Water and Moisture-resistant Micro-LED Displays

(Summary) Micro LED display device with improved packaging to prevent chromatic aberration when using quantum dot (QD) materials. The display has a positioning frame outside the display region to connect the cover plate to the substrate. An isolation frame surrounds the positioning frame to block environmental factors like water and oxygen from the QDs. The isolation frame has a lower water vapor transmission rate than the positioning frame to protect the QDs better. This prevents chromatic aberration when viewing the display from wider angles.

(Summary) LED package structure with waterproofing to improve light extraction and reliability. The structure has an LED on a substrate enclosed in a through hole with a side wall. An encapsulant fills the hole around the LED. A waterproof coating seals between the encapsulant and side wall. The coating and encapsulant are fluoropolymers with different transmittances. The lower transmittance coating seals the interface to prevent moisture ingress. The higher transmittance encapsulant allows light extraction.

(Summary) Waterproof packaging for electronic devices like sensors that uses organic substrates and a barrier layer to prevent moisture ingress through the substrate. The devices have a package with an organic substrate that allows moisture penetration. A barrier layer is formed on the substrate surface facing the component to block moisture ingress. This prevents contamination of the component from absorbed moisture in the organic substrate.

(Summary) Display apparatus with improved moisture and warpage resistance in encapsulated LED displays. The display has an encapsulation substrate with penetrating holes overlapping a moisture-blocking layer between the LED and the encapsulation substrate. This prevents moisture ingress while still allowing heat escape. The moisture-blocking layer has lower water vapor transmission rate than the encapsulating layer. The penetrating holes have small size and sufficient spacing to minimize moisture differences and prevent warpage. The blocking layer is made of a hard material to complement the soft encapsulation substrate rigidity.