3 patents in this list

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Micro-LED displays are transforming signage with their vibrant colors and exceptional clarity, offering a new visual experience. However, these displays face challenges in achieving uniform brightness and efficient energy use across large surfaces. The intricate balance of pixel density and light management is crucial for creating sharp, reliable images that capture attention in dynamic environments.

Professionals in the field encounter hurdles such as crosstalk between LEDs, heat dissipation, and maintaining consistency across modular panels. Overcoming these issues is essential to ensure that micro-LED technology meets the demands of high-resolution and high-contrast signage applications. The complexity of integrating numerous tiny LEDs while preserving display quality remains a significant challenge.

This page explores research-driven solutions that address these challenges, including recessed configurations for seamless tiling, advanced packaging to reduce crosstalk, and techniques for uniform luminance. By implementing these strategies, professionals can enhance display performance, ensuring reliability and efficiency in diverse signage applications.

1. Recessed Lower Body and Top Plate Configuration for Micro LED Module Tiling

SEOUL VIOSYS CO., LTD., 2023

Reducing linear defects observed when micro LED modules are arranged using a tiling technique in displays. The modules have a recessed lower body and a top plate. When tiled, the recessed lower bodies provide gaps between modules that prevent linear defects from being visible on the display. The top plates of adjacent modules cover the gaps. This allows close tiling of the modules with reduced visible defects compared to touching edges.

US11855052B2-patent-drawing

2. Modular Flat Panel Display with Edge-Adjacent LED Configuration Using Substrate Vias

V-Finity, Inc., 2022

A modular flat panel display with reduced visible seams between smaller displays when joined together. The display has a panel with an edge length less than the internal pixel spacing. This is achieved by connecting the LEDs to the pixel circuits using vias that go through the substrate, allowing the LEDs to be positioned closer to the edge. This reduces the non-emitting space at the edge compared to the internal pixel spacing, minimizing the visible seams when multiple panels are joined.

3. MicroLED Display Structure with Light Blocking and Guiding Layers for Enhanced LED Separation and Electrical Connectivity

Prilit Optronics, Inc., 2020

MicroLED displays with improved contrast and uniformity for large-size, high-resolution displays. The displays use a structure where microLEDs are separated by light blocking layers and surrounded by light guiding layers. This prevents interference and color mixing between adjacent LEDs. The LEDs are electrically connected through internal structures. The displays can be top emission (LEDs face the display substrate) or bottom emission (LEDs face away from the substrate). The light blocking and guiding layers enable dense packing of closely spaced LEDs without interference.