Thermal Control in Micro-LED Displays

Display device with integrated cooling to prevent overheating of the display panel. The cooling elements are positioned in the pixel array and driven along with the display pixels. A timing controller extracts the data value for each pixel area from the input signal and generates control signals to drive both the display and the cooling elements based on the extracted data. This synchronized driving of the display and cooling elements allows targeted cooling of the pixels with high heat output.

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Semiconductor package design to improve productivity, economic efficiency, thermal characteristics, and reliability. The package has multiple dies on a core layer surrounded by encapsulation material. The core wires extend vertically through the encapsulation and are covered by a conductive layer. An upper pad integrally connects to the uppermost core wire and is also covered by the conductive layer. This allows the upper pad to be above the core wires instead of directly on them. This prevents separation between the pad and encapsulation during processing and reduces cracking. The covered upper pad contacts the encapsulation material and a separate underfill layer separates the top die from the encapsulation. A heat spreader above the dies flattens them to improve thermal spreading.

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Display method for spliced LED (MLED) displays that reduces image sticking and improves display consistency. The method involves compensating the gray scale of sampled frames during playback. The compensation is based on initial gray scale data, filtered temperature influence data, and a target gray scale compensation. This avoids acquiring screen temperature. Compensating frames without temperature measurements improves uniformity and reduces image sticking compared to uncompensated frames.

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Optoelectronic component with improved heat dissipation and method for making it. The component has a semiconductor chip covered by a continuous metallic layer. The outer surface of the metallic layer has a structured pattern that provides identification of the component. The continuous metallic layer provides better heat dissipation compared to a non-continuous layer. The structured surface further increases the surface area for heat dissipation. This improves cooling of the chip and prevents hot spots. The component can also have other functions like electrical contact or barcode. The method involves applying metallic layers and selectively etching them to create the structured outer surface.

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Device and method for bonding phosphor converter tiles to LED dies to form LED devices with uniform and controlled bond layer thickness. The bonding device has an adhesive layer that is non-adhesive at room temperature but becomes adhesive at elevated temperature. This allows precise alignment and bonding of phosphor and LED dies by bringing them together at elevated temperature, then cooling to cure the bond. The uniform thin bond layer is formed between the LED and phosphor due to the adhesive's temperature-dependent adhesion.

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Display device design to reduce heat generation in the outer lines of the display structure. The display has an inner line surrounding the display area, outer lines outside the inner line, and a contact pattern connecting the inner and outer lines. The contact pattern overlaps the outer lines but has non-contact areas between them. An additional connection line is placed in these non-contact areas to electrically connect the inner and outer lines. This prevents concentrated current flow through the outer lines and reduces heat generation compared to directly connecting the inner and outer lines.

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LED display screen with improved heat dissipation for longer lifespan and better performance. The display has an internal heat dissipation mechanism where the display itself can cool down when used for short periods. For longer use, an external heat dissipation mechanism kicks in. It uses a snap-fit outer shell with air outlets and an internal mechanism with moving fan blades. The outer shell has a refrigeration component, expansion panel, and corrugated surface to rapidly lower temperature. This allows the display to operate longer by quickly dissipating heat.

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Ultra-black LED display screen with improved heat dissipation to prevent damage from prolonged use. The display has internal copper sheets, a heat-conducting bracket, through slots, heat dissipation columns, and graphite heat conductors. Heat generated by the LEDs transfers through the copper sheets to the bracket, then to the graphite columns. These columns can be rotated upward to expose them for airflow. This allows efficient heat dissipation through natural convection or forced air.

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An integrated heat dissipation display screen that reduces temperature of display devices like smartphones and tablets during prolonged use. The screen has an active temperature control component with a semiconductor refrigeration piece adhered to a heat dissipation guide plate. The refrigeration piece contacts a temperature equalizing plate. The guide plate has parallel fins for air flow between them. An air drum connected to a motor rotates inside the drum. This integrated setup actively cools the display panel by circulating air through the fins using the rotating drum.

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A double-sided LED display screen with improved heat dissipation to extend display life in high temperature environments. The display has a detachable heat dissipation mechanism between the front and rear LED screens. This mechanism contains a superconducting refrigeration plate, ventilation slots, alloy heat dissipation column, and an axial flow fan. The refrigeration plate contacts the LED screens to transfer heat. The fan accelerates airflow around the refrigeration chip to lower temperatures. The alloy column transfers this low temperature to the LED screens for rapid dissipation. This direct contact cooling with superconducting refrigeration extends display lifespan in hot conditions.

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LED display screen with improved heat dissipation to prevent components from overheating during prolonged operation. The screen has a bottom cover strip that allows air intake at the bottom end, enabling internal air circulation. Hot air generated by components is extracted through a heat-absorbing tube with a small aperture and negative pressure. This prevents large-scale heat diffusion and transference to other components. The tube's fast gas circulation speed and thermal insulation material absorb the hot air without contacting other components, achieving efficient component cooling.

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A heat dissipation structure for display screens that improves cooling efficiency compared to traditional methods. The structure has three cooling stages: a heat conduction stage, an air cooling stage, and a water cooling stage. The heat conduction stage uses a thermally conductive silica gel frame and radiation paint to transfer heat from the display screen to the air. An air cooling mechanism surrounds the heat conduction stage. A water cooling mechanism surrounds the air cooling stage. This multi-stage cooling setup allows efficient heat dissipation from the display screen using multiple cooling mechanisms in sequence.

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LED display screen with a heat dissipation structure to prevent overheating and component damage during long-term operation. The screen has a protective heat sink embedded in the display cover. The heat sink has features like heat conduction rods, pipes, and chambers to conduct and dissipate the internal screen heat. This prevents components from overheating and extends equipment life.

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Heat dissipation device for display chips that improves heat dissipation efficiency compared to traditional cooling methods. The device uses a multi-stage cooling system with a water cooling component, two heat sinks, and a sliding heat sink. The sliding heat sink has a bimetallic sheet that bends when temperatures rise to lower the secondary heat sink onto the water cooling component and turn on a water pump. This sequential cooling stages with progressive cooling helps extract more heat.

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Display module with efficient heat dissipation for applications like automotive displays with high power consumption and multiple IC chips. The module has a heat sink away from the display panel and Peltier-type heat dissipation units attached to it. The Peltier effect allows the heat generated by the display and IC chips to be transferred outward instead of just dissipating it. This combines heat sink and Peltier cooling for improved display module heat dissipation efficiency.

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Display device with improved heat dissipation to prevent overheating of components. The display has a composite thermal management system that efficiently conducts heat generated by the display components to the outside. It uses two thermal conductive film layers around the heat source device. The first layer quickly conducts heat from the device sidewall to the second layer. The second layer has high surface thermal conductivity to evenly distribute the heat. This allows rapid heat transfer from the source to the outside.

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LED display structure with improved heat dissipation to prevent overheating and degradation of the LED chips. The structure uses a heat conduction box, PCB board, LED lamp beads, cooling holes, and a compressible heat conduction material. The LED chips generate heat at the junction which is transferred through the cooling holes in the PCB to the heat conduction material. The material fills the box and contacts the PCB to conduct the heat further. The hole walls have a heat conduction layer. This allows direct heat transfer from the LEDs to the box and prevents hotspots on the PCB. The hole sizes are larger than the LED area for good coverage. The compressible material improves contact and efficiency.

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Display module with improved heat dissipation to prevent temperature rise and prolong display life. The module has a heat dissipation structure with layers stacked on the back of the display panel. The layers include thermally conductive adhesives, a heat conducting layer, and a heat spreading layer. A heat block runs through these layers in a perpendicular direction to the display surface. This directs heat from the display panel to the heat spreading layer for dissipation. The block also prevents relative displacement between the layers. The design enables rapid heat transfer to quickly dissipate heat from the display.

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Display module and display device with improved heat dissipation to prevent overheating and display failure. The display module has a shell with a back plate and side plate. The display panel is positioned in the shell. A heat sink is arranged on the backlight side of the display panel. The heat sink has a heat absorbing portion opposite the back plate and a first heat conducting portion abutting the side plate. This allows heat from the display panel to be absorbed and conducted through the shell to dissipate outside the module. The contact between the heat sink and shell increases to improve heat transfer rate.

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Heat dissipation device for screen display equipment that improves cooling performance without increasing volume or weight compared to prior art. The device has a heat dissipation module sandwiched between two heat conduction modules, one contacting the case and the other contacting the chip. A heat pipe inside the module transfers heat evenly between the modules. This allows direct contact with the hot components and rapid heat conduction through the pipe to distribute heat throughout the device for better overall dissipation.

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Display panel with improved heat dissipation for micro-LEDs to avoid efficiency loss and extend lifespan. The panel has pixel units with driving circuits between the substrate and light-emitting components. For units with micro-LEDs, the circuit includes a thin-film transistor connected to a metal structure. This forms a heat dissipation path from the micro-LED to the metal layer away from the substrate.

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A small-pitch high-density LED display screen design that provides effective heat dissipation for high-density LED displays. The display has an installation frame containing a display screen body. The display screen body has an aluminum substrate with a fixed backboard on the side away from the display. The side of the aluminum substrate closer to the display has a mounting groove. Heat sinks are fixed to the aluminum substrate farther away from the display. An internal heat dissipation channel with air amplifiers connects the heat sinks. The fixed backboard has cooling grooves, and a ventilation groove contains a cooling fan. This provides efficient heat dissipation from the LEDs through the aluminum substrate, heat sinks, channel, air amplifiers, and fan.

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Display module and display device with improved heat dissipation to prevent localized heating of the display panel from degrading performance and lifespan. A heat dissipation assembly is placed on the backside of the display panel. It includes a heat-conducting base with heat-dissipating components like expandable thermally conductive metal sheets. When the display panel locally heats, the heat conducts to the corresponding sheet that expands to increase dissipation area and rapidly conducts the heat away. This prevents hotspots and improves display performance and longevity.

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Display module with integrated phase change heat dissipation for medium and large size displays that has improved thermal management and reduced costs compared to conventional solutions. The display module contains a channel filled with a reversible phase change material that switches between liquid and solid states as temperature changes. The channel is inside a heat dissipation layer next to the display panel and the chip. This allows the chip to dissipate heat directly into the phase change material instead of relying on film or aluminum plates. The phase change material provides stable heat dissipation, recycleability, and a simple structure compared to forced cooling methods. Spoiler columns and interlaced channel layouts further enhance heat transfer.

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Heat pipe cooling structure for display devices that improves thermal dissipation compared to traditional fins. The structure uses a flat heat pipe sandwiched between the display case and mounting frame. Circular hole heat pipes are attached to the flat pipe on each side. Cooling fins are interspersed between the circular heat pipes. This configuration allows airflow between the fins to be channeled by the flat heat pipe and circular pipes for better heat dissipation. A fan on the back panel further improves airflow.

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Display cooling device to improve heat dissipation of displays mounted inside confined spaces like train compartments where external cooling fins are blocked. The device has a front frame and back cover with fins for heat dissipation. Inside the back cover, a heat conduction element contacts the display PCB and transfers heat to an embedded heat pipe. This spreads heat away from the PCB. The back cover fins dissipate the heat to the environment. This allows effective cooling of the display without external fins, as the heat is spread and transferred internally.

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LED display screen with improved heat dissipation for high-intensity applications. The display has a dedicated heat dissipation system with a blower, heat pipe, and suction fan. The blower blows air over the display to absorb heat, the heat pipe transfers it to the blower, and the suction fan removes hot air. This actively circulates and extracts heat, preventing overheating and prolonging display life.

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A rapid heat dissipation display to prevent overheating of internal components during prolonged use. The display has a rear shell with a heat pipe connected to the controller. A fixed frame inside the shell limits the position of a removable placement frame. The front of the placement frame holds a motor with fan blades. Ventilation holes in the shell aid cooling. The rear shell attaches to the outer frame. The heat pipe transfers heat from the controller to the shell's copper plate. The fan blows air over the components through the ventilation. The removable placement frame allows easy access for maintenance or replacement.

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Heat sink design for improving heat dissipation efficiency in displays and lighting applications. The heat sink has a unique layout of parallel, polygonal heat pipes and fins arranged on the surface of the main body. This configuration allows air convection and radiation cooling between the pipes and fins. The regular polygonal shape of the pipes increases surface area for better radiation. The heat sink can be installed on the display or lighting device to dissipate heat more effectively compared to conventional fins.

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Heat dissipation structure for LED display panels that allows thin, lightweight displays without enclosures while preventing overheating. The structure has an interleaved mounting plate and heat insulation board with an air guide cavity between them. The LED assembly is mounted on the plate and air holes on the sides allow airflow through the cavity. This provides efficient convective cooling. Outdoor displays avoid direct sunlight overheating since the insulation board shields the cavity.

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Display back plate and display device with improved heat dissipation to prevent overheating of LED displays. The back plate has a substrate, heat conduction layer, light emitting layer, and back plate layer. It also has heat dissipation posts in the substrate with holes. The posts connect to the heat conduction layer and back plate layer. This allows heat from the LEDs to transfer through the posts to the back plate. The holes and posts in the substrate improve heat extraction compared to just adhesive on the back plate.

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Display structure for electronic devices like intelligent lighting with improved heat dissipation to prevent overheating. The structure involves connecting the display to one side of a heat-dissipating pressure plate that has a cavity filled with a thermally conductive material. This allows heat from the display to transfer to the other side of the plate, speeding up dissipation compared to just using the display enclosure. The conductive material can be a phase change material that absorbs/releases heat at specific temperatures.

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Flexible display device that prevents pixel burnout in high resolution applications by improving heat dissipation from the chip. The display has a display panel, chip, and a specialized heat dissipation structure. The structure is located between the chip and the display panel on the side further from the bonding area. It provides a larger thermal conductivity path and higher conductivity materials to rapidly dissipate chip heat and prevent pixel burnout in high resolution applications where the chip needs stronger driving and higher power consumption.

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LED display screen with improved heat dissipation for preventing damage to the LEDs and maintaining display quality during prolonged operation or in high temperatures. The display screen has a mounting rack at the front with internal heat conduction plates that contact the screen to draw heat away. Air supply mechanisms connect to the heat conduction plates for active cooling. This allows timely heat dissipation when natural cooling is insufficient. The heat conduction plates are copper plates with pipes at the ends that connect to the air supply.

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Heat dissipation structure for LED displays that allows efficient and silent cooling of the displays without external power sources. The structure uses internal loops with phase change media, one-way valves, and evaporative cooling to rapidly transfer heat from the display modules to the display enclosure. The loops absorb heat from the module backs, evaporate the media, and condense it back in the enclosure to radiate it out. Tesla valves prevent backflow. This internal closed loop cooling eliminates fans, air conditioners, and refrigerants while reducing temperature and power consumption.

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Energy-saving temperature-controlled heat dissipation display screen with improved power consumption and longevity by actively dissipating heat generated by the display. The screen has a partition frame inside the display body with a heat dissipation member attached. This member contains a heat-conducting plate, vertical heat strips, heat collectors, fins, and a first case. It absorbs heat from the display and uses airflow and conduction to dissipate it. The partition frame prevents heat transfer between the display and body.

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Temperature sensing circuit for monitoring pixel temperature in high-brightness micro-LED displays without additional components. It uses the temperature-dependent off currents of two different thin film transistors inside the pixel circuitry. The difference in off current between the transistors provides a measure of the pixel temperature.

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A display module with improved luminance and heat emission performance for micro-LED displays. The module has micro-LEDs on a substrate surrounded by a reflective and light-blocking layer. The reflective layer helps capture light emitted from the side of the micro-LED and redirect it forward. The light-blocking layer prevents light leakage, increasing light efficiency and reducing power consumption. The reflective layer also helps dissipate heat from the micro-LED.

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Display module with improved heat dissipation to prevent overheating and degradation during prolonged use. The module has a heat-conducting copper sheet sandwiched between the display panel and base plate. This copper sheet draws heat away from the display components. An annular air duct surrounds the copper sheet and has an air inlet and outlet. This duct channels air over the copper sheet to further cool it. The base plate also has a mounting groove for the display assembly. This enclosed ventilation system prevents dust entry while improving heat dissipation.

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Display device with improved heat dissipation for large-size Mini-LED or Micro-LED displays. The display has a heat dissipation module with staggered fins on one side and a cavity with inlet and outlet to form an air duct. This creates a chimney effect to enhance heat removal. The fins divide the duct into sub-windows for better airflow. The fins are angled toward the outlet and have spacing. The fins are on a heat plate facing another plate in the module. This allows attaching Mini-LED/Micro-LED displays to the plates. The fins, plates, and duct are made of metal.

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Heat dissipation device for displays, especially vehicle-mounted displays with high brightness, that provides better cooling compared to passive or water-cooled methods while being lightweight and compact. The heat sink has a portion with a liquid metal radiator nested inside it. The liquid metal has high thermal conductivity, small volume, low freezing point, and wide temperature range. The liquid metal radiator and heat sink are embedded connected. This reduces device volume for balancing cooling, weight, and applicability. The display assembly has the display panel attached to the heat sink with a heat spreader between. This uses the heat sink and liquid metal for primary cooling, while the display panel spreads heat to the sink. The embedded connection reduces size further.

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Display module that improves micro-LED displays' luminance and heat emission performance. The module contains micro-LEDs on a substrate, with a reflective layer surrounding the micro-LEDs and a light-blocking layer on top. The reflective layer captures and redirects light emitted from the micro-LEDs' lateral surfaces to increase efficiency. The light-blocking layer prevents lateral light emission. This improves overall luminance by reducing wasteful side light and heat by containing light emission to the front. The layers can be applied via CVD and polished to expose the micro-LED tops.

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High-efficiency heat dissipation device for display screens to improve cooling performance of LED displays. It aims to address the issue of inadequate heat dissipation in LED screens that affects stability, color uniformity, and lifespan. The device has three components - a first heat dissipation plate, a support frame, and a radiation heat dissipation layer. The screen circuit board attaches to the heat dissipation plate. The frame connects the plate and radiation layer to provide an enclosed heat path. This captures and transfers heat from the screen to the radiation layer for efficient dissipation.

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Active heat dissipation display screen device that allows effective heat dissipation without external devices or open holes. The display has an internal mechanism with movable connecting plates and fixed heat dissipation plates at the bottom and top. This allows the inner plates to slide and dissipate heat internally, preventing dust entry and simplifying disassembly compared to external devices or openings.

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Electronic display assembly with high heat dissipation efficiency to improve reliability and longevity in harsh environments. The display has internal heat exchange passages between components like the backlight and LCD panel, and an external heat dissipation path. Ambient air flows through the external path and carries heat away from the internal passages. This allows internal components to shed heat to the external environment instead of accumulating inside. The multiple pathways and non-connected design prevent contaminants from entering the assembly.

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A new type of LED display module that improves thermal management, audio playback, and display effect compared to conventional modules. The module has an assembly box, display box, and speaker connected to one side of the assembly box. The display box has a heat dissipation plate connected to the upper end. Thermally conductive silicone grease connects the plate to heat-conducting pillars. This provides better thermal conductivity and heat dissipation to the LEDs, preventing burnout. The speaker allows audio playback after installation.

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LED display screen with an improved heat dissipation system to prevent overheating and failure. The screen has a support seat embedded at the bottom with cavities for heat conduction. A thermally conductive rod extends from the seat into the screen back to connect to the heat sink. This allows internal display heat to be conducted out through the seat, sink, and rod. Ventilating bulges on the sink radiate the heat to the outside. Arc-shaped grooves on the sink make handling easier.

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Display unit with integrated cooling for LED screens that efficiently dissipates heat generated by the display modules. The display unit has a cooling pipe with liquid inlet and outlet that connects to a heat exchanger. The cooling liquid absorbs heat from the display module, circulates through the heat exchanger to be cooled, then returns to the module. This continuous flow of cooling liquid improves heat dissipation efficiency compared to just using the heat exchanger.

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Heat dissipation structure for high power density display modules like microLED. It uses a chimney effect with a two-part heat sink to rapidly dissipate heat generated by the displays. The first heat sink has fins and side plates. The second heat sink attaches to the side plates to enclose a cavity with inlets and outlets. The stacked heat sinks create a forced airflow as hot air rises and cold air is drawn in. The fins further improve heat dissipation. The two-part design allows using different materials for better heat dissipation at lower cost.

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Heat dissipation device for LED displays that improves heat dissipation compared to fans. It uses a heat sink with fins and a heat pipe embedded in it. The heat pipe is flat against the display side of the heat sink. The fins are perpendicular to the pipe. Multiple heat pipes are staggered. This allows efficient heat transfer from the display components to the fins, then into the pipe and out to the ambient.

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