Transparent Micro-LED Display Fabrication

Transparent display device using LEDs that improves color uniformity, viewing angles, and thickness while maintaining high brightness. The display has a transparent substrate with individual LED pixels. Each pixel has a light emitting unit with red, green, and blue LEDs on a wiring board. A driving chip drives the LEDs. An encapsulation layer covers the LEDs and chip. A planarization layer and cover glass are added. To enhance light extraction, the display uses lens structures like micro lens arrays and unit lenses. This improves beam angles, viewing uniformity, and color uniformity. The lens structures can be attached to the encapsulation layer or formed directly on it. The lens thickness can be adjusted to balance light extraction and display thickness. The driving chip is spaced from the LEDs to avoid blocking light.

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Flexible and transparent smart display screen that can be applied to curved surfaces like curved glass windows and doors without affecting indoor lighting. The display has a flexible bottom layer, a transparent packaging layer, and a display layer sandwiched in between with flexible wire groups connecting the LED lights. This allows the screen to bend and conform to curved surfaces unlike rigid displays. It also enables it to be installed on glass windows and doors without obstructing indoor light as the transparent bottom layer allows light to pass through. The flexible design and transparent bottom layer make it suitable for energy efficient curved glass installations where conventional displays cannot be used.

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Reducing edge light leakage in tiled displays with microLEDs to eliminate visible seams between adjacent small-format displays. The solution involves using thin, high-transparency optically clear adhesive (OCA) layers between the microLEDs, substrate, and cover glass. The OCA layers have thicknesses between 0.005-0.2 mm, transmittance between 40-95%, and refractive indices between 1.1-1.6. This reduces edge light reflection and refraction at the boundaries of the tiled displays.

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Ultra-high pixel density microLED display with improved performance and manufacturability for applications like virtual reality, augmented reality, and wearables. The display has microLEDs and transistors stacked together as a single structure. To address issues with the thin film transistors (TFTs) in close proximity to the microLEDs, a field shielding member is inserted between them. This shield prevents TFT field distortion from the microLEDs during operation. The shield is electrically insulated from the microLEDs and TFTs. The microLEDs are formed first, then the shield, interlayer insulation, TFT, and metal contacts.

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A display device using micro LEDs that simplifies manufacturing compared to traditional micro LED displays with separate red, green, and blue subpixels. The display uses white micro LEDs and superlens filters instead of separate colored micro LEDs. The superlens filters are periodically arranged structures that modify the emerging light from the white micro LEDs to extract specific colors while blocking others. This allows full-color display by using just white micro LEDs instead of separate red, green, and blue LEDs. The superlens filters simplify manufacturing by eliminating the need for transferring and aligning multiple colored micro LEDs.

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Transparent display using stacked micro LED subpixels to improve transparency and reduce wiring losses compared to conventional transparent displays. The display has multiple stacked subpanels, each containing red, green, and blue micro LEDs in their own pixel area. This allows using the full pixel area for wiring and scan electrodes instead of shared transparent electrodes. The subpanels are stacked with overlapping micro LEDs to form a composite pixel. The stacked structure provides a large transparent area and reduces wiring losses compared to conventional displays where the transparent wiring area is limited by the pixel pitch.

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A split display module design for LED displays that improves brightness and contrast compared to conventional displays. The module has a sub-circuit board with LED packages mounted on it. The LED packages have a substrate, micro LED chips, black material, and a transparent layer. The substrate width is greater than 4 times the transparent layer thickness. This configuration allows higher brightness and contrast by reducing reflections from external light. The black material exposes the micro LEDs and the thick transparent layer reduces reflections.

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Micro LED microdisplay device structure with low crosstalk and small size, achieved by flipping the micro LED array and bonding it to the driving circuit instead of directly attaching the LED wafer. This allows etching the LED substrate after bonding to separate the pixels. Black filling or a reflective layer between pixels absorbs/reflects light that would otherwise leak and cause crosstalk. The microdisplay structure has flip-chip bonded micro LED array, driving circuit, and separated pixels with reduced crosstalk compared to direct bonding.

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Transparent LED display screen with improved transparency by using bare LED chips without encapsulation instead of traditional packaged LEDs. The display has a transparent substrate with circuitry, and bare LED chips arranged on it. Each bare chip has a driving chip and light-emitting chip stacked together. The display uses power jumpers to connect the bare chips directly to the power lines instead of series connections through wiring. This reduces the number of connections and obstruction of conductive material for better transparency. The bare chips are much smaller than packaged LEDs, allowing high resolution and pitch. The power jumper connections enable direct powering of the bare chips without needing to pass through each one.

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Micro LED display device that provides higher resolution and yield compared to conventional micro LED displays. The display has a micro LED array on a circuit board. The micro LED units are electrically connected to the board and emit light. The micro LED structure has a metal conductive layer above it with through-holes for each LED. A conversion layer is in some of the holes to change the LED light. Shields cover the metal layer except where conversion is needed. This prevents crosstalk between LEDs. The metal layer thickness is greater than the LED layer.

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Transparent LED display with improved transparency and resolution compared to conventional transparent LED displays. The display uses bare LED chips without the typical encapsulating shell. The bare LED chips are arranged on a transparent substrate instead of the conventional LED modules. The bare chips are much smaller, allowing reduced pixel pitch and higher resolution. Power and signals are transmitted using jumper wires instead of internal connections. This reduces obstruction of the display transparency. The bare chips have dual power pins for connecting through jumpers.

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A transparent LED display with improved transparency compared to existing designs. The display uses bare LED chips without encapsulation, arranged in high density on a transparent substrate. The LED chips have driver circuits integrated, eliminating the need for separate packaged LEDs. The chips are connected in parallel instead of series to reduce the number of connections. Power and signals are provided to the chips using thin jumper wires. This allows very small pixel pitches and high resolution while maintaining high transparency due to fewer obstructions from conductive materials.

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LED display device with improved luminance and resolution, and reduced pixel defects. The display uses LED elements with dual emission spectra controlled by separate pixel circuits. Each subpixel has two LEDs, one driven by the main pixel circuit and the other by a separate circuit. This allows the subpixel to emit a wider gamut of light by combining spectra. It also provides redundancy as a working LED can compensate for a failed one. The dual-spectrum LEDs are stacked and bonded to a growth substrate. A reflection layer contacts the substrate to enable double-sided emission.

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Flexible transparent LED display with improved durability and firmness by using a thin-film adhesive layer between the LED chips and substrate. The display has a flexible transparent substrate with conductive circuits. LED chips and flexible circuit boards are attached to the substrate using a dry adhesive film. This film provides additional rigidity and protection for the fragile LEDs while still allowing flexibility. A transparent cover film is placed over the adhesive. The adhesive is a soft, transparent, low-tack material like polyethylene vinyl acetate copolymer that bonds without curing at low temperatures.

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Micro LED transparent display that can be set up on demand, and a displaying luminance of the micro LED transparent display can be suitably adjusted. The display includes a substrate, a plurality of pixels, a flat layer, and at least one grating layer.

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Transparent LED display screen with improved transparency compared to conventional transparent LED displays. The display uses bare LED chips without encapsulation that are much smaller than regular LEDs. The bare chips are arranged on a transparent substrate instead of traditional LED arrays. The smaller chip size allows for much finer pixel pitch and higher resolution. The display also uses thinner bonding wires for power and signal connections to further reduce obstruction of light transmittance.

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Micro LED display with refraction structures to improve brightness and color accuracy. Each micro LED has a corresponding refraction structure placed on the substrate. The refraction structure changes the light emitting direction of the micro LED to increase forward brightness. It also reduces light mixing between LEDs of different colors to improve color fidelity when viewed from angles.

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Micro LED display device with reduced crosstalk and improved brightness. The device has a reflecting layer on the side walls of the LED units to prevent light leakage and crosstalk between adjacent pixels. This is achieved by a fabrication process where a sacrificial layer is deposited first, then the reflecting layer, and finally the sacrificial layer is removed. This allows forming the reflecting layer only on the side walls without etching. The reflecting layer blocks spontaneous emission from the side walls and reflects light back into the LED, improving brightness. The reflecting layer is discontinuous due to the sacrificial layer thickness, allowing stripping of both together.

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Micro LED display with improved reliability, viewing quality, and manufacturing cost compared to existing methods. The display has micro LED chips with structures on their surfaces that penetrate the encapsulation film when it is softened and pressed onto the chips. This tightly bonds the chips to the substrate and eliminates gaps between them. The encapsulation film is softened by heating or IR before pressing. This simplifies the process by eliminating an additional coating step and reduces cost compared to applying glue. The encapsulation film can be divided into blocks that separately cover groups of chips.

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Transparent LED display with improved transparency and touch sensitivity. The display structure uses transparent conductive layers instead of opaque wires to eliminate visible grid lines. The LEDs are mounted on a transparent base material, and connections are made using transparent conductive circuits printed on the base. The display also has a touch layer with transparent conductive circuits that can be used for touch input. The entire display, including the LEDs, touch layer, and connections, is sandwiched between transparent materials for a fully transparent display.

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