Material Verification for Package Integrity

Inspecting resin container films used in blister packaging to reliably distinguish and detect holes and thickness quality. The technique involves irradiating the film with lights of different wavelengths and imaging them to obtain luminance data. By using lights that partially transmit through the film at different rates based on thickness, the contrast between hole brightness and thin film brightness can be increased. This allows separate hole and thickness determination from the same imaging.

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Inspecting packages made by shrink-wrapping or stretch-wrapping objects using a technique that allows detecting tears in the packaging material without using special ultraviolet-absorbing packaging materials. The technique involves using a camera to image the package after irradiating it with ultraviolet light. The camera captures specular reflection images that reveal tears as dark areas. By analyzing the images, the quality of the packaging material can be determined without needing specialized materials. This improves inspection accuracy compared to fluorescent images.

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Automatic system for evaluating the sealing quality of heat-sealed packages of pourable food products like juice, milk, wine, etc. The system uses cameras to visually inspect the sealing strip that joins the packaging material. It compares the seal against predefined criteria to determine if it meets quality standards. This allows automated quality control of the heat sealing process, reducing human operator involvement.

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Epoxy plastic encapsulation material with low modulus and thermal expansion coefficient for semiconductor packaging that reduces stress and delamination during processing. The material is an epoxy molding compound containing epoxy resin pretreated with a stress absorber, phenolic resin pretreated with nanofillers, micron fillers, and curing accelerator. The stress absorber is a styrene-butadiene copolymer or derivative added to the epoxy resin. The nanofillers are surface-modified and premixed with phenolic resin. This pretreatment step ensures uniform dispersion of stress absorbers and nanofillers in the resin matrix. The compound has a modulus below 10 GPa and thermal expansion coefficient below 16 ppm/K, allowing lower molding stress and better reliability for semiconductor packaging.

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Testing compression resistance of heavy-duty packaging bags filled with contents and sealed, by stacking them in multiple layers and applying compression force. It involves stacking the bags vertically on a lower support with a flat top, then pressing from above with a horizontal plate. The load when the bags break is measured. This more closely approximates real usage conditions compared to testing single bags. Stacking 3-5 layers provides stable results.

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A packaging material with improved lamination strength, tear resistance, and low residual solvent levels. The packaging has layers in order: substrate, printed layer, adhesive layer, sealant. The printed layer is a polyester-urethane with Mw/Mn of 4-12. The adhesive layer is cured using a urethane polyol (Mw/Mn 2-17) and isocyanate (Mw/Mn 5.5-18.5). This specific molecular weight distribution range for the isocyanate improves adhesion and tear resistance. The low Mw/Mn polyester-urethane and cured adhesive have better lamination strength and lower residual solvent compared to conventional materials.

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Portable packaging leak tester for permeability protection clothing that can prevent non-conforming samples from being selected through direct measurement in the field and find natural damaged products at military bases. The tester uses a vacuum pump to form a negative air pressure inside a sealed chamber. If the packed item inflates under vacuum, it's normal. If it remains unchanged, it's defective. Releasing vacuum checks if it restores to original size. Alternatively, injecting air checks for leaks. The tester has handles and wheels for portable field use, auto pressure control, photo sensor, and test sequence program.

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Pharmaceutical packaging materials with improved inertness, extractability, leachability, and lubricity compared to conventional packaging materials. The materials have a thin film coating on the substrate surface. The coating is composed of two layers: a hexamethyldisiloxane (HMDS) layer followed by a silane layer. The HMDS layer provides inertness, barrier properties, and reduces extractables. The silane layer improves lubricity. This two-layer coating on substrates like vials/syringes improves drug inertness, reduces leachables, and provides high lubricity compared to uncoated packaging.

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A method to protect and authenticate packaged goods without using special tools for end users. The method involves embedding microstructures into the packaging material itself during production. These microstructures can be either stochastic or repeating patterns containing features like microliters or microsymbols. When viewed with the naked eye, these microstructures create variations in tone that reproduce halftones of an image. This allows users to visually verify the authenticity of the product without additional accessories.

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