Micro-LEDs for Commercial Signage

Micro LED array display device that enables individually driving and controlling micro LED pixels using flip chip bonding on a CMOS backplane. The display has a micro LED panel with multiple pixels, a CMOS backplane with cells corresponding to each pixel, and bumps between them. The micro LED pixels are flip chip bonded to the CMOS cells to drive them individually. This simplifies wiring and eliminates data lines compared to connecting each pixel. The display can also be a full color implementation with red, green, and blue micro LED panels bonded to the same CMOS backplane.

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LED light control circuit for intelligent electronic signs that allows display of different images on multiple LED modules based on user instructions. The circuit has separate drive modules for each set of LEDs. This allows each set to be independently controlled for customized displays. A central control module coordinates the drive modules and communicates with them using a protocol like DMX512. This allows complex synchronized displays across multiple LED sets.

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Micro LED display device that can be connected to neighboring micro LED displays to form a tiled display system without requiring individual setup. The displays have terminals on their side surfaces to connect to adjacent displays. Each display contains a controller that can communicate with connected displays using packets containing arrangement and identification data. This allows the displays to exchange data and synchronize without a central controller.

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Current-selectable microLED displays that improve power efficiency by matching the electrical current range to the pixel luminance range. The displays use clusters of microLEDs controlled by dedicated cluster controllers. Each cluster controller has a selectable current source that provides a specific range of currents. The controllers choose the right current level based on the pixel brightness to avoid unnecessary power waste. This reduces leakage in the current sources and improves efficiency compared to fixed-current sources. The clusters can be arranged over the microLED array to enable this per-pixel current customization.

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Pixel drive circuit for microLED displays that improves luminance, gray scale and stability. The circuit has separate current and light emission control circuits. The current control circuit outputs a fixed current to the microLED, keeping it at a high current density where efficiency is stable. The light emission control circuit pulsed drives the microLED using a capacitor charged by a variable voltage. This allows precise control of emission time. The fixed current and pulsed emission together optimize microLED performance.

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Reducing pixel pitch of microLED displays by separating the driver circuitry from the microLED array. The microLED matrix is on one side of a substrate and driver circuits are on the other side. Conductive paths in the substrate connect the microLEDs to the drivers. This allows reducing pixel size beyond the microLED size limitation. A separate driver circuit provides scan and PWM signals to the matrix drivers. The matrix drivers then control the microLEDs based on the scan and PWM signals.

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MicroLED display with in-pixel pulse width modulation (PWM) circuits to improve power efficiency and color accuracy at low grayscale levels compared to traditional column-based PWM. Each pixel has a compact PWM circuit that converts low-frequency sawtooth or triangular pulses from the column drivers into PWM pulses to drive the microLED. This allows using longer pulses from the column drivers instead of short high-frequency pulses, reducing power consumption. A digital-to-analog converter provides the grayscale data. The in-pixel PWM circuits have 7 or fewer transistors for compactness.

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Energy-saving Micro LED display screen that reduces power consumption by allowing individual LED modules to be turned off when not in use instead of the entire display. The display has a main control module, power supply module, and multiple LED modules. Each LED module has an interface to connect to the control and power modules. The control module converts video data and sends it to the LED modules. The power module supplies power to the display. When a module is not needed, the control module can disable power to that module instead of the whole display.

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Micro LED display with high resolution and compact layout to improve display quality and density. The micro LED display has a circuit board with micro LEDs having pixel arrays. A controller on the board drives the micro LEDs. The controller has an interface, data driving circuit, and core circuit. The interface receives command/data signals. The core circuit generates compensated display info based on micro LED arrangement in each pixel. The data driving circuit generates control signals for the micro LEDs using the compensated info. This allows packed micro LED displays with high resolution and compact layout as the controller optimizes the display signal for each micro LED.

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Micro LED display with high resolution and improved display quality using a single controller. The display has closely packed micro LED devices on a circuit board. A single controller drives the micro LEDs by transmitting signals to control their display statuses. The controller calculates compensated display data based on the micro LED arrangement to improve image quality. By reducing the pitch between micro LEDs and using a single controller, the display resolution is increased compared to one-to-one control.

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An LED display and control device that allows high-quality image reproduction on displays with commercial LED components, even when the components have limited response times. The solution involves generating an image control signal with a pulse width modulation (PWM) technique that reflects a preset weight. This weight is determined based on the shift clock period and basic pulse count. The weight determines the time between enabling LEDs, allowing fine control within the component's response time. It allows high-quality images with shorter PWM periods and faster refreshes, even on displays with commercial LED modules.

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Direct view LED display system with optimized resource utilization and image quality to enable higher resolution LED displays with reduced footprint and thickness. The system uses techniques like intelligent pixel processing, scan++, and virtualization to multiply effective pixel count without losing content or quality. It arranges individual RGB LEDs in a matrix and processes pixel data using software to form perception pixels by combining neighboring LEDs. This reduces the number of physical LEDs needed by 60% while maintaining image fidelity.

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LED display device with improved brightness, resolution and defect prevention. The display uses LED elements with dual emission spectra controlled by separate pixel drivers. This allows higher brightness and definition compared to single-spectrum elements. It also prevents defects by replacing a faulty LED without affecting other pixels. The display can be double-sided by embedding reflective layers between the LEDs and substrate.

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An LED display unit with integrated electronics for micro-pixel pitch displays that improves image stability and simplifies assembly compared to external driver boards. The display unit has flip-chip LEDs, bare crystal current drivers, and an integrated control module all on the substrate. This allows direct connection between the LEDs and drivers without external cables, improving image consistency and reducing assembly complexity compared to separate boards. The integrated driver layout allows higher LED densities with smaller pitch displays.

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Digital signage transparent LED display that provides clear high-resolution images on a transparent background. The display uses a flexible printed circuit board (PCB) with optimized circuit patterns to supply the rated current to each LED chip. This prevents resistance issues and improves brightness compared to glass or film-based displays. The PCB is inserted into a concave-convex transparent base panel with LED modules. The display has a removable cover and frame for installation flexibility. The flexible PCB and LED insertion process allows customized color and resolution configurations.

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Micro LED display with redundant subpixels to improve lifetime and mitigate burn-in. Each pixel has primary subpixels and redundant backup subpixels. The primary subpixels are used initially to display the image. After a threshold usage, the backup subpixels are enabled instead. This rotates the active subpixels to spread wear and prevent burn-in. The display has primary and backup red, green, and blue subpixels for each pixel. A controller switches between using the primary or backup subpixels based on usage.

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MicroLED display with efficient color mixing and reduced complexity by independently controlling the current and emission duration of each microLED color instead of using separate green and blue microLEDs. The display has red, green, and blue pixel units with dedicated current and period switches for their respective microLEDs. This allows precise control of the current and duty cycle for each color instead of using separate green and blue microLEDs. The switches are connected to a central light emission control unit. This enables efficient color mixing and reduces complexity compared to separate green and blue microLEDs.

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Display unit board for LED screens with improved pixel density and simplified manufacturing. The board has mini 4-in-1 RGB LED chips mounted directly on the PCB instead of separate red, green, and blue chips. This reduces the number of components and allows closer pixel pitch. The board also integrates an intelligent storage chip to store calibration data and LED info, eliminating the need for external flash modules. The board connects directly to the control system without calibration steps. The integrated chips, compact layout, and onboard storage simplify manufacturing compared to dispersed components and external flash.

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MicroLED displays with improved contrast and uniformity for large-size, high-resolution displays. The displays use a structure where microLEDs are separated by light blocking layers and surrounded by light guiding layers. This prevents interference and color mixing between adjacent LEDs. The LEDs are electrically connected through internal structures. The displays can be top emission (LEDs face the display substrate) or bottom emission (LEDs face away from the substrate). The light blocking and guiding layers enable dense packing of closely spaced LEDs without interference.

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Integrating local memory into microLED displays to improve performance and power efficiency. The displays have a backplane with an array of microLEDs and additional memory elements mounted between the LEDs. Each LED is driven using the local memory for that pixel, allowing independent pixel updates without needing to access a remote memory. This reduces data bandwidth and latency compared to driving all pixels from a central memory. It also enables features like per-pixel memory, power optimization, and local compute.

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A spliced display with integrated LED modules that eliminates gaps between the displays and simplifies assembly compared to tiled displays. The display has a transparent substrate with LED modules attached to the back. The modules contain micro LEDs between the driving backplane and substrate. A control element connects the modules using a signal transmission structure. This allows the modules to be spliced without gaps or tiling frames. The integrated modules are directly connected to each other through the substrate instead of being tiled separately. This provides a seamless display surface without visible gaps between the modules.

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LED display device with independent pixel control for improved display quality and simplified structure compared to conventional displays. The device has a modular design where each pixel (LED element) is driven by its own integrated circuit (IC). The pixels are arranged in a matrix with separate frames holding each pixel. This allows each pixel to be independently controlled without interdependence or connection between pixels. The separate frames also simplify manufacturing and maintenance compared to shared frames and wiring. The modular design enables accurate and visible information display while reducing manufacturing and maintenance costs.

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An LED display unit board with improved performance, cost, and maintenance compared to conventional LED displays. The board uses mini4-in-1 full-color LED chips instead of individual red, green, and blue chips. This reduces the number of components needed, simplifies layout, and improves uniformity. It also uses an integrated chip with row and column drivers on the board instead of separate components. This allows tighter pitch LED displays with fewer PCB layers. The board also integrates storage for correction data and LED info.

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Display apparatus with configurable LED display modules that can be cut and shaped while maintaining operational reliability. The display modules have individually addressable LED pixels with separate driving signal lines for each pixel. This allows modules to be cut into custom shapes without disconnecting pixels from the controller. The display can be formed by assembling and connecting the processed modules. The display apparatus is manufactured by determining module count, addresses, and shapes based on display form info, processing modules, and assembling them into the display. This enables configurable displays of various shapes by cutting and reassembling modules instead of custom fitting each time.

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Micro LED display device with reduced color crosstalk and improved yield compared to conventional micro LED displays. The device uses a time-sharing Fabry-Perot (FP) light control layer between the color conversion layer and substrate. This layer selectively transmits red, green, or blue light based on control signals. This allows a single blue micro LED per subpixel instead of separate blue, green, and red micro LEDs. The FP layer prevents blue light from blue micro LEDs leaking to adjacent pixels, reducing color crosstalk. It also reduces the number of micro LEDs needed and simplifies transfer compared to separate subpixel micro LEDs.

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Micro LED display device with redundant micro LEDs to improve display quality and enable high dynamic range (HDR) imaging. The display has primary micro LEDs for normal image display and redundant micro LEDs in each pixel. If a primary micro LED fails, the redundant micro LED is driven instead. For HDR imaging, both primary and redundant micro LEDs are driven simultaneously in certain areas to exceed the maximum brightness of the primary micro LED alone. This allows displaying images with brighter than 1000 nits brightness and increased contrast beyond what a single micro LED can achieve.

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Display module with improved efficiency and reduced cost compared to traditional micro LED displays. The module uses a separate blue micro LED chip on the substrate coated with a fluorescent layer. This blue light is converted to white by the fluorescent layer. A color filter substrate with RGB pixels is stacked above the fluorescent layer. This allows each RGB pixel to be formed by the blue micro LED chip and the color filter, instead of having all 3 colors in each micro LED. This reduces the number of micro LEDs needed and improves yield.

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Micro LED display device with flexible size options and manufacturing method to enable displays of various sizes. The display uses a micro LED panel with a rectangular layout of micro LED pixels. The display backplane is a CMOS circuit with cells matching the micro LED pixels. The backplane is divided into units along adjacent sides of the micro LED panel. This allows cutting and joining of backplane units to customize display size. The micro LEDs are flip-chip bonded to the CMOS cells.

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Micro LED display device with improved color uniformity and manufacturing method to enable full-color micro LED displays. The device has barrier structures between adjacent micro LED pixels to prevent color mixing. The barriers are formed periodically on the growth substrate or light-emitting structure. This prevents color interference and light scattering between pixels. The barriers can be formed using a photosensitive agent or other techniques. By isolating the pixels, it enables applying color conversion materials or phosphors between the barriers for full-color micro LED displays.

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LED display device with high resolution and digital signage system using it, where the LED display has a matrix of pixels each with red, green, and blue LEDs arranged in sub-lines. The row and column lines intersect, and the scan control circuit supplies voltage to rows. Pixel drivers create current paths in sub-lines to light up pixels. This allows dense pixel packing with short sub-pixel spacing for high resolution. The system uses an image converter to feed digital data to the display.

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Flexible, lightweight, and cost-effective large-area LED displays suitable for digital signage and outdoor applications. The displays are made using separate boards for the pixel drive circuits and the LED elements, connected by flexible substrates. This allows independent manufacturing of the circuits and LEDs, reducing weight, cost, and complexity compared to monolithic displays. The boards are arranged in a matrix and interconnected to form the display. The flexible boards and substrates enable flexible display shapes and installation options.

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Integrated LED displays with on-chip electronics and memory to simplify manufacturing and reduce power consumption compared to conventional LED displays. The displays have the LED pixels, drivers, and control electronics all on a single substrate with penetrating interconnects. The on-chip memory allows each pixel to store data for multiple frames, eliminating the need for external memory and driving circuits. The display can be fabricated using standard CMOS processes.

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Transparent LED display panel, manufacturing method, and digital signage system using the transparent display. The panel has a flexible substrate, metal mesh electrodes, flip-chip LEDs, and resin encapsulation. The flexible substrate allows curved displays without breaking. The mesh electrodes are gridded on the substrate and bonded LEDs. The encapsulation seals the LEDs and mesh. This provides a lightweight, flexible, and curved transparent display. The manufacturing method involves forming the mesh on the substrate, bonding flip-chip LEDs, and encapsulating. The signage system connects multiple displays and allows touch input.

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LED display unit with distributed power supply for reducing thickness and power consumption of large-scale LED displays like signboards. The display unit has integrated modules with LED pixels, local driving circuit, and power source on the same substrate. Each module has a local power source and driver for some pixels. Additional power sources are distributed between modules. This allows cooperative power saving by switching off unused driver circuits using local power sources. The distributed power sources also reduce overall thickness compared to centralized power supplies.

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Display device with improved resolution using regionalized light control instead of physically reducing display unit size. The display has a micro LED panel with a light control component on the emitting side. Each light control area corresponds to a micro LED. Instead of shrinking the LEDs, the control areas are divided into multiple photon control areas. In each frame, the photon areas sequentially transmit the LED light. This indirectly reduces apparent LED size due to persistence of vision. The display breaks the physical limitation of reducing LED size and increases resolution by regionally controlling emitted light.

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LED display system with modular design, advanced scan technology, and high-performance drivers for improved stability, visibility, and flexibility. The system has a PC, control unit, and LED display screen. The control unit has input, signal processing, and output interfaces. The LED display has driver circuits for each pixel. The scan technology divides the display into independent units that scan separately. Signal latching synchronizes scanning. High-performance drivers provide brightness, color, angle, life, stability, and response. Modular design allows easy assembly, expansion, and maintenance by adding/removing units.

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Highly transparent LED display suitable for large-area applications that can be integrated into buildings and other structures without blocking light. The display has a front glass panel, a rear glass panel, and a drive circuit assembly. The rear glass has a transparent conductive film with LED chips welded at the nodes. The chips are connected using flip chip bonding. The drive circuit is a narrow strip placed horizontally or vertically. This allows the display to have a high transparency rate of up to 92% by using small LEDs on the rear glass and a transparent filler between the panels. The circuitry is separate from the glass panels and can be produced independently.

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Miniature transparent LED display with high brightness and transparency. It uses a transparent substrate, a drive module, and a transparent inorganic semiconductor LED microarray. The LED chips in the array can be made on a transparent wafer and emit light from the front, back, or both sides. This allows the background or objects behind the display to be seen through the transparent display.

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A transparent LED display screen with high transparency and ease of maintenance. The display uses a modular design where the LED pixel modules are mounted on a transparent support surface with staggered bars. This allows the LED bars to be narrower than traditional displays, improving transparency. The drive modules are hidden inside the support bars. The modules are electrically connected to a bus amplifier and receiving system. This enables the LED pixels to be driven and controlled without visible electronics. The modular design allows easy replacement of LED bars without removing the entire light bar.

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A slim, lightweight LED signage system that reduces thickness and simplifies installation compared to conventional LED signage. The system uses detachable, thin LED pixel panels with integrated drivers, separate power and control boxes, and a slim sign frame. The pixel panels have male/female connectors to link and stack. The frame has grooves for panel insertion. The power and control boxes are combined. This allows a slim signboard by separating the heat-generating LEDs from the power supply and controller. The connectors enable easy panel replacement and assembly. The boxes can be installed separately for easy access. The sign frame is a thin, detachable box that attaches to the building. This enables protruding signage with less load.

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