Durability Optimization for Micro-LED Display Technology

Micro-LED display panel with redundancy to improve yield and reliability. The display has micro-LEDs arranged in sub-pixels on a driving substrate, with some sub-pixels containing two series-connected micro-LEDs of the same color. In normal sub-pixels, both LEDs emit light, but if one LED fails, only the working LED emits light. Redundancy positions allow extra LEDs to parallel connect if both originals fail. This compensates for failed LEDs and maintains full sub-pixel brightness. The redundancy prevents single LED failures from affecting display quality.

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Micro-LED design with a current guiding structure to improve efficiency and lifespan. The micro-LED has a current guiding element in the center of the LED stack that directs the current flow away from the sidewalls. This prevents current from flowing through the defect-prone sidewall region, which can reduce efficiency. The current guiding part forces the current to spread out through the center of the LED before reaching the sidewalls. This avoids non-radiative recombination and damage that can occur on the sidewalls.

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Micro-LED display that can sustain high brightness without overheating, which can lead to color degradation and reduced lifetime. The display uses micro-caps to thermally insulate the tiny LEDs from the substrate. The micro-caps create chambers around each LED that are sealed and can be filled with gas or vacuum. This prevents heat buildup and protects the color conversion layers. The display also has color material layers on the micro-caps to enhance color performance.

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Micro-LED display and package method to encapsulate micro-LED chips with an optimized film. The micro-LED chips have small microstructures on their surfaces. A softened encapsulation film is pressed onto the substrate and chips until the microstructures penetrate it. When the film hardens, it tightly encapsulates the chips and substrate without coating. The penetrating microstructures anchor the film, preventing the chips from falling off. This provides chip protection without coating or modules. The microstructures also improve light extraction.

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High-resolution flexible displays that can be folded without cracking or breaking. The displays use graphene-based transparent electrodes that are more flexible and durable than conventional Indium Tin Oxide (ITO) electrodes. The graphene electrodes are formed on top of micro-LED pixels to complete the display circuitry. The graphene electrode layer can be produced using chemical vapor deposition (CVD) techniques.

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Micro-LED display with an antistatic ground structure to protect the internal circuitry from static damage. The display has an additional ground circuit board that grounds static electricity from the display circuits, like the multiplexer and driver IC. The board is connected to the side circuitry and positioned around the main circuitry. It contains antistatic protection elements like TVS diodes to absorb static charges and prevent them from damaging sensitive circuits. This allows the display to be assembled and handled without risking static damage.

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Fused assemblies of inorganic light-emitting diodes (LEDs) that can avoid brightness and power control problems resulting from LED defects. The fused LED components each have a set of serially connected LEDs with one LED having a fuse to blow if it shorts. This isolates defective LEDs. The fused LED components are used in displays, lamps, and other lighting devices to ensure reliable LED performance. The fused LED components can be made using micro-transfer printing of LED layers onto sacrificial posts.

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An LED element design that improves stability of electrical connections between the LED element and substrate in an LED display module. The LED element has electrode pads with increased contact area achieved by applying a conductive filler like solder to the electrode pad surfaces. This helps ensure reliable electrical connection to the substrate pads when the LED element is mounted on the substrate. The method involves checking and adding filler to the electrode pad contacts if needed during LED manufacturing.

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