Laser Scribing Techniques for Solar Cell Module Integration

Precision laser machining for photovoltaic manufacturing through controlled spot size optimization. The method employs laser scribing with precisely controlled beam spot sizes to achieve precise trench formation while minimizing collateral damage. The laser beam's Rayleigh length and divergence are optimized to ensure precise spot placement and minimize material exposure. This approach enables the creation of precise photovoltaic structures without the need for large, expensive needle arrays or high-power laser systems.

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Solar cell with enhanced microcrack resistance and improved dicing performance. The solar cells feature a unique dicing process that creates strip-shaped cells through mechanical fragmentation rather than traditional wafering. The process utilizes high-frequency laser pulses to break the solar cells into uniform strips, eliminating the formation of microcracks during the dicing process. This approach enables the creation of high-quality solar cells with reduced material waste and improved dicing characteristics. The solar cells are then assembled into photovoltaic modules with improved mechanical integrity and reduced manufacturing defects.

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Laser scribing method and device for thin film solar cells that avoids issues of electric leakage and improves scribing accuracy. The method involves moving the solar cell substrate relative to a stationary laser module, instead of moving the laser module. This allows scribing all layers except the front electrode with the first laser, then scribing the front electrode with the second laser. The first laser's wider scribing width prevents electric leakage between modules. The device has a base plate and a parallel-moving light source module with linear motors. Two lasers are integrated on the module and move together with the substrate.

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Solar cell with a marking method that avoids damaging the silicon wafer during cell production. The marking is done on a functional layer formed on the cell's front surface instead of directly on the wafer. Low-power lasers are used to create indentations in the functional layer for cell tracking. This allows identification without penetrating the wafer and preventing damage. The indentations are shallow and confined to the functional layer.

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Non-destructive scribing device for high-speed solar cells that enables precise material processing while maintaining product integrity. The device features a mounting frame that supports a conveyor belt and a laser system, with the laser and nozzle group positioned in a controlled sequence. The mounting frame is equipped with a correction mechanism for aligning the material feed position. The conveyor belt transports the solar cells, and the laser system sequentially cuts and cools the material. The device's flexibility allows for simultaneous processing of multiple solar cell fragments.

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Reducing material loss during laser scribing of solar cells by optimizing the laser scribe process. The laser scribe process is improved by controlling the laser beam position during scribing to minimize stress concentrations and cracking in the solar cell structure. The process achieves high scribe rates while maintaining precise control over the laser beam position to prevent uneven scribe lines and stress concentrations. This approach enables laser scribing of solar cells with enhanced material integrity and reduced material loss during the process.

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Reducing thermal damage in laser-induced groove formation in solar cells by employing a novel semiconductor layer that selectively absorbs laser energy. The layer, comprising a material with a higher absorption coefficient than the substrate, is integrated into the solar cell's semiconductor layer. This selective absorption enables thermal damage mitigation during laser groove formation, particularly when using laser wavelengths below 600 nm. The layer can be formed on the substrate's rear surface or in the semiconductor layer, and its absorption characteristics can be optimized for specific laser wavelengths.

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A method for manufacturing solar cells with integrated metallization contacts through laser-assisted patterning and bonding. The process involves creating laser-assisted metallization contacts on solar cells through laser patterning of metal foil, followed by bonding the metal foil to the solar cell backside. The metallization contacts are formed using laser-assisted patterning of metal foil, and the bonding process enables direct electrical connection between the metal foil and the solar cell backside. The metallization contacts are then integrated into a solar cell string along with conventional interconnects, enabling efficient and reliable solar cell connections.

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Method and photovoltaic module for reducing cutting efficiency loss of solar cell chips, particularly in laser-sliced photovoltaic modules. The method involves sequential laser scribing followed by controlled laser splitting, where the laser cuts the battery chip during manufacturing, reducing fragmentation and damage. This approach enables efficient cutting without requiring the entire chip, thereby minimizing post-processing losses.

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Manufacturing method for solar cells that maintains power generation efficiency during cutting operations. The method involves preparing solar cells for dicing by arranging dopants on one surface and doping with laser irradiation. The dopants create regions with different impurity concentrations on the surface facing the laser, while maintaining the dopant concentration on the back surface. This creates a selective doping pattern that ensures the laser energy is focused on the area with higher dopant concentration, preserving the solar cell's electrical properties during cutting.

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A novel method for producing solar cell strings that eliminates the risk of cracking during soldering. The process involves creating a matrix of interconnects on the solar cell surface before assembly. The interconnects are formed through a series of laser cuts through the cell's silicon layer, creating conductive pillars that are then connected to the cell's front grid lines. The pillars are positioned to ensure that they are in contact with the front grid lines, while the interconnects are positioned to be in contact with the back grid lines. This configuration prevents the formation of cracks during soldering, while maintaining the structural integrity of the solar cell string.

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A method for creating through grooves in solar cells through precise laser cutting, enabling efficient and controlled structural modification. The method employs a laser to selectively cut through the solar cell's thickness while maintaining cell integrity, eliminating the need for mechanical cutting techniques that can damage the cell structure. The laser is programmed to alternate its cutting path through the cell, ensuring precise control over the groove's orientation and depth. This laser-assisted cutting approach enables the creation of through grooves in solar cells without disrupting the cell's structural integrity, making it particularly suitable for manufacturing solar cells with complex geometries.

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A photovoltaic cell processing device that enables precise cutting and welding of half-cell batteries without compromising their structural integrity. The device employs a laser scribing system to create precise cut lines in the wafer surface, followed by a specialized welding process that preserves the battery's structural integrity. The device's unique approach ensures that the back grid line remains intact during the welding process, eliminating potential cracking and fragmentation issues that can occur when welding exposed battery edges.

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A method for preparing transparent solar cell components that enables high-speed production of light-transmissive solar cells while maintaining power generation characteristics. The method employs a laser cleaning and scribing process to create precise, insulated regions within the solar cell, followed by a second laser treatment to remove the thin film layer while maintaining the scribed regions. This approach enables the creation of transparent solar cell components with both high transmission efficiency and reliable power generation. The laser cleaning step is performed without damaging the power generation areas, while the second laser treatment precisely removes the thin film without causing short circuits. The laser processing speed of 30 cm/s is significantly higher than traditional machining methods, enabling faster production rates while maintaining operational reliability.

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A P-type PERC double-sided solar cell with enhanced efficiency through a novel double-side architecture. The cell features a backside aluminum grid with laser-defined grating lines, enabling improved light transmission and carrier transport between the front and back surfaces. This architecture replaces the conventional all-aluminum rear field with a patterned backside structure, while maintaining the PERC technology that enables high-efficiency solar cells. The cell's unique double-side design provides superior performance compared to conventional single-side PERC cells.

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A multifunctional laser scribing system for photovoltaic module production that enables simultaneous laser cutting of solar cells in two dedicated zones. The system comprises a frame, loading/unloading mechanism, rotating picking device, disk indexing mechanism, CCD camera, laser cutting unit, and two laser scribing units. The laser cutting unit is positioned in one zone, while the disk indexing mechanism enables simultaneous laser cutting in the other zone. The system features an automatic cell feeding mechanism that transports cells to the laser cutting unit, ensuring efficient production while maintaining high cell quality.

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In-situ laser scribing apparatus for manufacturing thin-film solar cells and other semiconductor devices. The apparatus enables direct laser scribing of photovoltaic materials in their native form, eliminating the need for vacuum chambers and vacuum sputtering. The system employs a laser diode pump source and a high-power diode-pumped solid-state laser, which are combined in a single apparatus. The laser scribes the photovoltaic material directly, enabling faster and more efficient processing compared to traditional vacuum-based techniques.

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System and method for laser scribing solar panels and solar panels, and more specifically, to laser scribing lines with arbitrary shapes and patterns on solar panels, and solar panels board. The system enables precise laser inscription of complex patterns on solar panels by creating custom laser lines with curved shapes and varying line spacing. This approach addresses the challenges associated with conventional laser scribing techniques, particularly for thin film solar panels on flexible substrates, by enabling the creation of precise and controlled laser lines.

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Solar cell fabrication process that enables high-throughput production of solar cells with improved efficiency through laser patterning of ion-implanted etch-resistant layers. The process uses laser scribing to create trench/p-polysilicon junctions in implanted regions, followed by selective etching to preserve the implanted regions while creating trenches in the substrate. This laser patterning enables the formation of self-aligned trench/p-polysilicon junctions at the center of implanted lines, where high boron implant doses and out-diffusion concentrations are typically found. The laser patterning enables the creation of trench/p-polysilicon junctions with improved electrical properties compared to conventional mask-based patterning techniques.

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A method to manufacture solar cells through a novel scribing process that minimizes thermal damage during the cutting process. The method employs an integrated scribing pattern where two parallel laser-induced breakdown spectroscopy (LIBS) patterns are created in the solar cell surface. The laser patterns are designed to overlap in a controlled manner, with each pattern having a specific scan period and open section. This pattern arrangement ensures that the laser energy is concentrated in the overlapping regions, reducing thermal damage by preventing the formation of recombination sites. The overlapping pattern design also enables the laser to maintain its oscillation frequency during the cutting process, while the open sections allow the cell to cool. This approach enables the creation of solar cells with improved power conversion efficiency while minimizing thermal damage.

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