Dimensional Analysis for Package Accuracy
2 patents in this list
Updated:
Package dimensioning systems must achieve sub-millimeter accuracy while operating at conveyor speeds of 2-3 meters per second. Current vision systems face challenges with reflective surfaces, irregular shapes, and varying material properties that can introduce measurement errors of up to 5mm—particularly problematic for logistics operations handling millions of parcels daily.
The fundamental challenge lies in balancing measurement accuracy with throughput speed while accounting for real-world variables like ambient lighting, package orientation, and surface characteristics.
This page brings together solutions from recent research—including Z-axis coordinate subtraction techniques, dual-device image acquisition systems, adaptive lighting controls, and multi-sensor fusion approaches. These and other approaches focus on achieving reliable dimensional accuracy in high-speed logistics environments while maintaining operational efficiency.
1. Method and Device for Package Dimension Detection Using 3D Camera with Z-Axis Coordinate Subtraction
GUANGDONG UNIVERSITY OF TECHNOLOGY, Guangdong University of Technology, 2021
Method, device, and equipment for detecting package dimensions using a 3D camera that improves accuracy compared to 2D cameras. The method involves using a 3D camera to capture the empty platform without the package, then capturing the platform with the package. By subtracting the Z-axis coordinates where X and Y match, differences reveal the package height. With this height, the Z-coordinates from the second 3D data are restricted. The restricted Z-data is projected onto the XY plane and fitted to a rectangle. The rectangle dimensions give the package length and width.
2. Dual-Device Image Acquisition System for Inner and Outer Surface Defect Detection in Microwavable Packaging Materials
Kangmei Packaging Co., Ltd., SIG COMBIBLOC CO LTD, 2021
A packaging material defect detection system that can inspect the inner surfaces of microwavable packaging materials like paper cups. The system uses two image acquisition devices with different light extraction directions. One device is for highly reflective materials and the other is for low reflectivity materials like microwavable packaging. The first device captures defects on the outer surface. The second device, with a different light direction, captures defects on the inner surface of low reflectivity materials. This allows comprehensive inspection of both inner and outer surfaces of all packaging materials.
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