Micro-LED Lifespan Enhancement

LED display and electronic equipment with improved heat dissipation for micro LED devices. The heat dissipation is achieved by surrounding the LED chips with a heat sink and introducing an inert gas into the airflow channels. The heat sink absorbs and conducts heat away from the LED chips. The inert gas fill in the airflow channels acts as an insulator to prevent heat transfer between adjacent LED chips. This prevents accumulation of heat on the display backplane and improves display performance and chip lifetime.

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Micro LED display module design to improve yield, repairability, and prevent breakage compared to conventional Micro LED displays. The module has detachable sub-boards with positioning tubes between them. This allows individual sub-boards to be replaced without disturbing the main board. The sub-boards have fixed blocks on one side and LED modules on the other. This configuration prevents unequal forces on the sub-boards that can cause separation. The positioning tubes prevent the sub-boards from moving and separating when connected to the main board. The tubes also prevent stress on the main board. The sub-boards can be extracted and replaced through access grooves without removing the main board.

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Microdisplay module with high current driving capability to enable brighter and more power-efficient microdisplays for applications like projection and AR. The module has an embedded heat sink block in the center of the driver board that quickly dissipates the high current microdisplay's heat. The microdisplay chip is bonded to the heat sink using a sintered layer. Surrounding bonding wires disperse current to reduce transmission losses and heat. This design reduces temperature rise and stability issues when driving microdisplays at high currents.

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Micro LED display module with improved heat dissipation and reduced light reflection. The module has an external light absorbing sheet over the micro LED chips. The sheet has arrays of heat dissipation holes connecting the centers of four holes. This allows heat generated by the LEDs to dissipate to the outside. It also exposes areas of the adhesive layer beneath the holes for heat transfer. This prevents trapped heat and delamination issues. The holes also reduce internal reflections by allowing light to escape.

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MicroLED display with improved heat dissipation by mounting the circuit board on the heat sink and filling the hollow area between them with thermal adhesive. This directly attaches the microLED chip to the heat sink with the adhesive surrounding it for better heat transfer.

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LED display device with improved heat dissipation to extend display life. The device uses thermally conductive connectors between the PCB and a separate heat sink enclosure. This allows direct contact and heat transfer between the PCB and enclosure, preventing heat buildup on the PCB and LEDs. The connectors quickly dissipate the LED heat to the enclosure. This avoids heat accumulation that ages the display.

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Microdisplay chip with efficient heat dissipation, and a corresponding heat sink, for high-resolution displays in applications like AR/VR headsets. The microdisplay has a bonded array of tiny LEDs on a substrate with heat dissipation holes. The LED sidewalls have dielectric layers, with an outer layer of diamond, to insulate and conduct heat. This prevents damage during processing and enables vertical heat flow. The substrate has thermal vias for internal dissipation. A nanoscale nitride film protects the sidewalls during diamond deposition. The chip has vertical packaging for better heat transfer. The heat sink has copper, gold, diamond, etc. filling the holes. This allows efficient heat transfer from the chip to air.

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Mini LED display module with improved thermal management to prevent overheating and degradation of the mini LED chips. The module has a heat dissipation structure with multiple parallel heat conduction channels between the LED chips and circuit layer. Air flows through these channels to extract heat from the LEDs. The channels have a gradually decreasing cross-section to increase airflow speed and heat transfer efficiency. Fans assist in forcing airflow through the channels. The channels also have air guide holes to connect them to the LED gaps for direct heat extraction. The fans have adjustable speeds to balance airflow rates for optimal heat dissipation.

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LED array display substrate with improved heat dissipation and safety compared to conventional LED displays. The substrate has a sealed LED assembly with cooling, protection, and an anti-seepage mechanism. A cooling pipe with pump extracts heat from the LEDs through a sealed gap between silicone sleeves and plates. This prevents coolant leakage into the display. The silicone protection isolates the LEDs from external seepage. The sealed LED assembly with internal cooling improves heat dissipation efficiency and longevity by absorbing heat from the LEDs.

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SMD LED with improved heat dissipation and longer lifetime by directly transferring heat from the LED chips to the substrate and using a heat pipe. The LED has separate cups for the red and blue chips, filled with fluorescent glue. The cups are connected to the substrate. A heat pipe connects the red chip cup to a heat sink. This allows direct heat transfer from the red chip to the substrate and sink, improving dissipation. The blue chip cup has no heat pipe, but still connects to the substrate. This allows direct heat transfer from both chips to the substrate. The cups protect the dried glue from damage.

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Wafer-level LED packaging structure that improves heat dissipation and reliability of LED chips. The structure uses a silicon base with features like accommodating grooves, mounting groove, ventilation, filter screen, scraping mechanism, heat dissipation mechanism, and heat conduction rods. This provides stable installation of the LED chip, dust removal, faster heat dissipation, and protection.

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Micro-LED display panel with redundancy to improve yield and reliability. The display has micro-LEDs arranged in sub-pixels on a driving substrate, with some sub-pixels containing two series-connected micro-LEDs of the same color. In normal sub-pixels, both LEDs emit light, but if one LED fails, only the working LED emits light. Redundancy positions allow extra LEDs to parallel connect if both originals fail. This compensates for failed LEDs and maintains full sub-pixel brightness. The redundancy prevents single LED failures from affecting display quality.

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Micro LED display device with improved stability and electrical performance by optimizing the mesa structure of the micro LED chips. The micro LED device has a mesa structure with multiple bosses, each boss having multiple light-emitting units. This controls the number of bosses and units to avoid excessive side area leading to instability, and excessive boss area causing high leakage current. It improves micro LED device stability and electrical performance compared to having a single boss per unit or large boss areas.

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Micro-LED design with a current guiding structure to improve efficiency and lifespan. The micro-LED has a current guiding element in the center of the LED stack that directs the current flow away from the sidewalls. This prevents current from flowing through the defect-prone sidewall region, which can reduce efficiency. The current guiding part forces the current to spread out through the center of the LED before reaching the sidewalls. This avoids non-radiative recombination and damage that can occur on the sidewalls.

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MicroLED display device with bonding support layers between the electrode pads to prevent shorts, misalignment, and cracking during bonding and curing. The bonding support layers are placed between the substrate pads and the microLED electrodes. They prevent pad contact causing shorts, provide support to prevent microLED cracking, and serve as alignment references during transfer. The layers have varying optical densities between upper and lower portions, with lower density lower portions. This prevents light leakage.

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Display module with improved heat dissipation to prevent damage from excessive heat during operation. The module has a heat sink in the array layer next to the LEDs. This sink absorbs the LED heat and spreads it away from the LEDs to prevent localized hotspots. Additionally, a separate heat sink on the other side of the module dissipates the absorbed heat further. The heat sinks have larger areas on the sides away from the LEDs to maximize heat transfer. This allows the module to operate at higher brightness without failure due to heat buildup.

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Display substrate, display module, and display device design to improve heat dissipation in high-density micro LED displays. The display substrate has a base substrate with micro LED chips attached to the backside. This allows direct heat transfer from the LEDs to the substrate, preventing heat accumulation between closely packed LEDs. The LEDs emit light through the substrate. A display panel can be added on the light-emitting side of the substrate. This substrate design reduces micro LED heat buildup, improves LED reliability, and enables high-density micro LED displays with better heat dissipation.

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Micro-LED packaging structure to improve heat dissipation and reliability. The packaging has a sealed encapsulation around the wire connections between the micro-LED chip, lead frame, and contact electrode to prevent disconnections. This prevents damage to the connections during shock and vibration that can cause micro-LED failure. The encapsulation also prevents thermal stresses from concentrating in the small micro-LED chip, which reduces temperature rise and improves efficiency and reliability.

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Micro-LED display that can sustain high brightness without overheating, which can lead to color degradation and reduced lifetime. The display uses micro-caps to thermally insulate the tiny LEDs from the substrate. The micro-caps create chambers around each LED that are sealed and can be filled with gas or vacuum. This prevents heat buildup and protects the color conversion layers. The display also has color material layers on the micro-caps to enhance color performance.

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A display backplane and display device with improved heat dissipation for high resolution, high brightness microLED displays. The display backplane has thermally conductive connections between the LED chips and the backplane substrate. This provides direct heat conduction path from the chips to the backplane to dissipate the heat. The connections replace the encapsulation layer on the chip side, which can trap heat. The improved heat dissipation prevents thermal accumulation on the backplane and maintains LED performance and lifespan.

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