Contamination Removal from Packages for Purity

A method for cleaning and preventing contamination inside a chamber used for semiconductor processing. The method involves cyclically raising and lowering the pressure inside the chamber while heating and cooling it. This removes and dislodges contaminants from the chamber walls and components. The contaminant-laden gas is then purged. The cycling is done between pressures above and below atmospheric pressure. This prevents internal contaminants from being deposited back on the substrates during processing.

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Cleaning agent composition for semiconductor substrate cleaning that provides improved cleaning performance and reduces contamination compared to conventional cleaning agents. The composition contains tetrabutylammonium fluoride trihydrate, 3-butoxy-N,N-dimethylpropanamide, and pentaethylene glycol monododecyl ether. The composition is used in semiconductor processing to clean semiconductor substrates, particularly after metallization steps. The composition provides improved cleaning of metal residues and reduces contamination compared to conventional cleaning agents.

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Continuous and semi-continuous manufacturing method for electrodes with improved thickness uniformity and reduced deflection. The method involves dispensing electrode slurry onto a current collector using a rotating drum with arc-shaped pallets. The current collector material is fed into the drum and a discrete portion is tucked between the pallets. The slurry is dispensed onto this tucked section and then the pallets move to re-form the gap, leaving discrete slurry patches. This allows consistent, uniform slurry application without the weight variations that cause deflection. The drum can also have features like concave rollers, pinion gears, and vacuum to further control dispensing and prevent material shifting.

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Vibrating body and substrate processing apparatus for improving contaminant removal during cleaning. The vibrating body has an inclined region on the contact surface with the cleaning liquid that faces the substrate. The angle between the inclined region and the end of the vibrating body facing the substrate is 20-87 degrees. This inclined region facilitates parallel movement of contaminants on the substrate surface during cleaning by applying a force perpendicular to the surface.

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A process to improve reliability of hybrid bonded microelectronic devices by removing nanoparticles from the bonding surfaces after activation. The process involves cleaning the surfaces after activating them for hybrid bonding to remove extraneous particles that can cause leakage between closely spaced conductive features. The cleaning can physically remove and dissolve nanoparticles without harming the bonding surfaces. This prevents undesirable current and signal leakage between fine conductive lines and traces, especially at higher voltages with sub-micron spacing. The cleaning step is done between activation and bonding.

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Remediation of PCB-contaminated concrete using a nonmetal treatment system (NMTS) paste and zero-valent magnesium (ZVMg) to extract and degrade PCBs from concrete surfaces. The NMTS paste is applied to the concrete, penetrates the pores, and desorbs PCBs into the paste. The extracted PCBs are then degraded by the ZVMg. This provides a cost-effective alternative to physical removal or encapsulation of PCB-contaminated concrete.

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Recycling printed plastic containers without contaminating the recycled plastic with colorants or other components of the ink. The method involves using water-based inks on the containers that can be removed as solid particles when exposed to a hot caustic solution. The inks contain polymers like self-crosslinking acrylics that don't dissolve in the wash. This allows separating the recycled plastic from the ink particles, preventing color contamination during recycling.

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Substrate treatment method and apparatus for preventing contamination and improving washing efficiency in semiconductor processing. The method involves using a dummy substrate to clean the drying chamber between runs. After developing, the dummy substrate is loaded wet into the drying chamber and supercritical fluid is supplied. This washes the chamber. The dummy is then baked and reused. This reduces contamination compared to using residue from the drying chamber. It also automates chamber cleaning by integrating it into the process flow.

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A composition for removing metal residues from semiconductor substrates during manufacturing. The composition contains a specific resin with repeating units having a hydroxy group and a group with a pKa of 10.0 or less. The resin suppresses tungsten dissolution compared to regular polymers. It also provides better removal of metal residues and leaves fewer residues after rinsing. The composition is used to treat semiconductor substrates with metal-containing residues to clean them before further processing steps.

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Automated system for removing particles from semiconductor pellicles using a nozzle, robot arm, vacuum pump, and distance sensor. The system locates a particle on the pellicle membrane, lowers the nozzle to a threshold distance, dispenses a droplet to cover the particle, horizontally drags the droplet to an edge, and suctions it off. This removes particles without damaging the pellicle.

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Pre-wet module for cleaning and degassing substrates prior to plating that improves efficiency by allowing better access to patterned surfaces and preventing recontamination. The module has a rotating stage to hold the substrate with the processing side up. It has a chamber with a lid and tubular skirt around the lid edge. The chamber can be raised and lowered. Cleaning liquid is supplied through the lid nozzle when the chamber is raised. Degassing liquid is supplied when the chamber is lowered. This allows full access to the patterned surface for cleaning, then degassing without obstruction.

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Multilayer film for packaging materials that allows easy removal of adhering contents like food residue while maintaining good heat sealability. The film has a sealing layer with a thermoplastic resin and a surfactant. Embossing the sealing layer surface to increase its specific area enhances content release. The film can be used in containers like paper cups to facilitate cleaning.

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Reducing the risk of ink particles from printed packaging transferring into food products during manufacturing. The method involves curing the inner layer of the packaging material to bind ink particles that migrate from the outer printed layer. This prevents the ink particles from being released into the food product. The packaging material is formed into packages and filled with the product without a separate ink migration preventing layer. This avoids compromising efficiency and versatility compared to adding a separate layer.

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Laminate for packaging materials, containers, and articles that can improve hygiene and quality even when the recycled resin content is high. The laminate uses chemically recycled resin instead of material recycled resin. Chemically recycled resin is made by converting discarded resin into a low molecular weight form and then polymerizing it, rather than cleaning and melting used packaging materials. This reduces impurities and thermal degradation compared to material recycling. The laminate has at least 10% vol or mass of chemically recycled resin.

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Filler assembly for sterile filling of flexible pouches with flowable materials like food products. The filler has zones for preheating, sterilization, flushing, and filling. The pouch moves through these zones sequentially. The preheat zone has a preheat nozzle and vacuum to suction the pouch before sterilization. The sterilization zone has a sterilization nozzle and vacuum after sterilization. The flushing zone has a flushing nozzle and vacuum after flushing. This sequence helps prevent contamination by removing fluids from the pouch between steps. The filler also has a mechanism to move the pouch through the zones. The mechanism has two regions: helical screws to guide the pouch entry, and linear slides to move it through the zones. The nozzle assemblies have sealing rims with slots to allow fluid flow when engaged with

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Reducing outgassing of volatile organic compounds from pellicle packaging to minimize contamination of pellicles used in semiconductor lithography. The pellicle packaging has a total outgassing of 90 ppm or less when heated at 100°C for 30 minutes. The packaging has a sealant layer with thickness 40 μm or less, optionally an adhesive layer, and can contain an ethylene-vinyl alcohol copolymer in the sealant. This reduces outgassing compared to typical packaging materials. The packaging can also be used to enclose pellicle receptors for lithography tools. The pellicle itself may have a styrene-butadiene-based adhesive for original plates.

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Packer machine for making pouches containing snus or other loose products like tea or coffee. The machine has features to improve productivity and quality while collecting loose powder from the pouches. It uses actuators with adjustable pneumatic springs to precisely control the sealing pressure. This prevents pouches from inflating with air during filling. Between the longitudinal and transverse sealers, a suction device removes loose powder blown out by the compressed air feeding the pouches. This prevents dirtying of the sealing units and ensures clean pouches.

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Packaging machine that prevents defective sealing by removing foreign matter from the sealed portion. The machine has a feature to thoroughly clean the overlapped edges of the packaging material before sealing. It does this by inserting a brushing device between the bag maker and sealer that can be pushed into the overlapped edges. The brushing device has a vent hole and a suction device to draw the edges through the hole and clean them. This prevents foreign matter like product scraps from being sealed in the package.

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Product packaging assembly that prevents contamination of packaged products from ambient environments. The assembly has a filter sandwiched between a support and a surface film, with sealed perimeters. This assembly is placed over the package opening. During heating, gases vent out through the assembly while the filter blocks ambient particles from entering. This prevents contamination during processing and handling in contaminated environments.

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Packaging material with antimicrobial and low adhesion properties to reduce contamination and disease transmission through contact with the packaging surface. The packaging has a coating that combines anti-microbial behavior to deactivate contaminating microbes with low adhesion properties to prevent buildup of contamination. The coating is applied over a substrate and can be printed onto the packaging. The low adhesion properties help prevent contamination from sticking to the surface, while the anti-microbial properties deactivate any remaining contamination.

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