Improved Power Efficiency of Liquid Immersion Cooling for Data Center

Two-phase immersion cooling system with active vapor management to reduce fluid loss and improve efficiency compared to prior art two-phase cooling systems. The system uses a vapor management system connected to the immersion tanks to condense and return vapor instead of allowing it to escape. This prevents fluid loss and reduces the need for continuous chiller operation compared to freeboard condensers. The vapor management system has a valve that opens when tank pressure exceeds a threshold to allow vapor admission, condensing it in a separate chamber, and returning condensed liquid back to the tanks. This prevents overfilling while capturing and recycling vapor.

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Waste heat recovery system for immersion liquid cooling servers that allows heat dissipation without needing additional pumps. The system uses a two-phase coolant in an evaporation box that absorbs heat from the single-phase coolant in the server immersion tank. A driving impeller in the circulation pipe rotates as the gas-filled coolant flows, driving a driven impeller to pump the single-phase coolant. This recirculates the coolant without pumps, utilizing the evaporating coolant's heat to drive the pumping.

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Waste heat recovery system for immersion liquid cooling servers that reduces energy consumption and improves environmental performance by leveraging the waste heat generated during server operation. The system uses two-phase coolant to absorb some of the heat from the single-phase coolant circulating through the server chassis. Gas bubbles formed in the two-phase coolant drive an impeller in the return pipe, which then drives an impeller in the coolant inlet to pump the single-phase coolant. This pumpless circulation allows the waste heat to be converted into kinetic energy instead of just dissipating it, improving overall system efficiency.

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Improved cooling system for data centers with higher efficiency compared to conventional liquid cooling systems. The cooling system uses separate cooling mediums in isolated capsules immersed in a common storage tank. The capsule contains a secondary cooling medium that transfers heat to the primary cooling medium in the tank. This allows more efficient heat transfer since the capsule's secondary cooling medium can be optimized for the specific device being cooled, while the tank's primary cooling medium can be optimized for overall system efficiency.

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A high-density computing system that integrates six or more high-power graphics processing units (GPUs) in a compact 1U server rack, utilizing immersion cooling to efficiently dissipate heat generated by the GPUs. The system enables operation of multiple high-power GPUs in a single rack, achieving higher computational density and performance compared to traditional air-cooled systems.

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An active-passive immersion cooling system for electronic devices that combines forced convection with passive heat transfer to enhance cooling efficiency. The system features a rotor-driven flow stream that circulates dielectric coolant through a heat sink's flow ducts, while also allowing passive liquid flow when the rotor is not operational. The system can be used in both single-component and multi-component configurations, and is particularly suited for high-power devices such as servers and data storage systems.

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Immersion cooling system for controlling the temperature of a heat generating hardware component, comprising a reservoir with multiple hardware positions, a cooling liquid supply with individually configurable nozzles for each position, and a recovery system. The system enables precise temperature control by directing cooling liquid to specific hotspots on each component, and can be scaled up or down by connecting multiple reservoirs. A filler body can be inserted between the component and reservoir bottom to optimize liquid volume and flow.

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Liquid immersion cooling apparatus for high-performance servers, comprising a sealed cabinet with a transparent cover, a refrigeration device located in the gas space, and a coiled tube for condensing coolant vapor. The refrigeration device includes a liquid-cooled heat exchanger and a cooling chip, with the coiled tube thermally coupled to the heat exchanger. The coiled tube condenses coolant vapor from the gas space, allowing it to drip back into the liquid space and recycle the coolant, eliminating waste and preventing condensation on the cover.

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A two-phase immersion-type heat dissipation structure having a porous structure for enhanced heat transfer. The structure includes a heat dissipation substrate with a fin surface and a non-fin surface, a plurality of fins integrally formed on the fin surface, and a reinforcement frame surrounding the fins. A porous structure with a porosity of 10-50% and thickness of 0.1-1 mm is applied to the fin surface and fins to increase heat transfer efficiency. The structure can be used in immersion cooling systems for high-power electronic devices.

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An actively controlled immersion cooling system for data centers that dynamically adjusts cooling power to match the heat load of IT equipment. The system continuously monitors system parameters, weather conditions, and IT equipment performance to optimize cooling capacity and energy efficiency. It performs readiness checks, performance monitoring, and predictive weather-based adjustments to ensure reliable and efficient cooling.

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An immersed cooling system for electronic devices, comprising a liquid coolant and a heat exchanger, wherein the coolant is selectively directed to components with high heat generation rates to optimize cooling efficiency.

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A thermal management system for electronic devices that uses separate immersion chambers to cool components with different thermal requirements. Each chamber contains a working fluid that absorbs heat from the component, and the fluid pressure in each chamber can be independently controlled to optimize boiling temperatures. The system enables customized thermal management for components with varying heat loads, reducing energy waste and improving overall system efficiency.

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A data center cooling system for heterogeneous IT clusters, comprising a prefabricated module design that integrates multiple cooling technologies, including air cooling and two-phase immersion cooling, within a single enclosure. The system features a containment layer that separates hot and vapor zones, and a heat exchanger that enables heat transfer between the two zones. The system also includes a return conduit for condensed vapor and a cooling air supply for air-cooled servers, enabling efficient cooling of both air-cooled and immersion-cooled servers in a single cluster.

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A server and cooling system for immersion cooling of high-power IT equipment. The system includes a flow module with a housing, channel, inlet, pump, and fluid distribution interface, which can be submerged in an immersion cooling fluid. The flow module can be coupled to a cooling device, such as a cold plate or evaporator, which is thermally coupled to the IT equipment. The system enables efficient heat transfer and management of high-power density servers in immersion cooling environments.

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A two-phase immersion-cooling heat-dissipation structure with skived fins having high surface roughness for enhanced heat transfer. The structure features a high thermal conductivity substrate with a vacuum-sealed cavity containing liquid, which forms an indirect contact with the heat-generating component. Skived fins with high surface roughness are attached to the substrate to facilitate efficient heat transfer through the immersion-cooling process.

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A two-phase immersion-type composite heat dissipation device that combines a surface porous layer and fins to enhance heat transfer. The device features a heat dissipation substrate with a heat source-facing surface and an opposite surface with fins, and a surface porous layer covering a portion of the substrate's low-temperature region. The porous layer and fins work together to create nucleation sites for bubble generation and enhance heat transfer through the immersion cooling process.

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A fluid immersion cooling system for electronic systems that uses a dual-phase coolant fluid in combination with one or more overlying layers of single-phase coolant fluids. The dual-phase fluid has a lower boiling point and higher density than the single-phase fluids, allowing it to vaporize and condense in a controlled manner. Heat-generating components are submerged in the dual-phase fluid, which vaporizes and rises to the single-phase fluid layer where it condenses and returns to the dual-phase fluid, completing the cooling cycle.

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A dual-mode cooling system for datacenters that combines cold plate cooling and immersion cooling to efficiently cool both high-power and low-power server components. The system features separate cooling loops for high-power components cooled by cold plates and low-power components cooled by immersion in a dielectric liquid, enabling improved cooling efficiency and reduced power consumption compared to traditional air cooling methods.

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An immersion liquid cooling tank assembly for servers and other electronic devices, comprising a tank with a base and sidewalls, a condenser for vapor-to-liquid phase change, a cross-flow fan for airflow generation, an internal wall system for airflow direction, a top cover, and a sloping wall that creates a closed airflow loop with the sidewalls to enhance heat removal efficiency.

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With the increasing processing capabilities of data centers, the demand for advanced cooling has been increased, positioning liquid immersion cooling systems as a focal point due to their effectiveness and environmental benefits. This paper reviews the current state and prospects of liquid immersion cooling technologies for data centers by paper analyzing. The research spans the optimization of cooling technology parameters, material and coolant performance, as well as system level integration and thermal management. The characteristics analysis of liquids and supercritical fluids underscores the significance of coolant selection Innovative cooling network designs have been shown to initiate failures and improve thermal distribution, enhancing data center performance and reliability. Additionally, the interplay between cooling systems and IT systems has been explored for its overall energy efficiency impact. Liquid immersion cooling technology demonstrates vast potential in ensuring safety, enhancing heat exchange efficiency, and meeting the growing needs of future data center develo... Read More

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