4 patents in this list

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Creating ultra high resolution micro-LED displays involves precise manipulation of tiny light-emitting diodes, each thinner than a human hair. The challenge lies in assembling these minuscule components onto a substrate with perfect alignment and minimal defects. As manufacturers strive to meet the demand for sharper, more vibrant screens, the complexity of this task grows exponentially.

Key hurdles include ensuring uniform brightness, preventing current leakage, and achieving seamless integration with driving circuits. Each step, from transferring micro-LEDs to aligning them precisely, requires meticulous attention to detail. The manufacturing process must balance efficiency with the need for high-quality output, all while managing costs and minimizing waste.

This page outlines various engineering approaches and research findings that address these challenges. Techniques such as innovative layer transfer, precision alignment, and selective etching are discussed. These solutions enhance manufacturing efficiency, improve display performance, and pave the way for the next generation of high-resolution screens.

1. Light Emitting Assembly with Micro-LEDs Featuring Thin Bridging Arms for Substrate Attachment and Separation

XIAMEN SAN'AN OPTOELECTRONICS CO., LTD., 2023

Light emitting assembly with micro-LEDs that allows efficient transfer printing without yield loss. The micro-LED structure has bridging arms connecting to a supporting substrate. The arms are thinner than the surrounding dielectric layer on the mesa surface. During transfer, the thinner arms break cleanly leaving a small residue on the LED side wall. This avoids remaining arm fragments that can impede operation. The thin arms require less force to separate compared to equal width arms, improving yield. The thinner arms also allow higher density packing of micro-LEDs on the substrate without collisions.

US20230155071A1-patent-drawing

2. Vertical Micro LED Assembly with Through-Hole Substrate Alignment

Chi-Young Yoon, Bae-Gun Jung, 2022

LED assembly with vertical micro LED alignment that improves light efficiency, quantity, and integration compared to horizontally aligned micro LEDs. The vertical alignment is achieved by inserting micro LEDs into through holes in a substrate. This allows the LEDs to be aligned and fixed in an upright position without overlapping electrodes. It also enables higher packing density and better light extraction as the LEDs emit perpendicular to the substrate surface. The alignment process involves suspending the micro LEDs and flowing them into the through holes.

US11521954B2-patent-drawing

3. Method for Fabricating Stacked Multi-Strata MicroLED Display Panels with Integrated Pixel Driver Circuitry

Hong Kong Beida Jade Bird Display Limited, 2020

Fabrication method for integrated multi-color LED display panels that enables mass production of high resolution, high color gamut, and high brightness microLED displays. The method involves stacking multiple strata of microLEDs on top of a supporting substrate with the pixel driver circuitry already integrated. This allows efficient, high yield fabrication of stacked microLED displays with thousands to millions of pixels. The stacking process involves bonding, patterning, filling, and planarizing the microLED epitaxial layers.

4. Micro LED Display Panel with Trumpet-Shaped Flanged Reflective Bottom Electrodes and Associated Manufacturing Method

SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD, 2019

Micro LED display panel and manufacturing method to improve efficiency and resolution of micro LED displays. The method involves transferring micro LED chips onto a substrate with reflective bottom electrodes that have flanges extending around the chips. The flanges are trumpet-shaped and pasted to the substrate inner walls. This allows the LED chips to be closer together and reduces light absorption by the substrate. The flanges also reflect light back into the LEDs. The top electrode covers the LEDs. A protective layer encloses the chips. The bottom electrode extends into a recess in the substrate.