Transparent Micro-LED Display Fabrication

Transparent display device using LEDs that improves color uniformity, viewing angles, and thickness while maintaining high brightness. The display has a transparent substrate with individual LED pixels. Each pixel has a light emitting unit with red, green, and blue LEDs on a wiring board. A driving chip drives the LEDs. An encapsulation layer covers the LEDs and chip. A planarization layer and cover glass are added. To enhance light extraction, the display uses lens structures like micro lens arrays and unit lenses. This improves beam angles, viewing uniformity, and color uniformity. The lens structures can be attached to the encapsulation layer or formed directly on it. The lens thickness can be adjusted to balance light extraction and display thickness. The driving chip is spaced from the LEDs to avoid blocking light.

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Flexible and transparent smart display screen that can be applied to curved surfaces like curved glass windows and doors without affecting indoor lighting. The display has a flexible bottom layer, a transparent packaging layer, and a display layer sandwiched in between with flexible wire groups connecting the LED lights. This allows the screen to bend and conform to curved surfaces unlike rigid displays. It also enables it to be installed on glass windows and doors without obstructing indoor light as the transparent bottom layer allows light to pass through. The flexible design and transparent bottom layer make it suitable for energy efficient curved glass installations where conventional displays cannot be used.

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Reducing edge light leakage in tiled displays with microLEDs to eliminate visible seams between adjacent small-format displays. The solution involves using thin, high-transparency optically clear adhesive (OCA) layers between the microLEDs, substrate, and cover glass. The OCA layers have thicknesses between 0.005-0.2 mm, transmittance between 40-95%, and refractive indices between 1.1-1.6. This reduces edge light reflection and refraction at the boundaries of the tiled displays.

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Ultra-high pixel density microLED display with improved performance and manufacturability for applications like virtual reality, augmented reality, and wearables. The display has microLEDs and transistors stacked together as a single structure. To address issues with the thin film transistors (TFTs) in close proximity to the microLEDs, a field shielding member is inserted between them. This shield prevents TFT field distortion from the microLEDs during operation. The shield is electrically insulated from the microLEDs and TFTs. The microLEDs are formed first, then the shield, interlayer insulation, TFT, and metal contacts.

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A display device using micro LEDs that simplifies manufacturing compared to traditional micro LED displays with separate red, green, and blue subpixels. The display uses white micro LEDs and superlens filters instead of separate colored micro LEDs. The superlens filters are periodically arranged structures that modify the emerging light from the white micro LEDs to extract specific colors while blocking others. This allows full-color display by using just white micro LEDs instead of separate red, green, and blue LEDs. The superlens filters simplify manufacturing by eliminating the need for transferring and aligning multiple colored micro LEDs.

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Transparent display using stacked micro LED subpixels to improve transparency and reduce wiring losses compared to conventional transparent displays. The display has multiple stacked subpanels, each containing red, green, and blue micro LEDs in their own pixel area. This allows using the full pixel area for wiring and scan electrodes instead of shared transparent electrodes. The subpanels are stacked with overlapping micro LEDs to form a composite pixel. The stacked structure provides a large transparent area and reduces wiring losses compared to conventional displays where the transparent wiring area is limited by the pixel pitch.

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A split display module design for LED displays that improves brightness and contrast compared to conventional displays. The module has a sub-circuit board with LED packages mounted on it. The LED packages have a substrate, micro LED chips, black material, and a transparent layer. The substrate width is greater than 4 times the transparent layer thickness. This configuration allows higher brightness and contrast by reducing reflections from external light. The black material exposes the micro LEDs and the thick transparent layer reduces reflections.

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Micro LED microdisplay device structure with low crosstalk and small size, achieved by flipping the micro LED array and bonding it to the driving circuit instead of directly attaching the LED wafer. This allows etching the LED substrate after bonding to separate the pixels. Black filling or a reflective layer between pixels absorbs/reflects light that would otherwise leak and cause crosstalk. The microdisplay structure has flip-chip bonded micro LED array, driving circuit, and separated pixels with reduced crosstalk compared to direct bonding.

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Transparent LED display screen with improved transparency by using bare LED chips without encapsulation instead of traditional packaged LEDs. The display has a transparent substrate with circuitry, and bare LED chips arranged on it. Each bare chip has a driving chip and light-emitting chip stacked together. The display uses power jumpers to connect the bare chips directly to the power lines instead of series connections through wiring. This reduces the number of connections and obstruction of conductive material for better transparency. The bare chips are much smaller than packaged LEDs, allowing high resolution and pitch. The power jumper connections enable direct powering of the bare chips without needing to pass through each one.

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Micro LED display device that provides higher resolution and yield compared to conventional micro LED displays. The display has a micro LED array on a circuit board. The micro LED units are electrically connected to the board and emit light. The micro LED structure has a metal conductive layer above it with through-holes for each LED. A conversion layer is in some of the holes to change the LED light. Shields cover the metal layer except where conversion is needed. This prevents crosstalk between LEDs. The metal layer thickness is greater than the LED layer.

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Transparent LED display with improved transparency and resolution compared to conventional transparent LED displays. The display uses bare LED chips without the typical encapsulating shell. The bare LED chips are arranged on a transparent substrate instead of the conventional LED modules. The bare chips are much smaller, allowing reduced pixel pitch and higher resolution. Power and signals are transmitted using jumper wires instead of internal connections. This reduces obstruction of the display transparency. The bare chips have dual power pins for connecting through jumpers.

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A transparent LED display with improved transparency compared to existing designs. The display uses bare LED chips without encapsulation, arranged in high density on a transparent substrate. The LED chips have driver circuits integrated, eliminating the need for separate packaged LEDs. The chips are connected in parallel instead of series to reduce the number of connections. Power and signals are provided to the chips using thin jumper wires. This allows very small pixel pitches and high resolution while maintaining high transparency due to fewer obstructions from conductive materials.

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LED display device with improved luminance and resolution, and reduced pixel defects. The display uses LED elements with dual emission spectra controlled by separate pixel circuits. Each subpixel has two LEDs, one driven by the main pixel circuit and the other by a separate circuit. This allows the subpixel to emit a wider gamut of light by combining spectra. It also provides redundancy as a working LED can compensate for a failed one. The dual-spectrum LEDs are stacked and bonded to a growth substrate. A reflection layer contacts the substrate to enable double-sided emission.

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Flexible transparent LED display with improved durability and firmness by using a thin-film adhesive layer between the LED chips and substrate. The display has a flexible transparent substrate with conductive circuits. LED chips and flexible circuit boards are attached to the substrate using a dry adhesive film. This film provides additional rigidity and protection for the fragile LEDs while still allowing flexibility. A transparent cover film is placed over the adhesive. The adhesive is a soft, transparent, low-tack material like polyethylene vinyl acetate copolymer that bonds without curing at low temperatures.

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Micro LED transparent display that can be set up on demand, and a displaying luminance of the micro LED transparent display can be suitably adjusted. The display includes a substrate, a plurality of pixels, a flat layer, and at least one grating layer.

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Transparent LED display screen with improved transparency compared to conventional transparent LED displays. The display uses bare LED chips without encapsulation that are much smaller than regular LEDs. The bare chips are arranged on a transparent substrate instead of traditional LED arrays. The smaller chip size allows for much finer pixel pitch and higher resolution. The display also uses thinner bonding wires for power and signal connections to further reduce obstruction of light transmittance.

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Micro LED display with refraction structures to improve brightness and color accuracy. Each micro LED has a corresponding refraction structure placed on the substrate. The refraction structure changes the light emitting direction of the micro LED to increase forward brightness. It also reduces light mixing between LEDs of different colors to improve color fidelity when viewed from angles.

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Micro LED display device with reduced crosstalk and improved brightness. The device has a reflecting layer on the side walls of the LED units to prevent light leakage and crosstalk between adjacent pixels. This is achieved by a fabrication process where a sacrificial layer is deposited first, then the reflecting layer, and finally the sacrificial layer is removed. This allows forming the reflecting layer only on the side walls without etching. The reflecting layer blocks spontaneous emission from the side walls and reflects light back into the LED, improving brightness. The reflecting layer is discontinuous due to the sacrificial layer thickness, allowing stripping of both together.

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Micro LED display with improved reliability, viewing quality, and manufacturing cost compared to existing methods. The display has micro LED chips with structures on their surfaces that penetrate the encapsulation film when it is softened and pressed onto the chips. This tightly bonds the chips to the substrate and eliminates gaps between them. The encapsulation film is softened by heating or IR before pressing. This simplifies the process by eliminating an additional coating step and reduces cost compared to applying glue. The encapsulation film can be divided into blocks that separately cover groups of chips.

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Transparent LED display with improved transparency and touch sensitivity. The display structure uses transparent conductive layers instead of opaque wires to eliminate visible grid lines. The LEDs are mounted on a transparent base material, and connections are made using transparent conductive circuits printed on the base. The display also has a touch layer with transparent conductive circuits that can be used for touch input. The entire display, including the LEDs, touch layer, and connections, is sandwiched between transparent materials for a fully transparent display.

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Micro-LED displays with improved yield, reliability, and manufacturability by using microtransfer printing to assemble ultra-small LEDs onto non-LED substrates. The displays have LED arrays too small, too large, or too fragile to be assembled conventionally. The LEDs are transferred from a growth substrate to the display substrate using microtransfer printing techniques. This allows LEDs to be formed on different substrates optimized for growth vs display applications. The LEDs have close spaced anode and cathode contacts on the same side for easier interconnection. The display substrate is non-homogeneous to the LEDs. This enables stacked LED displays and avoids LED growth on display substrates. The close spaced contacts allow vertical isolation between LED terminals. The displays can have microLEDs too small to pick and place, with widths and lengths as small as 0.5um.

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A thin and compact double-sided display that allows viewing from both sides without needing separate displays. It achieves this by integrating LEDs directly onto the glass substrate of the display and using transparent electrode lines on the glass to connect them. The LEDs emit light from both sides and are matched with optical films for brightness. The display panels and glass substrate are sandwiched between frames for structure. This eliminates the need for separate backlights and thick displays.

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Integrated LED display module for high resolution and transparency displays with simpler circuitry and improved heat dissipation compared to conventional modules. The module has a matrix of LEDs directly bonded to an integrated circuit (IC) chip on a glass substrate. The IC chip controls the LEDs. This eliminates the need for a separate PCB between the LEDs and IC, simplifying the circuitry. The glass substrate provides better heat dissipation compared to a PCB. Multiple modules can be spliced together to form a larger display.

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MicroLEDs with micro-lenses for efficient optical coupling into display systems. The microLEDs have sloping mesa sidewalls and a back reflector. The micro-lenses extract light from the microLEDs and direct the chief ray to specific angles. This compensates for the microLED array's chief ray offset to match display field of view. The sloping mesa shapes and collimated beam profiles improve extraction efficiency. The micro-lens array pitch is different from the microLED array to match lens centers to LED centers. This focuses light into the display system.

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High PPI color Micro-LED display with over 1500 pixels per inch resolution, achieving both high pixel density and color display. The display uses stacked transparent film layers containing arrays of microLED chips of different colors. The lower layer has green microLEDs, the middle layer has blue microLEDs, and the top layer has red microLEDs. The films are bonded to an optical glass substrate using optical adhesive. This allows forming a compact, high PPI color display by stacking the color layers instead of using a single microLED layer.

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A transparent display panel with subpixels containing micro LEDs and transparent regions to enable both display content and external scene viewing. The transparent regions surround the opaque micro LEDs to allow light transmission. The display uses micro LEDs driven by integrated circuits for high brightness and efficiency. The transparent regions are made of materials like glass or organic insulating layers with openings matching the subpixel layout. This allows external light to pass through while blocking light emitted by the micro LEDs. The transparent display can be used in applications like augmented reality, vehicle displays, and transparent signage where viewers can see both the display and the surrounding environment.

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Display device using micro LEDs with reduced thickness and improved color clarity, visibility, and assembly efficiency. The display uses a thin film transistor (TFT) substrate with a connection pad for each pixel. A thin resin layer connects the TFT to a micro LED package containing multiple subpixels. This reduces the overall thickness of the display. The LED package has a transparent resin layer between the LED chips and the connection wiring. The thin LEDs and resin layers prevent step differences and diffuse reflection. The TFT layout allows integrating sensors on the same pad.

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Display screen for head-mounted displays like VR/AR glasses that improves resolution, brightness, and battery life compared to existing displays. The screen uses Micro LED chips driven by a CMOS integrated circuit substrate. The Micro LED chips are sealed under an optical layer to protect them. This allows high resolution, brightness, and efficiency from the Micro LEDs while the CMOS drive substrate provides power and signal connections. The sealed package also improves durability and water resistance. The display screen can be integrated into head-mounted devices like VR/AR glasses.

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Flexible transparent LED display film with improved heat dissipation and flexibility compared to traditional displays. The display film has a multi-layer structure with an upper packaging film, LED layer, circuit layer, bottom layer, and lower packaging film. The layers are connected in sequence. This allows the display to be cut and shaped flexibly. The design includes heat dissipation holes to prevent internal temperature buildup. The display uses transparent nano silver wires for high transparency and brightness. The layered structure and heat dissipation holes enable flexible, transparent, high-performance LED displays.

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Micro LED display device with a Fresnel lens assembly to enlarge the displayed images and increase the effective display size while using micro LEDs with their high brightness. The display has a matrix of micro LED modules, with a Fresnel lens above each module. The Fresnel lenses are arranged in a plate. This enlarges the images from each module and combines them into a single integrated image. This allows using arrays of small micro LED modules to create larger displays with the benefits of micro LED brightness.

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MicroLED display array design to reduce optical crosstalk between pixels and improve display quality. The design involves roughening the surface between individual pixels in the current mainstream MicroLED array. This forms a hemispherical or cone-shaped surface on the n-GaN layer between the gaps of a single device. This allows light to leak out at the rough surface instead of continuing to reflect and propagate in the channel between pixels. This greatly reduces the optical crosstalk between a single MicroLED pixel and improves image fidelity and color contrast.

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A flexible transparent LED display with improved robustness and touch sensitivity by using a film lamination process. The display has a flexible substrate with connected LED chips and flexible circuitry. A dry adhesive layer is applied to the substrate surface, the LED chips, and the circuitry ends. A high-transparency film is then laminated on top of the adhesive. This film-laminated structure provides impact protection, touch sensitivity, and airtightness to the flexible transparent display without compromising light transmittance or flexibility.

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Micro LED display with improved yield and defect tolerance by using sub-pixels with redundant emitters. In this design, each pixel has multiple sub-pixels, at least three emitting red, green, and blue light respectively. If any sub-pixel fails, the other sub-pixels compensate. This allows replacing defective emitters with working ones during manufacturing. It also allows using color conversion layers in sub-pixels with failed emitters. This improves display yield by reducing non-functional pixels.

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Transparent LED display screen that can be truly transparent and can be integrated into glass structures like building facades. The display has a sandwiched transparent adhesive layer between two transparent substrate layers. The LED light source is embedded in the adhesive layer and emits light through the substrates to make the display transparent. The LEDs are completely buried in the adhesive so light doesn't pass through them. This allows the display to be truly transparent when turned on, as the light signal sequentially passes through the adhesive, substrates, and exits the display.

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Micro LED display with reduced color crosstalk and simplified manufacturing compared to conventional Micro LED displays. The display uses a time-sharing Fabry-Perot (FP) light control layer between the color conversion layer and substrate. This layer selectively transmits red, green, or blue light. A control circuit chooses which color to transmit through the FP layer. This eliminates the need for blue Micro LEDs in each subpixel, reducing crosstalk and simplifying manufacturing compared to conventional Micro LED displays where each subpixel has a blue Micro LED.

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Micro LED display device with improved efficiency, color accuracy, and viewing angle compared to conventional micro LED displays. The device has a micro LED array, a layer of quantum dots above the LEDs, a color filter, and a polarizer. The quantum dots convert the LED emission to desired colors for the color filter. This enables using simpler, higher efficiency quantum dot conversion instead of relying solely on color LEDs for full color. The color filter and polarizer are stacked above the LEDs and quantum dots.

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Flexible display that transmits light while showing images. The display has color LEDs mounted at regular intervals on one side of a flexible transparent film. Power lines on the edges of the film supply power to the LEDs. This allows the display to show images while transmitting light through the transparent film. It provides a way to display content while still letting light pass through, like a transparent window with an integrated display.

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Micro LED display device with improved light extraction efficiency using an optical resin layer with specific refractive index and transparency. The display has an array substrate with micro LEDs on one side, an optical resin layer between the LEDs, and a transparent layer on top. The optical resin has a refractive index of 1.40-1.60 and 90% or higher transparency to enhance light extraction from the micro LEDs.

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Reducing crosstalk in microLED displays by roughening the surface between individual pixels. This involves forming a hemispherical or conical surface on the n-GaN layer between the gaps of a single device. This allows light from the channel between the GaN layers to penetrate through the rough surface before reaching the adjacent device, reducing the optical crosstalk between pixels.

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Micro-LED display with high resolution, increased light emitting area, and densely packed transistors and LEDs for micro-pixel sub-pixels. The display has a micro-LED and switching transistor densely stacked in each pixel, with a driving transistor below. The micro-LED and transistors are vertically integrated in a layered structure. The LED and switching transistor share a common channel layer and have separate supply and forming layers. The driving transistor has a vertical channel. This allows compact micro-pixels with all components in a small area. It also expands the LED emitting region compared to horizontally arranged transistors. The stacked design enables dense packing of micro-LEDs and transistors, increasing pixel density and resolution.

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Miniature LED transparent display with improved transparency and reduced crosstalk between pixels compared to traditional displays. The display uses arrays of micro LEDs in each pixel surrounded by walls that enclose the micro LEDs instead of having the walls along the pixel edges. This reduces the wall length and allows more light to pass through the display while preventing light leakage between pixels.

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Low-power, high-brightness integrated color microLED display. The display is fabricated by a method involving growing a blue LED epitaxial layer on a sapphire substrate, patterning openings in the blue LED layer to expose the underlying substrate, forming ohmic contacts on the exposed substrate, and transferring the blue LED array onto a receiving substrate with drivers. A color conversion layer is added to change the blue light to other colors. This provides a compact, self-contained microLED display with integrated color conversion.

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Laminated micro LED display screen with improved manufacturing feasibility for larger displays like TVs. The screen has a glass substrate, a transparent circuit layer in the middle, and multiple groups of die-bonded LED layers on top. These LED layers have red, green, and blue subpixels stacked in staggered positions to form a full color display. This reduces the welding accuracy requirements compared to side-by-side RGB subpixels. It allows easier assembly of high resolution micro LED displays with better yield and cost.

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Micro LED display module with improved heat dissipation to prevent damage to the micro LED chips and maintain adhesion of the external light absorbing sheet. The module has an adhesive layer covering the micro LED chips and an external light absorbing sheet on top. The light absorbing sheet has heat dissipation holes arranged in a matrix. Micro LED pixels are positioned between the heat dissipation holes. This allows heat generated by the LEDs to radiate through the holes and adhesive layer recesses to the outside, preventing buildup that can damage the LEDs or detach the sheet.

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Micro LED display module with improved heat dissipation and reduced light leakage compared to conventional designs. The module has an external light absorbing sheet with heat dissipation holes covering the adhesive layer. The holes allow heat generated by the micro LEDs to radiate to the outside. They are positioned between adjacent pixels to avoid blocking light. This prevents thermal damage to the LEDs and prevents the absorbing sheet from falling off. The sheet also absorbs external light. Without the gaps between black films in conventional assemblies, it reduces light leakage between modules.

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Micro LED display screen with improved transparency and flexibility compared to traditional LED displays. The display has a stacked structure with a transparent substrate, solar cell, conductive layer, and micro LED emitter layer. The micro LED emits light into a light guide plate that diffusely reflects and spreads the light, providing uniform display. This eliminates the need for opaque black backing materials and allows transparency. The solar cell allows the display to be self-powered.

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Penetrating display device for augmented reality that provides high resolution and transparency. The display uses micro LED dies with small pixel sizes and emitting in red, green, and blue. The micro LEDs are arranged on a thin transparent substrate with metal circuits. The micro LED area is less than 10% of the substrate. The micro LED beams penetrate the substrate and are covered by a transparent plate. A bonding layer seals between the substrate and plate. This allows high resolution and transparency since the micro LED area is small. The display can be used in augmented reality devices like headsets with curved displays matching the wearable body shape. The display connects to an onboard processing device.

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Micro LED display panel with double-sided display capability. The panel has a thin film transistor (TFT) substrate with spaced apart micro LEDs on it. Unlike conventional micro LED displays that only show images from one side, this panel allows display on both sides. This is achieved by having the TFT circuitry on one side and the micro LEDs on the opposite side, enabling separate images to be displayed on each side. The panel can have electrical connections to the TFT and micro LEDs from both sides or through the substrate.

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Micro LED display with reduced color crosstalk and improved display quality. The display uses a unique structure with a driving substrate, encapsulation layer, color filter substrate, and patterned convex feature. The blue Micro LEDs are arranged on the driving substrate facing the color filter substrate. An encapsulation layer covers the blue Micro LEDs. The convex feature is on the color filter substrate. This design prevents lateral light spread from adjacent pixels by directing the light through the color filter substrate and encapsulation layer. The convex feature further reduces color crosstalk.

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Display module with improved luminance and heat dissipation for microLED displays. The module has microLEDs on a substrate with reflective layers around the lateral sides and a light blocking layer on top of the reflective layer. This reflects more light from the microLED edges and prevents lateral light escape. It also helps contain the heat generated by the microLEDs. The reflective layers are heat-cured to prevent damage to the microLEDs. The blocking layer prevents light leakage from the edges. This improves luminance and reduces power consumption by better utilizing the microLED light. It also reduces heat damage to the microLEDs and components.

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