Thermal Control in Micro-LED Displays

Display device with integrated cooling to prevent overheating of the display panel. The cooling elements are positioned in the pixel array and driven along with the display pixels. A timing controller extracts the data value for each pixel area from the input signal and generates control signals to drive both the display and the cooling elements based on the extracted data. This synchronized driving of the display and cooling elements allows targeted cooling of the pixels with high heat output.

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Semiconductor package design to improve productivity, economic efficiency, thermal characteristics, and reliability. The package has multiple dies on a core layer surrounded by encapsulation material. The core wires extend vertically through the encapsulation and are covered by a conductive layer. An upper pad integrally connects to the uppermost core wire and is also covered by the conductive layer. This allows the upper pad to be above the core wires instead of directly on them. This prevents separation between the pad and encapsulation during processing and reduces cracking. The covered upper pad contacts the encapsulation material and a separate underfill layer separates the top die from the encapsulation. A heat spreader above the dies flattens them to improve thermal spreading.

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Display method for spliced LED (MLED) displays that reduces image sticking and improves display consistency. The method involves compensating the gray scale of sampled frames during playback. The compensation is based on initial gray scale data, filtered temperature influence data, and a target gray scale compensation. This avoids acquiring screen temperature. Compensating frames without temperature measurements improves uniformity and reduces image sticking compared to uncompensated frames.

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Optoelectronic component with improved heat dissipation and method for making it. The component has a semiconductor chip covered by a continuous metallic layer. The outer surface of the metallic layer has a structured pattern that provides identification of the component. The continuous metallic layer provides better heat dissipation compared to a non-continuous layer. The structured surface further increases the surface area for heat dissipation. This improves cooling of the chip and prevents hot spots. The component can also have other functions like electrical contact or barcode. The method involves applying metallic layers and selectively etching them to create the structured outer surface.

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Device and method for bonding phosphor converter tiles to LED dies to form LED devices with uniform and controlled bond layer thickness. The bonding device has an adhesive layer that is non-adhesive at room temperature but becomes adhesive at elevated temperature. This allows precise alignment and bonding of phosphor and LED dies by bringing them together at elevated temperature, then cooling to cure the bond. The uniform thin bond layer is formed between the LED and phosphor due to the adhesive's temperature-dependent adhesion.

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Display device design to reduce heat generation in the outer lines of the display structure. The display has an inner line surrounding the display area, outer lines outside the inner line, and a contact pattern connecting the inner and outer lines. The contact pattern overlaps the outer lines but has non-contact areas between them. An additional connection line is placed in these non-contact areas to electrically connect the inner and outer lines. This prevents concentrated current flow through the outer lines and reduces heat generation compared to directly connecting the inner and outer lines.

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LED display screen with improved heat dissipation for longer lifespan and better performance. The display has an internal heat dissipation mechanism where the display itself can cool down when used for short periods. For longer use, an external heat dissipation mechanism kicks in. It uses a snap-fit outer shell with air outlets and an internal mechanism with moving fan blades. The outer shell has a refrigeration component, expansion panel, and corrugated surface to rapidly lower temperature. This allows the display to operate longer by quickly dissipating heat.

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Ultra-black LED display screen with improved heat dissipation to prevent damage from prolonged use. The display has internal copper sheets, a heat-conducting bracket, through slots, heat dissipation columns, and graphite heat conductors. Heat generated by the LEDs transfers through the copper sheets to the bracket, then to the graphite columns. These columns can be rotated upward to expose them for airflow. This allows efficient heat dissipation through natural convection or forced air.

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An integrated heat dissipation display screen that reduces temperature of display devices like smartphones and tablets during prolonged use. The screen has an active temperature control component with a semiconductor refrigeration piece adhered to a heat dissipation guide plate. The refrigeration piece contacts a temperature equalizing plate. The guide plate has parallel fins for air flow between them. An air drum connected to a motor rotates inside the drum. This integrated setup actively cools the display panel by circulating air through the fins using the rotating drum.

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A double-sided LED display screen with improved heat dissipation to extend display life in high temperature environments. The display has a detachable heat dissipation mechanism between the front and rear LED screens. This mechanism contains a superconducting refrigeration plate, ventilation slots, alloy heat dissipation column, and an axial flow fan. The refrigeration plate contacts the LED screens to transfer heat. The fan accelerates airflow around the refrigeration chip to lower temperatures. The alloy column transfers this low temperature to the LED screens for rapid dissipation. This direct contact cooling with superconducting refrigeration extends display lifespan in hot conditions.

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LED display screen with improved heat dissipation to prevent components from overheating during prolonged operation. The screen has a bottom cover strip that allows air intake at the bottom end, enabling internal air circulation. Hot air generated by components is extracted through a heat-absorbing tube with a small aperture and negative pressure. This prevents large-scale heat diffusion and transference to other components. The tube's fast gas circulation speed and thermal insulation material absorb the hot air without contacting other components, achieving efficient component cooling.

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A heat dissipation structure for display screens that improves cooling efficiency compared to traditional methods. The structure has three cooling stages: a heat conduction stage, an air cooling stage, and a water cooling stage. The heat conduction stage uses a thermally conductive silica gel frame and radiation paint to transfer heat from the display screen to the air. An air cooling mechanism surrounds the heat conduction stage. A water cooling mechanism surrounds the air cooling stage. This multi-stage cooling setup allows efficient heat dissipation from the display screen using multiple cooling mechanisms in sequence.

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LED display screen with a heat dissipation structure to prevent overheating and component damage during long-term operation. The screen has a protective heat sink embedded in the display cover. The heat sink has features like heat conduction rods, pipes, and chambers to conduct and dissipate the internal screen heat. This prevents components from overheating and extends equipment life.

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Heat dissipation device for display chips that improves heat dissipation efficiency compared to traditional cooling methods. The device uses a multi-stage cooling system with a water cooling component, two heat sinks, and a sliding heat sink. The sliding heat sink has a bimetallic sheet that bends when temperatures rise to lower the secondary heat sink onto the water cooling component and turn on a water pump. This sequential cooling stages with progressive cooling helps extract more heat.

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Display module with efficient heat dissipation for applications like automotive displays with high power consumption and multiple IC chips. The module has a heat sink away from the display panel and Peltier-type heat dissipation units attached to it. The Peltier effect allows the heat generated by the display and IC chips to be transferred outward instead of just dissipating it. This combines heat sink and Peltier cooling for improved display module heat dissipation efficiency.

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Display device with improved heat dissipation to prevent overheating of components. The display has a composite thermal management system that efficiently conducts heat generated by the display components to the outside. It uses two thermal conductive film layers around the heat source device. The first layer quickly conducts heat from the device sidewall to the second layer. The second layer has high surface thermal conductivity to evenly distribute the heat. This allows rapid heat transfer from the source to the outside.

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LED display structure with improved heat dissipation to prevent overheating and degradation of the LED chips. The structure uses a heat conduction box, PCB board, LED lamp beads, cooling holes, and a compressible heat conduction material. The LED chips generate heat at the junction which is transferred through the cooling holes in the PCB to the heat conduction material. The material fills the box and contacts the PCB to conduct the heat further. The hole walls have a heat conduction layer. This allows direct heat transfer from the LEDs to the box and prevents hotspots on the PCB. The hole sizes are larger than the LED area for good coverage. The compressible material improves contact and efficiency.

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Display module with improved heat dissipation to prevent temperature rise and prolong display life. The module has a heat dissipation structure with layers stacked on the back of the display panel. The layers include thermally conductive adhesives, a heat conducting layer, and a heat spreading layer. A heat block runs through these layers in a perpendicular direction to the display surface. This directs heat from the display panel to the heat spreading layer for dissipation. The block also prevents relative displacement between the layers. The design enables rapid heat transfer to quickly dissipate heat from the display.

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Display module and display device with improved heat dissipation to prevent overheating and display failure. The display module has a shell with a back plate and side plate. The display panel is positioned in the shell. A heat sink is arranged on the backlight side of the display panel. The heat sink has a heat absorbing portion opposite the back plate and a first heat conducting portion abutting the side plate. This allows heat from the display panel to be absorbed and conducted through the shell to dissipate outside the module. The contact between the heat sink and shell increases to improve heat transfer rate.

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Heat dissipation device for screen display equipment that improves cooling performance without increasing volume or weight compared to prior art. The device has a heat dissipation module sandwiched between two heat conduction modules, one contacting the case and the other contacting the chip. A heat pipe inside the module transfers heat evenly between the modules. This allows direct contact with the hot components and rapid heat conduction through the pipe to distribute heat throughout the device for better overall dissipation.

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