Increase Durability of Micro-LEDs

Making carbon fibers from solid asphaltenes, a component found in crude oil and bitumen, by melt spinning the asphaltenes directly into fibers instead of dissolving them in solvents. The solid asphaltene precursor is heated and melted in a sealed vessel, then extruded through a spinneret to form green fibers. The fibers are stabilized, carbonized, and graphitized in stages to improve mechanical properties. This allows making carbon fibers from solid asphaltene sources without dissolving them first.

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Reducing electrical discharge machining (EDM) damage in dynamo-electric machines like motors and generators by using conductive cans around the stator to dissipate capacitive voltages. The cans are made with conductive materials like fiber-reinforced composites or coated with conductive layers. This allows them to be part of the machine's grounding system, reducing voltage spikes on bearings and other components connected to the shaft. The cans still encapsulate the stator, but their conductivity prevents capacitive voltages from building up between stator and rotor. This reduces EDM wear in bearings and gearboxes compared to using insulating cans.

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Distributed cryptographic system for secure and scalable data archiving using a network of autonomous blockchains. The system enables data immutability, verifiability, and scalability improvements over traditional blockchains for enterprise applications. Each participant has its own independent blockchain to manage its data. Blocks are linked inter-chain using cryptographic hashes. If a participant wants to modify data, they must rewrite their entire chain. This prevents tampering since all linked chains would need agreement. The system also enables cancellation and deletion of data through special blocks.

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Distributed data detection method for low latency, low weight, low power devices like smart glasses that need local processing of data but lack the resources for it. The method involves an end-unit device obtaining datasets and streaming some to a remote computing device. The end-unit determines local information and sends it. The remote device selects an operation based on the local info and dataset parts. The end-unit detects using the selected op. This allows leveraging remote resources for optimized detection without requiring heavy local hardware. The remote device can also select ops for both devices using the same dataset parts.

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Reducing power consumption of depth sensors in AR headsets to enable longer battery life by intelligently adjusting the emission pattern and frame rate based on user motion and environment. The AR device senses user motion and identifies activity. It then determines the optimal emission pattern and frame rate for the depth sensor based on that activity. This allows reducing power by lowering intensity, shortening range, or decreasing frame rate when less precision is needed. It also adjusts patterns to maximize range when needed. By dynamically optimizing depth sensor settings for the task, it reduces power consumption compared to fixed settings.

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Display devices with signal lines that can maintain proper operation even when the substrate bends and cracks occur in the signal lines. The solution involves adding parallel protective link lines running through the bending area. These protective link lines have the same metal as the touch sensor layer and extend parallel to the main signal lines. This prevents cracks in the main signal lines from disrupting signal transfer as the protective link lines can still carry the signal.

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A system to prevent a farming vehicle from following an incorrect replacement guidance line when receiving updates from a server. The system has a switch between two modes to handle guidance line updates. In the first mode, the vehicle replaces the original guidance line with the new one received from the server. In the second mode, the vehicle keeps the original line. The switch is controlled based on the vehicle's internal status. This prevents issues like following an incorrect replacement line if the timing of the update is off. The system acquires vehicle status and switches between modes to avoid following wrong guidance lines when receiving updates from an external server.

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A method to manufacture display devices with improved reliability by avoiding the need for transfer steps. The method involves bonding the display substrate metal layer with protrusions on the light emitting element during growth, then transferring the element to the display substrate by aligning and moving. This eliminates separate transfer steps and associated reliability issues.

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A method to improve yield and reliability of microLED display fabrication by preventing warpage during transfer of the microLEDs from the growth substrate to the final display substrate. The method involves using a pressure jig to flatten the sapphire growth substrate before laser transfer of the microLEDs. This prevents warpage issues during laser lifting and transfer that could misalign the microLEDs. The pressure jig applies localized pressure to flatten the substrate against the spacer and circuit board, avoiding excessive crushing of components.

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Display device with improved reliability and reduced electrode peeling of microLED displays. The display has a substrate with pixels containing light-emitting elements and transistors. The transistor and light-emitting element are insulated by a film. The mounting electrode for the light-emitting element is on the insulating film. The film has a groove along the mounting electrode's edge. The anode electrode connects to the transistor and makes contact with the mounting electrode in the groove bottom. This configuration prevents peeling of the mounting electrode by securely anchoring it in the groove.

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LED display and electronic equipment with improved heat dissipation for micro LED devices. The heat dissipation is achieved by surrounding the LED chips with a heat sink and introducing an inert gas into the airflow channels. The heat sink absorbs and conducts heat away from the LED chips. The inert gas fill in the airflow channels acts as an insulator to prevent heat transfer between adjacent LED chips. This prevents accumulation of heat on the display backplane and improves display performance and chip lifetime.

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Micro LED display module with improved heat dissipation and reduced light reflection. The module has an external light absorbing sheet over the micro LED chips. The sheet has arrays of heat dissipation holes connecting the centers of four holes. This allows heat generated by the LEDs to dissipate to the outside. It also exposes areas of the adhesive layer beneath the holes for heat transfer. This prevents trapped heat and delamination issues. The holes also reduce internal reflections by allowing light to escape.

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MicroLED display with improved heat dissipation by mounting the circuit board on the heat sink and filling the hollow area between them with thermal adhesive. This directly attaches the microLED chip to the heat sink with the adhesive surrounding it for better heat transfer.

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LED display device with improved heat dissipation to extend display life. The device uses thermally conductive connectors between the PCB and a separate heat sink enclosure. This allows direct contact and heat transfer between the PCB and enclosure, preventing heat buildup on the PCB and LEDs. The connectors quickly dissipate the LED heat to the enclosure. This avoids heat accumulation that ages the display.

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LED array display substrate with improved heat dissipation and safety compared to conventional LED displays. The substrate has a sealed LED assembly with cooling, protection, and an anti-seepage mechanism. A cooling pipe with pump extracts heat from the LEDs through a sealed gap between silicone sleeves and plates. This prevents coolant leakage into the display. The silicone protection isolates the LEDs from external seepage. The sealed LED assembly with internal cooling improves heat dissipation efficiency and longevity by absorbing heat from the LEDs.

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Micro-LED display panel with redundancy to improve yield and reliability. The display has micro-LEDs arranged in sub-pixels on a driving substrate, with some sub-pixels containing two series-connected micro-LEDs of the same color. In normal sub-pixels, both LEDs emit light, but if one LED fails, only the working LED emits light. Redundancy positions allow extra LEDs to parallel connect if both originals fail. This compensates for failed LEDs and maintains full sub-pixel brightness. The redundancy prevents single LED failures from affecting display quality.

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Micro LED display device with improved stability and electrical performance by optimizing the mesa structure of the micro LED chips. The micro LED device has a mesa structure with multiple bosses, each boss having multiple light-emitting units. This controls the number of bosses and units to avoid excessive side area leading to instability, and excessive boss area causing high leakage current. It improves micro LED device stability and electrical performance compared to having a single boss per unit or large boss areas.

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Micro-LED design with a current guiding structure to improve efficiency and lifespan. The micro-LED has a current guiding element in the center of the LED stack that directs the current flow away from the sidewalls. This prevents current from flowing through the defect-prone sidewall region, which can reduce efficiency. The current guiding part forces the current to spread out through the center of the LED before reaching the sidewalls. This avoids non-radiative recombination and damage that can occur on the sidewalls.

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MicroLED display device with bonding support layers between the electrode pads to prevent shorts, misalignment, and cracking during bonding and curing. The bonding support layers are placed between the substrate pads and the microLED electrodes. They prevent pad contact causing shorts, provide support to prevent microLED cracking, and serve as alignment references during transfer. The layers have varying optical densities between upper and lower portions, with lower density lower portions. This prevents light leakage.

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Display module with improved heat dissipation to prevent damage from excessive heat during operation. The module has a heat sink in the array layer next to the LEDs. This sink absorbs the LED heat and spreads it away from the LEDs to prevent localized hotspots. Additionally, a separate heat sink on the other side of the module dissipates the absorbed heat further. The heat sinks have larger areas on the sides away from the LEDs to maximize heat transfer. This allows the module to operate at higher brightness without failure due to heat buildup.

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