Manufacturing Ultra High Resolution Micro-LED Displays

Light emitting assembly with micro-LEDs that allows efficient transfer printing without yield loss. The micro-LED structure has bridging arms connecting to a supporting substrate. The arms are thinner than the surrounding dielectric layer on the mesa surface. During transfer, the thinner arms break cleanly leaving a small residue on the LED side wall. This avoids remaining arm fragments that can impede operation. The thin arms require less force to separate compared to equal width arms, improving yield. The thinner arms also allow higher density packing of micro-LEDs on the substrate without collisions.

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LED assembly with vertical micro LED alignment that improves light efficiency, quantity, and integration compared to horizontally aligned micro LEDs. The vertical alignment is achieved by inserting micro LEDs into through holes in a substrate. This allows the LEDs to be aligned and fixed in an upright position without overlapping electrodes. It also enables higher packing density and better light extraction as the LEDs emit perpendicular to the substrate surface. The alignment process involves suspending the micro LEDs and flowing them into the through holes.

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Fabrication method for integrated multi-color LED display panels that enables mass production of high resolution, high color gamut, and high brightness microLED displays. The method involves stacking multiple strata of microLEDs on top of a supporting substrate with the pixel driver circuitry already integrated. This allows efficient, high yield fabrication of stacked microLED displays with thousands to millions of pixels. The stacking process involves bonding, patterning, filling, and planarizing the microLED epitaxial layers.

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Micro LED display panel and manufacturing method to improve efficiency and resolution of micro LED displays. The method involves transferring micro LED chips onto a substrate with reflective bottom electrodes that have flanges extending around the chips. The flanges are trumpet-shaped and pasted to the substrate inner walls. This allows the LED chips to be closer together and reduces light absorption by the substrate. The flanges also reflect light back into the LEDs. The top electrode covers the LEDs. A protective layer encloses the chips. The bottom electrode extends into a recess in the substrate.

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