Efficient Mass Transfer in Micro-LED Display Manufacturing

(Summary) This patent describes a device that can manufacture micro-LEDs. It consists of two stages: a wafer stage and a substrate stage. The wafer stage is where the LED wafer is placed. It is connected to the substrate stage via a driving member. The substrate stage is connected to a lower base. This allows both stages to move together or just the wafer stage. This is important because it helps to minimize the gap change between the two stages. This is critical for the successful transfer of the micro-LED chips to the glass substrate.

(Summary) A method for transferring micro LEDs to a display substrate. This method involves using a liquid suspension medium with a density similar to that of the micro LEDs. This allows the LEDs to float on the liquid, preventing them from adhering to the substrate. A positioning substrate with holes of the same size as the LEDs is then placed over the suspension. This traps the floating LEDs in the holes. The substrate is then vibrated to align the LEDs with the holes. The LEDs that enter the holes are partially exposed on the substrate side. Finally, the positioned LEDs are transferred to the display substrate.

(Summary) A method for efficiently and accurately transferring micro LEDs to a target substrate. This method uses a two-step laser process. In the first step, a laser is used to separate and release the LEDs from a relay substrate. In the second step, a second laser is used to bond the released LEDs to the target substrate. This method is more efficient and accurate than traditional methods. It also has the potential to reduce the cost of production.

(Summary) This patent outlines a method for transferring micro-LED chips from a wafer to a substrate. This method, called laser lift-off, reduces waste and increases efficiency. It starts by analyzing the LED usage in each block of the wafer. This helps to determine an optimized mask size and transfer area. This optimization minimizes the number of scrap blocks. As a result, more of the micro-LED chips on the wafer can be transferred and used instead of being wasted. This increases the efficiency of the process and reduces the amount of waste generated.

(Summary) A transfer device for mass-producing micro LED displays. This transfer device is designed to pick up and stack micro LEDs from different substrates with varying spacing. It consists of a tube with an open end and a closed end. At the closed end, there is a driving mechanism that moves to pick up the micro LEDs from the open end. The tube can store multiple micro LEDs and detach for releasing them onto a target substrate. This device is designed to work at high speeds, allowing for mass production of micro LED displays.

(Summary) This patent describes a method to improve the yield of microLEDs during display manufacturing. It also ensures that the electrical connection to the mirror layers is maintained. The method involves a series of steps. First, a mirror layer is deposited on a substrate. This is followed by the deposition of a sacrificial layer. The microLEDs are then transferred onto the sacrificial layer. Finally, the sacrificial layer is removed, leaving the microLEDs on the mirror layer. This method allows for a high yield of microLEDs to be transferred, while also preserving the electrical connection to the mirror layer.

(Summary) This patent describes a structure and method for transferring LED chips without damaging them. The structure includes two adhesive layers between the substrate and the LED chips. The bottom layer is a pyrolysis adhesive and is thicker than the height of the LED electrodes. The top layer is a photolysis adhesive. During the transfer process, laser irradiation is used to degrade the top layer and release the chip. The thicker bottom layer helps protect the electrodes from any damage. After the chip is released, it can be transferred to a display backplane. This structure and method are an effective way to protect LED chips during the transfer process.

(Summary) This patent describes a system for transferring micro LED devices between substrates without physical contact. The system is based on the use of hot air. It includes a hot air blowing head which is used to heat the adhesive that holds the micro LED to the first substrate. The heat causes the adhesive to release the micro LED. The micro LED is then vacuum suctioned and transferred to the second substrate. This system eliminates the need for physical contact between the micro LED and the substrates, which can cause damage to the micro LED.

(Summary) A micro-LED grip and inspection system that facilitates the safe transfer and testing of micro-LEDs for display manufacturing. The system consists of a grip body with a porous member and a conductive layer. The porous member enables the vacuum suction transfer of micro-LEDs between substrates without causing any damage. The conductive layer, on the other hand, provides electrical contact for inspection. The layer can be patterned to ensure that the pores are not blocked. The inspection device contacts the conductive layer to test the LED. This ensures that the micro-LEDs are safe and of good quality.

(Summary) A micro LED display device with reduced transfer defects. This device consists of a substrate, a plurality of micro LEDs, a protective film, an insulating layer, and a connection electrode. The protective film and the insulating layer both have contact holes that expose the LED surface. The connection electrode transmits signals to the LED through these contact holes. The key feature of this device is that the contact hole in the protective film is larger than the contact hole in the insulating layer. This prevents misalignment of the LED positions and short circuiting of the electrode to the LED during transfer. This ensures that the device works properly and prevents any transfer defects.