Thermal Control in Micro-LED Displays

LED display screen with improved heat dissipation for longer lifespan and better performance. The display has an internal heat dissipation mechanism where the display itself can cool down when used for short periods. For longer use, an external heat dissipation mechanism kicks in. It uses a snap-fit outer shell with air outlets and an internal mechanism with moving fan blades. The outer shell has a refrigeration component, expansion panel, and corrugated surface to rapidly lower temperature. This allows the display to operate longer by quickly dissipating heat.

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Ultra-black LED display screen with improved heat dissipation to prevent damage from prolonged use. The display has internal copper sheets, a heat-conducting bracket, through slots, heat dissipation columns, and graphite heat conductors. Heat generated by the LEDs transfers through the copper sheets to the bracket, then to the graphite columns. These columns can be rotated upward to expose them for airflow. This allows efficient heat dissipation through natural convection or forced air.

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An integrated heat dissipation display screen that reduces temperature of display devices like smartphones and tablets during prolonged use. The screen has an active temperature control component with a semiconductor refrigeration piece adhered to a heat dissipation guide plate. The refrigeration piece contacts a temperature equalizing plate. The guide plate has parallel fins for air flow between them. An air drum connected to a motor rotates inside the drum. This integrated setup actively cools the display panel by circulating air through the fins using the rotating drum.

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A double-sided LED display screen with improved heat dissipation to extend display life in high temperature environments. The display has a detachable heat dissipation mechanism between the front and rear LED screens. This mechanism contains a superconducting refrigeration plate, ventilation slots, alloy heat dissipation column, and an axial flow fan. The refrigeration plate contacts the LED screens to transfer heat. The fan accelerates airflow around the refrigeration chip to lower temperatures. The alloy column transfers this low temperature to the LED screens for rapid dissipation. This direct contact cooling with superconducting refrigeration extends display lifespan in hot conditions.

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LED display screen with improved heat dissipation to prevent components from overheating during prolonged operation. The screen has a bottom cover strip that allows air intake at the bottom end, enabling internal air circulation. Hot air generated by components is extracted through a heat-absorbing tube with a small aperture and negative pressure. This prevents large-scale heat diffusion and transference to other components. The tube's fast gas circulation speed and thermal insulation material absorb the hot air without contacting other components, achieving efficient component cooling.

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A heat dissipation structure for display screens that improves cooling efficiency compared to traditional methods. The structure has three cooling stages: a heat conduction stage, an air cooling stage, and a water cooling stage. The heat conduction stage uses a thermally conductive silica gel frame and radiation paint to transfer heat from the display screen to the air. An air cooling mechanism surrounds the heat conduction stage. A water cooling mechanism surrounds the air cooling stage. This multi-stage cooling setup allows efficient heat dissipation from the display screen using multiple cooling mechanisms in sequence.

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LED display screen with a heat dissipation structure to prevent overheating and component damage during long-term operation. The screen has a protective heat sink embedded in the display cover. The heat sink has features like heat conduction rods, pipes, and chambers to conduct and dissipate the internal screen heat. This prevents components from overheating and extends equipment life.

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Heat dissipation device for display chips that improves heat dissipation efficiency compared to traditional cooling methods. The device uses a multi-stage cooling system with a water cooling component, two heat sinks, and a sliding heat sink. The sliding heat sink has a bimetallic sheet that bends when temperatures rise to lower the secondary heat sink onto the water cooling component and turn on a water pump. This sequential cooling stages with progressive cooling helps extract more heat.

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Display module with efficient heat dissipation for applications like automotive displays with high power consumption and multiple IC chips. The module has a heat sink away from the display panel and Peltier-type heat dissipation units attached to it. The Peltier effect allows the heat generated by the display and IC chips to be transferred outward instead of just dissipating it. This combines heat sink and Peltier cooling for improved display module heat dissipation efficiency.

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Display device with improved heat dissipation to prevent overheating of components. The display has a composite thermal management system that efficiently conducts heat generated by the display components to the outside. It uses two thermal conductive film layers around the heat source device. The first layer quickly conducts heat from the device sidewall to the second layer. The second layer has high surface thermal conductivity to evenly distribute the heat. This allows rapid heat transfer from the source to the outside.

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LED display structure with improved heat dissipation to prevent overheating and degradation of the LED chips. The structure uses a heat conduction box, PCB board, LED lamp beads, cooling holes, and a compressible heat conduction material. The LED chips generate heat at the junction which is transferred through the cooling holes in the PCB to the heat conduction material. The material fills the box and contacts the PCB to conduct the heat further. The hole walls have a heat conduction layer. This allows direct heat transfer from the LEDs to the box and prevents hotspots on the PCB. The hole sizes are larger than the LED area for good coverage. The compressible material improves contact and efficiency.

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Display module with improved heat dissipation to prevent temperature rise and prolong display life. The module has a heat dissipation structure with layers stacked on the back of the display panel. The layers include thermally conductive adhesives, a heat conducting layer, and a heat spreading layer. A heat block runs through these layers in a perpendicular direction to the display surface. This directs heat from the display panel to the heat spreading layer for dissipation. The block also prevents relative displacement between the layers. The design enables rapid heat transfer to quickly dissipate heat from the display.

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Display module and display device with improved heat dissipation to prevent overheating and display failure. The display module has a shell with a back plate and side plate. The display panel is positioned in the shell. A heat sink is arranged on the backlight side of the display panel. The heat sink has a heat absorbing portion opposite the back plate and a first heat conducting portion abutting the side plate. This allows heat from the display panel to be absorbed and conducted through the shell to dissipate outside the module. The contact between the heat sink and shell increases to improve heat transfer rate.

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Heat dissipation device for screen display equipment that improves cooling performance without increasing volume or weight compared to prior art. The device has a heat dissipation module sandwiched between two heat conduction modules, one contacting the case and the other contacting the chip. A heat pipe inside the module transfers heat evenly between the modules. This allows direct contact with the hot components and rapid heat conduction through the pipe to distribute heat throughout the device for better overall dissipation.

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Display panel with improved heat dissipation for micro-LEDs to avoid efficiency loss and extend lifespan. The panel has pixel units with driving circuits between the substrate and light-emitting components. For units with micro-LEDs, the circuit includes a thin-film transistor connected to a metal structure. This forms a heat dissipation path from the micro-LED to the metal layer away from the substrate.

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A small-pitch high-density LED display screen design that provides effective heat dissipation for high-density LED displays. The display has an installation frame containing a display screen body. The display screen body has an aluminum substrate with a fixed backboard on the side away from the display. The side of the aluminum substrate closer to the display has a mounting groove. Heat sinks are fixed to the aluminum substrate farther away from the display. An internal heat dissipation channel with air amplifiers connects the heat sinks. The fixed backboard has cooling grooves, and a ventilation groove contains a cooling fan. This provides efficient heat dissipation from the LEDs through the aluminum substrate, heat sinks, channel, air amplifiers, and fan.

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Display module and display device with improved heat dissipation to prevent localized heating of the display panel from degrading performance and lifespan. A heat dissipation assembly is placed on the backside of the display panel. It includes a heat-conducting base with heat-dissipating components like expandable thermally conductive metal sheets. When the display panel locally heats, the heat conducts to the corresponding sheet that expands to increase dissipation area and rapidly conducts the heat away. This prevents hotspots and improves display performance and longevity.

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Display module with integrated phase change heat dissipation for medium and large size displays that has improved thermal management and reduced costs compared to conventional solutions. The display module contains a channel filled with a reversible phase change material that switches between liquid and solid states as temperature changes. The channel is inside a heat dissipation layer next to the display panel and the chip. This allows the chip to dissipate heat directly into the phase change material instead of relying on film or aluminum plates. The phase change material provides stable heat dissipation, recycleability, and a simple structure compared to forced cooling methods. Spoiler columns and interlaced channel layouts further enhance heat transfer.

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Heat pipe cooling structure for display devices that improves thermal dissipation compared to traditional fins. The structure uses a flat heat pipe sandwiched between the display case and mounting frame. Circular hole heat pipes are attached to the flat pipe on each side. Cooling fins are interspersed between the circular heat pipes. This configuration allows airflow between the fins to be channeled by the flat heat pipe and circular pipes for better heat dissipation. A fan on the back panel further improves airflow.

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Display cooling device to improve heat dissipation of displays mounted inside confined spaces like train compartments where external cooling fins are blocked. The device has a front frame and back cover with fins for heat dissipation. Inside the back cover, a heat conduction element contacts the display PCB and transfers heat to an embedded heat pipe. This spreads heat away from the PCB. The back cover fins dissipate the heat to the environment. This allows effective cooling of the display without external fins, as the heat is spread and transferred internally.

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