror layers is maintained. The method involves a series of steps. First, a mirror layer is deposited on a substrate. This is followed by the deposition of a sacrificial layer. The micro-LEDs are then transferred onto the sacrificial layer. Finally, the sacrificial layer is removed, leaving the micro-LED on the mirror layer. This method allows for a high yield of micro-LEDs to be transferred, while also preserving the electrical connection to the mirror layer.

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A micro-LED grip and inspection system that facilitates the safe transfer and testing of micro-LEDs for display manufacturing. The system consists of a grip body with a porous member and a conductive layer. The porous member enables the vacuum suction transfer of micro-LEDs between substrates without causing any damage. The conductive layer, on the other hand, provides electrical contact for inspection. The layer can be patterned to ensure that the pores are not blocked. The inspection device contacts the conductive layer to test the LED. This ensures that the micro-LEDs are safe and of good quality.

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