Micro-LED Displays for Enhanced Signage Applications
3 patents in this list
Updated:
Micro-LED displays face integration challenges at multiple scales: individual LED chips measure 1-10 micrometers, while complete display modules span hundreds of millimeters. At these scales, visible defects emerge from both manufacturing variations and assembly tolerances—including linear seams between tiled modules and light leakage between adjacent pixels that can degrade image quality.
The fundamental challenge lies in achieving seamless visual integration of micro-LED modules while maintaining manufacturability and yield at production scales.
This page brings together solutions from recent research—including recessed module designs that minimize visible seams, advanced collimation structures that reduce pixel crosstalk, embedded chip architectures that improve reliability, and multi-layer circuit designs that enable higher density integration. These and other approaches focus on practical manufacturing methods while delivering the visual performance demanded by commercial signage applications.
1. Recessed Lower Body and Top Plate Configuration for Micro LED Module Tiling
SEOUL VIOSYS CO., LTD., 2023
Reducing linear defects observed when micro LED modules are arranged using a tiling technique in displays. The modules have a recessed lower body and a top plate. When tiled, the recessed lower bodies provide gaps between modules that prevent linear defects from being visible on the display. The top plates of adjacent modules cover the gaps. This allows close tiling of the modules with reduced visible defects compared to touching edges.
2. Modular Flat Panel Display with Edge-Adjacent LED Configuration Using Substrate Vias
V-Finity, Inc., 2022
A modular flat panel display with reduced visible seams between smaller displays when joined together. The display has a panel with an edge length less than the internal pixel spacing. This is achieved by connecting the LEDs to the pixel circuits using vias that go through the substrate, allowing the LEDs to be positioned closer to the edge. This reduces the non-emitting space at the edge compared to the internal pixel spacing, minimizing the visible seams when multiple panels are joined.
3. MicroLED Display Structure with Light Blocking and Guiding Layers for Enhanced LED Separation and Electrical Connectivity
Prilit Optronics, Inc., 2020
MicroLED displays with improved contrast and uniformity for large-size, high-resolution displays. The displays use a structure where microLEDs are separated by light blocking layers and surrounded by light guiding layers. This prevents interference and color mixing between adjacent LEDs. The LEDs are electrically connected through internal structures. The displays can be top emission (LEDs face the display substrate) or bottom emission (LEDs face away from the substrate). The light blocking and guiding layers enable dense packing of closely spaced LEDs without interference.
