Micro-LED Driver Circuitry Designs for Enhanced Display Performance

Micro-LED display with stacked multi-color pixels and an integrated driver circuit for high-resolution displays with compact pixel sizes and reduced power consumption. The display has a normal driver circuit and a pixel structure where red, green, and blue sub-pixels are stacked on top of each other. The sub-pixels are electrically connected to the driver circuit through metal wires. The stacked pixel design reduces pixel size while still providing full-color capability. The pixels are fabricated by growing and stacking layers for each sub-pixel color, then cutting and connecting them to the driver circuit.

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Display panel with improved heat dissipation for micro-LEDs to avoid efficiency loss and extend lifespan. The panel has pixel units with driving circuits between the substrate and light-emitting components. For units with micro-LEDs, the circuit includes a thin-film transistor connected to a metal structure. This forms a heat dissipation path from the micro-LED to the metal layer away from the substrate.

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A display driver architecture for micro-LED displays that reduces pixel pitch and increases bit depth with shared circuitry to improve performance and manufacturability. The architecture uses a macro-pixel design with multiple pixels sharing circuits like comparators and leveraging contiguous layout regions to reduce transitions. This allows fitting more bit cells and additional logic in the same area. By grouping circuits, using standard bit cells, and sharing certain components, it enables higher bit depths per pixel in dense micro-LED arrays.

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Optimizing CMOS driver electronics layout for micro-LED displays to uniformly distribute current and reduce hotspots. The layout uses interleaved Vled and cathode contact areas along two sides, surrounded by a cathode redistribution ring connecting to the cathode µbumps, instead of injecting current from three sides. This spreads current along the display edges for uniform distribution and avoids excessive density at the corners.

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Optimized layout of CMOS driver electronics for micro-LED displays to reduce power losses and improve reliability. The layout uses a power plane design with interleaved Vled and cathode contact areas along the sides of the display, surrounded by a cathode redistribution ring. This allows uniform injection of cathode current along all four sides of the display area to distribute current and avoid hotspots.

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A display panel that uses micro-LEDs and integrated driver circuitry to reduce power consumption compared to conventional display technologies like LCD and OLED. The display panel has an array of micro-LED pixels where each pixel contains a micro-LED and an integrated driver circuit. This allows each pixel to control its own LED brightness and color directly without additional driver circuitry. The integrated driver circuitry reduces power consumption by eliminating the need for separate driver components for each pixel. The micro-LED pixels can be densely packed to achieve high-resolution displays with improved brightness and energy efficiency.

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Micro-LED display system that reduces power consumption while maintaining high resolution, refresh rate, and reducing pin count compared to conventional displays. The system uses cascaded micro-LED integrated circuits (μICs) arranged in a matrix. All μICs in the same column receive the same column data signal sequentially. The μICs in each row receive different row clock signals sequentially. This enables a single-column driver to provide data to all columns and a single-row driver to provide clocks to all rows. The cascaded μICs decode and store the data for their row and only enable their LED based on the row clock. This allows one driver per row and column instead of per LED, reducing driver count.

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Micro-LED display system with integrated circuits (μICs) and row/column drivers sharing a serial interface to lower power consumption, pin count, and driver circuits compared to conventional displays. The μICs cascade in rows and columns. Each μIC has flip-flops and transistors to receive clocked data signals and drive RGB LEDs. The μICs receive column data and row clock signals through the shared serial interface from the drivers.

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Display systems with integrated micro-LED driving circuitry for high-resolution displays with smaller pixels. The displays use hybrid chiplets comprising a micro-LED chiplet stacked on a microdriver chiplet. The microdriver chiplet contains drive transistors made from high-performance semiconductor material, unlike the low-performance TFTs used in display backplanes. This allows smaller, more efficient drive transistors to be stacked underneath each micro-LED, saving display area compared to placing them separately on the backplane.

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Micro-LED displays with stacked multi-color pixels integrated with driving circuits to reduce pixel size and power consumption while improving yield compared to traditional displays. The displays use micro-LEDs with different color emissions stacked on top of each other in individual pixels. The stacked pixels are fabricated on top of an integrated circuit (IC) device containing the driving circuitry. They are then electrically connected to the driving circuit using metal wires. This reduces the pixel size compared to individually fabricating and placing pixels on a substrate. The result is a smaller, higher-resolution display with lower power consumption.

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Fabricating actively driven micro-LED (mLED) displays using direct bonding of mLED arrays to CMOS driver chips. This provides a manufacturing process for transparent and flexible micro-LED array displays using direct bonding of mLEDs to CMOS driver circuits. The bonding provides a reliable electrical connection between the mLED array and driver chips, enabling the mass production of mLED displays.

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