Cost Reduction Strategies for Micro-LED Display Manufacturing

(Summary) Micro LED display substrate fabrication with reduced process steps and costs. The method involves forming a graphene layer on a transfer substrate, growing a micro LED structure on the graphene layer, transferring the micro LED to an organic layer on an array substrate, etching holes through the protective layer and array substrate to expose the LED and transistor electrodes, then depositing a metal layer to electrically connect the LED and transistor.

(Summary) Micro LED device with improved manufacturing efficiency and cost. The method uses a transparent variable resistance material as the protective layer and electrode material. By applying voltage to the protective layer, a conductive filament can be formed in the material, converting it into a transparent electrode layer. This eliminates the need for separate transparent electrodes and simplifies the manufacturing process by reducing the number of required masks.

(Summary) Micro-LED display technology that enables low-cost high-resolution displays with improved yield and reliability. The displays use tiny inorganic LEDs transferred onto a substrate using printing techniques. The LEDs have metal contacts on one side and emit light out the other side. The metal contacts are separated by a small distance, allowing simple interconnection. By transfer printing the LEDs, they can be assembled on large-area substrates. The displays can have high pixel density and yield, and use integrated circuits to control LED sets.

(Summary) A micro-LED display panel with high resolution and no screen door effect while reducing costs. The panel has an array of rectangular active areas on the substrate, each containing a uniform grid of micro-LEDs. Multiple micro-LEDs per pixel allow high resolution without gaps or a screen door effect. Adjusting the number of micro-LEDs per active area also enables cost control while still providing high overall pixel density.

(Summary) A technique to produce high efficiency micro-LED displays with lower manufacturing costs. The technique involves monolithically growing different colored micro-LEDs on the same wafer and transferring them to the display backplane to form pixels. This eliminates the need for separate growth and transfer steps for each micro-LED color. For example, blue and green micro-LEDs can be grown together in a "BG" structure, then transferred as a unit to the backplane.

(Summary) Micro-LED array display manufacturing method that enables wafer level transfer of micro-LEDs to improve yield and reduce cost. The method involves temporarily bonding micro-LEDs on a donor wafer to a carrier substrate, lifting them off the donor wafer using laser irradiation, transferring them to a transfer head substrate, bonding them to a receiving display substrate, and finally removing the transfer head to leave the micro-LEDs on the display. This allows selective transfer of only good micro-LEDs, repair of defects, and use of laser-transparent substrates.

(Summary) Micro LED display panel configuration that provides high-resolution with reduced screen-door effect and lower manufacturing cost compared to using numerous micro LEDs per pixel. The panel has an array of rectangular active areas on the substrate, with each area containing a uniform distribution of micro LEDs. The number of micro LEDs per area can be optimized to balance resolution and cost. This arrangement allows achieving high resolution without requiring a micro LED for every subpixel area, avoiding the screen-door effect.