Efficient Thermal Management for Micro-LED Displays

Display panel with improved heat dissipation for micro-LEDs to avoid efficiency loss and extend lifespan. The panel has pixel units with driving circuits between the substrate and light-emitting components. For units with micro-LEDs, the circuit includes a thin-film transistor connected to a metal structure. This forms a heat dissipation path from the micro-LED to the metal layer away from the substrate.

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A backlight unit for displays that uses mini-LEDs or micro-LEDs as light sources for improved contrast and power efficiency is needed. The backlight has a color conversion sheet to convert the LED light, a first diffusion lens sheet with triangular pyramid lenses aligned in one direction and a second diffusion lens sheet with triangular pyramid lenses aligned in another direction at an angle to the first. This separates and diffuses the LED light to reduce hot spots and improve uniformity.

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Temperature sensing circuit for monitoring pixel temperature in high-brightness micro-LED displays without additional components. It uses the temperature-dependent off currents of two different thin film transistors inside the pixel circuitry. The difference in off current between the transistors provides a measure of the pixel temperature.

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A display module with improved luminance and heat emission performance for micro-LED displays. The module has micro-LEDs on a substrate surrounded by a reflective and light-blocking layer. The reflective layer helps capture light emitted from the side of the micro-LED and redirect it forward. The light-blocking layer prevents light leakage, increasing light efficiency and reducing power consumption. The reflective layer also helps dissipate heat from the micro-LED.

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Display module that improves micro-LED displays' luminance and heat emission performance. The module contains micro-LEDs on a substrate, with a reflective layer surrounding the micro-LEDs and a light-blocking layer on top. The reflective layer captures and redirects light emitted from the micro-LEDs' lateral surfaces to increase efficiency. The light-blocking layer prevents lateral light emission. This improves overall luminance by reducing wasteful side light and heat by containing light emission to the front. The layers can be applied via CVD and polished to expose the micro-LED tops.

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Micro-LED display with thermal isolation improves performance and prevents aging at elevated temperatures. The display has a micro-LED chip covered by a transparent micro-cap, forming a sealed chamber. The chamber is filled with vacuum, air, or inert gas to isolate the LED chip from its surroundings thermally.

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Display panel with micro-LED and a heat dissipation structure to reduce temperature and improve lifespan and efficiency. The panel has pixel units with driving circuits between the substrate and light-emitting components. The driving circuit is a thin film transistor for pixel units with micro-LEDs. A metal structure connects the transistor source/drain and the micro-LED electrode. This forms a heat dissipation path from the micro-LED to the metal structure. The metal structure conducts heat away from the micro-LED to reduce its temperature and prevent defects from invading the light-emitting layer.

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A display module with improved luminance and heat emission performance for micro-LED screens. The module includes micro-LEDs on a substrate with a reflective layer surrounding the micro-LEDs' sides and a light-blocking layer on top. The reflective layer helps direct light forward and prevents side emissions, boosting efficiency. The light-blocking layer prevents light leakage.

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LED packages with a heat-dissipating substrate have improved thermal performance compared to conventional circuit boards. The heat-dissipating substrate is a panel-shaped structure with two heat-dissipating blocks and a heat-dissipating plate. Lateral insulating members electrically isolate the blocks and plate. The blocks and plate occupy most of the substrate, providing better thermal conductivity. The insulating members allow the substrate to have an electrically conductive property.

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Heat-dissipating substrate for LED packages with a structure that improves heat dissipation from the LED chip during operation. The substrate has a panel shape with a heat-dissipating block on one side and an insulated heat-spreading plate on the other side. Lateral insulating members electrically isolate the block and plate. The block and plate have microprotrusions on their surfaces to enhance thermal conductivity.

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A micro LED display panel with improved heat dissipation and simplified manufacturing compared to conventional micro LED displays. The display panel has micro LEDs on a glass substrate with electrodes made of graphene for good conductivity and heat dissipation. The micro LEDs are covered with graphene heat dissipation layers. The color conversion layers can also have graphene heat dissipation layers.

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Micro LED display panel with micro LED pixels for high resolution displays. The micro LEDs have a special design to improve manufacturing yield and heat dissipation compared to conventional LEDs. The micro LED has two electrodes that align with the top and bottom semiconductor layers, rather than extending beyond them. This reduces stress on the thin semiconductor layers. The micro LED is used in a display panel with micro LED pixels that can achieve high resolution by packing a large number of tiny micro LEDs.

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MicroLED display panel with improved heat dissipation. The panel has a microLED array substrate that has microLEDs directly connected to the pixel electrodes via a conductive layer. This allows heat generated by the microLEDs to be conducted away through the pixel electrodes and dissipated through the backplane.

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