Increase Durability of Micro-LEDs

LED display and electronic equipment with improved heat dissipation for micro LED devices. The heat dissipation is achieved by surrounding the LED chips with a heat sink and introducing an inert gas into the airflow channels. The heat sink absorbs and conducts heat away from the LED chips. The inert gas fill in the airflow channels acts as an insulator to prevent heat transfer between adjacent LED chips. This prevents accumulation of heat on the display backplane and improves display performance and chip lifetime.

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Micro LED display module with improved heat dissipation and reduced light reflection. The module has an external light absorbing sheet over the micro LED chips. The sheet has arrays of heat dissipation holes connecting the centers of four holes. This allows heat generated by the LEDs to dissipate to the outside. It also exposes areas of the adhesive layer beneath the holes for heat transfer. This prevents trapped heat and delamination issues. The holes also reduce internal reflections by allowing light to escape.

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MicroLED display with improved heat dissipation by mounting the circuit board on the heat sink and filling the hollow area between them with thermal adhesive. This directly attaches the microLED chip to the heat sink with the adhesive surrounding it for better heat transfer.

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LED display device with improved heat dissipation to extend display life. The device uses thermally conductive connectors between the PCB and a separate heat sink enclosure. This allows direct contact and heat transfer between the PCB and enclosure, preventing heat buildup on the PCB and LEDs. The connectors quickly dissipate the LED heat to the enclosure. This avoids heat accumulation that ages the display.

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LED array display substrate with improved heat dissipation and safety compared to conventional LED displays. The substrate has a sealed LED assembly with cooling, protection, and an anti-seepage mechanism. A cooling pipe with pump extracts heat from the LEDs through a sealed gap between silicone sleeves and plates. This prevents coolant leakage into the display. The silicone protection isolates the LEDs from external seepage. The sealed LED assembly with internal cooling improves heat dissipation efficiency and longevity by absorbing heat from the LEDs.

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Micro-LED display panel with redundancy to improve yield and reliability. The display has micro-LEDs arranged in sub-pixels on a driving substrate, with some sub-pixels containing two series-connected micro-LEDs of the same color. In normal sub-pixels, both LEDs emit light, but if one LED fails, only the working LED emits light. Redundancy positions allow extra LEDs to parallel connect if both originals fail. This compensates for failed LEDs and maintains full sub-pixel brightness. The redundancy prevents single LED failures from affecting display quality.

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Micro LED display device with improved stability and electrical performance by optimizing the mesa structure of the micro LED chips. The micro LED device has a mesa structure with multiple bosses, each boss having multiple light-emitting units. This controls the number of bosses and units to avoid excessive side area leading to instability, and excessive boss area causing high leakage current. It improves micro LED device stability and electrical performance compared to having a single boss per unit or large boss areas.

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Micro-LED design with a current guiding structure to improve efficiency and lifespan. The micro-LED has a current guiding element in the center of the LED stack that directs the current flow away from the sidewalls. This prevents current from flowing through the defect-prone sidewall region, which can reduce efficiency. The current guiding part forces the current to spread out through the center of the LED before reaching the sidewalls. This avoids non-radiative recombination and damage that can occur on the sidewalls.

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MicroLED display device with bonding support layers between the electrode pads to prevent shorts, misalignment, and cracking during bonding and curing. The bonding support layers are placed between the substrate pads and the microLED electrodes. They prevent pad contact causing shorts, provide support to prevent microLED cracking, and serve as alignment references during transfer. The layers have varying optical densities between upper and lower portions, with lower density lower portions. This prevents light leakage.

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Display module with improved heat dissipation to prevent damage from excessive heat during operation. The module has a heat sink in the array layer next to the LEDs. This sink absorbs the LED heat and spreads it away from the LEDs to prevent localized hotspots. Additionally, a separate heat sink on the other side of the module dissipates the absorbed heat further. The heat sinks have larger areas on the sides away from the LEDs to maximize heat transfer. This allows the module to operate at higher brightness without failure due to heat buildup.

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Display substrate, display module, and display device design to improve heat dissipation in high-density micro LED displays. The display substrate has a base substrate with micro LED chips attached to the backside. This allows direct heat transfer from the LEDs to the substrate, preventing heat accumulation between closely packed LEDs. The LEDs emit light through the substrate. A display panel can be added on the light-emitting side of the substrate. This substrate design reduces micro LED heat buildup, improves LED reliability, and enables high-density micro LED displays with better heat dissipation.

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Micro-LED packaging structure to improve heat dissipation and reliability. The packaging has a sealed encapsulation around the wire connections between the micro-LED chip, lead frame, and contact electrode to prevent disconnections. This prevents damage to the connections during shock and vibration that can cause micro-LED failure. The encapsulation also prevents thermal stresses from concentrating in the small micro-LED chip, which reduces temperature rise and improves efficiency and reliability.

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Micro-LED display that can sustain high brightness without overheating, which can lead to color degradation and reduced lifetime. The display uses micro-caps to thermally insulate the tiny LEDs from the substrate. The micro-caps create chambers around each LED that are sealed and can be filled with gas or vacuum. This prevents heat buildup and protects the color conversion layers. The display also has color material layers on the micro-caps to enhance color performance.

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A display backplane and display device with improved heat dissipation for high resolution, high brightness microLED displays. The display backplane has thermally conductive connections between the LED chips and the backplane substrate. This provides direct heat conduction path from the chips to the backplane to dissipate the heat. The connections replace the encapsulation layer on the chip side, which can trap heat. The improved heat dissipation prevents thermal accumulation on the backplane and maintains LED performance and lifespan.

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MicroLED package design with improved heat dissipation for better reliability. The package has a heat sink, chip, glass panel, and circuit board. The chip is attached to both the heat sink and glass panel, and the circuit board is mounted on the heat sink. This allows direct chip-to-heatsink thermal conduction to dissipate chip heat.

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Display package design for microLED displays that improves thermal management and planarity. The package has a molding compound, LED dies, backplane die, and spacer structures. The spacer structures have higher thermal conductivity than the molding compound. This provides mechanical support and alignment for the LED dies while allowing thermal isolation between them. The higher thermal spacers prevent thermal coupling between closely packed microLED dies. The molding compound with lower thermal conductivity surrounds the LED dies and backplane.

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Chip-level packaged digital LED light source with improved heat dissipation for prolonged LED chip life. The LED light source has a main body with a thermal isolation groove on the top surface. The bottom wall of the groove has a seat that protrudes out. A base is attached to the seat's upper side. The LED chip is placed on the bottom wall of the reflection cavity in the base. The seat is located at the bottom wall of the base. An L-shaped thermally conductive sheet is fixed to the outer surface of the thermal isolation groove. The vertical plate of the sheet extends out of the main body and contacts the outer surface of the base. The horizontal plate of the sheet penetrates out of the main body. This configuration allows effective heat dissipation from the LED chip through the thermally conductive sheet, reducing attenuation and improving current handling capability to prolong LED chip life.

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Micro-LED display and package method to encapsulate micro-LED chips with an optimized film. The micro-LED chips have small microstructures on their surfaces. A softened encapsulation film is pressed onto the substrate and chips until the microstructures penetrate it. When the film hardens, it tightly encapsulates the chips and substrate without coating. The penetrating microstructures anchor the film, preventing the chips from falling off. This provides chip protection without coating or modules. The microstructures also improve light extraction.

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Micro-LED display panel, display module, and LED display screen with improved heat dissipation and power efficiency. The display has a micro-LED panel with individual lamp bodies containing the LED chips. A graphene thermoelectric conversion layer is placed below the wiring layer. The conversion layer absorbs waste heat from the wiring and circuitry to dissipate it. This prevents accumulation of heat on the panel and substrate. The graphene layer is electrically connected to the display power supply.

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Micro-LED display with an antistatic ground structure to protect the internal circuitry from static damage. The display has an additional ground circuit board that grounds static electricity from the display circuits, like the multiplexer and driver IC. The board is connected to the side circuitry and positioned around the main circuitry. It contains antistatic protection elements like TVS diodes to absorb static charges and prevent them from damaging sensitive circuits. This allows the display to be assembled and handled without risking static damage.

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